The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.
Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal
Abstract
Thermal management for high heat flux removal from microelectronic chips is gaining critical importance in many earth-based and space-based systems. Heat fluxes greater than 1 MW/m2 (100 W/cm2) have already been realized in high-end server applications, while cooling needs in next generation chips and advanced systems such as high-power electronics and electrical systems, pulsed power weapons systems, solid-state sensors, and phased-array radars are expected to reach 5–10 MW/m2 (500–1000 W/cm2). After evaluating the contributions from different thermal resistances in the chip-to-ambient thermal path, this paper presents a critical review and research recommendations for three prominent contending technologies: jet impingement, spray cooling, and microchannel heat sinks.
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Citations
Cites
Thermal Interface Materials: Historical Perspective, Status, and Future Directions
Prasher, R. (2006) · Proceedings of the IEEE · doi:10.1109/jproc.2006.879796 · Cited by 927
Cited by
He, Z., Yan, Y., & Zhang, Z. (2021) · Energy · doi:10.1016/j.energy.2020.119223 · Cited by 869
Spray cooling and flash evaporation cooling: The current development and application
Cheng, W.-L., Zhang, W.-W., Chen, H., & Hu, L. (2016) · Renewable and Sustainable Energy Reviews · doi:10.1016/j.rser.2015.11.014 · Cited by 384
Ribeiro, G. B., Barbosa, J. R., & Prata, A. T. (2012) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2011.12.032 · Cited by 42
Ahmadi, V. E., Barestrand, H. A., Summers, J., & Yilmaz, C. (2026) · Case Studies in Thermal Engineering · doi:10.1016/j.csite.2026.107650 · Cited by 10
Metadata
- Authors
- Kandlikar, S. G., & Bapat, A. V.
- Venue
- Heat Transfer Engineering
- Publisher
- Informa UK Limited
- Published
- 2007-11
- Volume
- 28
- Issue
- 11
- Pages
- 911-923
- ISSN
- 0145-7632 (ISSN-L)
- 1521-0537
- OpenAlex
- W1965054448
- Cited by
- 291
- References
- 1
- FWCI
- 9.98
- Type
- journal article
- Language
- en
- Open access
- closed
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- Kandlikar, S. G., & Bapat, A. V. (2007). Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal. Heat Transfer Engineering. https://doi.org/10.1080/01457630701421703
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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