Cited by 33Semiconductor materials and devicesCopper Interconnects and ReliabilityFerroelectric and Negative Capacitance Devices

Electrical characteristics of thin Ta2O5 films deposited by reactive pulsed direct-current magnetron sputtering

Kim, J.-Y., Nielsen, M. C., Rymaszewski, E. J., Lu, T.-M.·2000·Journal of Applied Physics

Abstract

Room temperature deposition of tantalum oxide films on metallized silicon substrates was investigated by reactive pulsed magnetron sputtering of Ta in an Ar/O2 ambient. The dielectric constant of the tantalum oxide ranged from 19 to 31 depending on the oxygen percentage [P(%)=PO2/(PO2+PAr)] used during sputtering. The leakage current density was less than 10 nA/cm2 at 0.5 MV/cm electric field and the dielectric breakdown field was greater than 3.8 MV/cm for P=60%. A charge storage as high as 3.3 μF/cm2 was achieved for 70-Å-thick film. Pulse frequency variation (from 20 to 200 kHz) did not give a significant effect in the electrical properties (dielectric constant or leakage current density) of the Ta2O5 films.

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Registry

Crossref · 10.1063/1.372033

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21 of 21 references verified0 citation errors · 0 not checkable

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  • The relative permittivity of the tantalum oxide film was estimated to be εr film = 30, in agreement with literature data for tantalum oxide.

    “The relative permittivity of the film was estimated to be ε r film = 30, which is in agreement with data available in the literature for tantalum oxide [26].”

    From Sub-nanosecond switching of a tantalum oxide memristor (2011) · cites this paper as [26]

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Authors
Kim, J.-Y., Nielsen, M. C., Rymaszewski, E. J., & Lu, T.-M.
Affiliations
Rensselaer Polytechnic Institute (US)
Venue
Journal of Applied Physics
Published
2000-02-01
Volume
87
Issue
3
Pages
1448-1452
ISSN
  • 0021-8979 (ISSN-L)
  • 1089-7550
OpenAlex
W1969595558
Cited by
33
References
21
Citations by year
2025: 2 · 2023: 3 · 2012: 2
FWCI
6.05
Type
journal article
Language
en
Open access
closed
Locations
Journal of Applied Physics (publishedVersion)
Funders
Microelectronics Advanced Research Corporation
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
  • Physical Sciences › Materials Science › Electronic, Optical and Magnetic Materials › Copper Interconnects and Reliability
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Ferroelectric and Negative Capacitance Devices
Keywords
tantalum oxide thin films, tantalum pentoxide, dielectric constant, leakage current density, dielectric breakdown field, charge storage, oxygen partial pressure, room-temperature deposition, pulse frequency

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