The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.
Field Assisted Glass-Metal Sealing
Abstract
A new process is described which permits the sealing of metals to glass and other insulators at temperatures well below the softening point of the glass. Sealing is accomplished in about 1 min by applying a dc voltage in excess of a few hundred volts between the glass and the metal in such a way that the former is at a negative potential with respect to the latter. The process has been applied to a number of glass-metal combinations. A discussion is presented of some of the mechanisms which are believed to play a role in the bonding process.
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Cites
Weyl, W. A., Marboe, E. C., Susanti, T., Sumantri, C., & Indriati, M. F. (1967) · Cited by 89
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A Path Beyond Metal and Silicon:Polymer/Nanomaterial Composites for Stretchable Strain Sensors
Qiu, A., Li, P., Yang, Z., Yao, Y., Lee, I., & Ma, J. (2019) · Advanced Functional Materials · doi:10.1002/adfm.201806306 · Cited by 237
Industrially microfabricated ion trap with 1 eV trap depth
Auchter, S., Axline, C., Decaroli, C., Valentini, M., Purwin, L., Oswald, R., Matt, R., Aschauer, E., Colombe, Y., Holz, P., et al. (2022) · Quantum Science and Technology · doi:10.1088/2058-9565/ac7072 · Cited by 23
Metadata
- Authors
- Wallis, G., & Pomerantz, D. I.
- Venue
- Journal of Applied Physics
- Publisher
- AIP Publishing
- Published
- 1969-09-01
- Volume
- 40
- Issue
- 10
- Pages
- 3946-3949
- ISSN
- 0021-8979 (ISSN-L)
- 1089-7550
- OpenAlex
- W1986620377
- Cited by
- 746
- References
- 1
- FWCI
- 4.55
- Type
- journal article
- Language
- en
- Open access
- closed
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- Wallis, G., & Pomerantz, D. I. (1969). Field Assisted Glass-Metal Sealing. Journal of Applied Physics. https://doi.org/10.1063/1.1657121
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.