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Cited by 125Thermal properties of materialsAdhesion, Friction, and Surface InteractionsHeat Transfer and Boiling Studies

The influence of interface bonding on thermal transport through solid–liquid interfaces

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Harikrishna, Hari, Ducker, William A., Huxtable, Scott T.·2013·Applied Physics Letters
DOI 10.1063/1.4812749
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Abstract

We use time-domain thermoreflectance to show that interface thermal conductance, G, is proportional to the thermodynamic work of adhesion between gold and water, WSL, for a series of five alkane-thiol monolayers at the gold-water interface. WSL is a measure of the bond strength across the solid-liquid interface. Differences in bond strength, and thus differences in WSL, are achieved by varying the terminal group (ω-group) of the alkane-thiol monolayers on the gold. The interface thermal conductance values were in the range 60–190 MW m−2 K−1, and the solid-liquid contact angles span from 25° to 118°.

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  • TDTR can also be applied to characterize thermal properties of liquids and fluids, such as the thermal conductivity/heat capacity of liquids, thermal conductance of solid/liquid interfaces, the heat transfer coefficient of fluids during evaporation, condensation, microchannel cooling, and flow boiling.

    “For example, TDTR can also be applied to characterize thermal properties of liquids and fluids, such as the thermal conductivity/heat capacity of liquids, 103 thermal conductance of solid/liquid interfaces, 80, 233, 234 the heat transfer coefficient of fluids during evaporation, 235, 236 condensation, 237 microchannel cooling, 238 and flow boiling. 239”

    From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [234]

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Authors
Harikrishna, H., Ducker, W. A., & Huxtable, S. T.
Affiliations
Virginia Tech (US)
ORCID
Venue
Applied Physics Letters
Publisher
AIP Publishing
Published
2013-06-24
Volume
102
Issue
25
ISSN
  • 0003-6951 (ISSN-L)
  • 1077-3118
DOI
10.1063/1.4812749
OpenAlex
W1999570457
Cited by
125
References
2
Citations by year
2026: 8 · 2025: 11 · 2024: 9 · 2023: 13 · 2022: 10 · 2021: 9 · 2020: 5 · 2019: 12 · 2018: 11 · 2017: 10 · 2016: 18 · 2015: 3 · 2014: 6
FWCI
4.06
Type
journal article
Language
en
Open access
Locations
  • Applied Physics Letters (publishedVersion)
  • VTechWorks (Virginia Tech) (submittedVersion)
Funders
  • Institute for Critical Technology and Applied Science
  • Air Force Office of Scientific Research (FA9550-)
Topics
  • Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
  • Physical Sciences › Engineering › Mechanics of Materials › Adhesion, Friction, and Surface Interactions
  • Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Boiling Studies
Keywords
interface thermal conductance, solid-liquid interface, work of adhesion, gold-water interface, interfacial strength, terminal group effects, contact angle, time-domain thermoreflectance, heat transport

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