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Interfacial bonding mechanism and pouring temperature effect on Al/Cu bimetal prepared by a novel compound casting process
Abstract
Interfacial bonding mechanism and pouring temperature effect on Al/Cu bimetal prepared by a novel compound casting process, Guan, Feng, Jiang, Wenming, Li, Guangyu, Jiang, Haixiao, Zhu, Junwen, Fan, Zitian
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In the citing paper
“The thermal conditions in the casting process and, sequentially, the formation of intermetallic phases can be modified via several process parameters depending on the respective process.For example, these can be the pouring temperature [2,3], preheating temperature of the insert [4] or mold temperature/cladding temperature [5].”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [2]
In the citing paper
“From the literature, shear strengths of 40 MPa to 80 MPa are known from other casting processes such as lost foam [2], horizontal core-filling continuous casting [11], gravity die casting [12], liquid-solid compound casting process [13] and core-filling continuous casting [14].”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [2]
In the citing paper
“However, cavities are reported only as a characteristic of a poor bond formation in the interfacial layer, which can be reduced by increasing the heat impact [2,3,5,16].”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [2]
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Research works printed but not linked: 29
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Cited by
Sorted by citations
Ahmadzadeh Salout, S., & Mirbagheri, S. M. H. (2024) · Scientific Reports · doi:10.1038/s41598-024-57849-7 · Cited by 18
Nolte, N., Lukasczyk, T., & Mayer, B. (2022) · Metals · doi:10.3390/met12081314 · Cited by 5
“poor bond formation in the interfacial layer, which can be reduced by increasing the heat impact [2,3,5,16].”
BackgroundJassim, A. H., Abtaan, N. S., & Ahmed, S. R. (2024) · Tikrit Journal of Engineering Sciences · doi:10.25130/tjes.31.4.13
Metadata
- Authors
- Guan, F., Jiang, W., Li, G., Jiang, H., Zhu, J., & Fan, Z.
- Affiliations
- State Key Laboratory of Materials Processing and Die & Mould Technology (CN)
- Corresponding author
- Jiang, Wenming
- Jiang, Haixiao
- Venue
- Materials Research Express
- Publisher
- IOP Publishing
- Published
- 2019-07-10
- Volume
- 6
- Issue
- 9
- Pages
- 096529
- ISSN
- 2053-1591 (ISSN-L)
- OpenAlex
- W2955416618
- Cited by
- 20
- References
- 0
- Citations by year
- 2026: 1 · 2025: 5 · 2024: 5 · 2023: 3 · 2022: 4 · 2021: 1 · 2020: 1
- FWCI
- 0.84
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- Locations
- Materials Research Express (publishedVersion)
- Funders
- Natural Science Foundation of Hubei Province (2017CFB488)
- National Natural Science Foundation of China (51775204)
- National MCF Energy R&D Program (2018YFE0313300)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Mechanical Engineering › Aluminum Alloys Composites Properties
- Physical Sciences › Materials Science › Metals and Alloys › Aluminum Alloy Microstructure Properties
- Keywords
- interfacial bonding mechanism, pouring temperature, copper-aluminum interface, dissimilar metal joining
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- CoChat. (2026). Citation check: Interfacial bonding mechanism and pouring temperature effect on Al/Cu bimetal prepared by a novel compound casting process. https://app.cochat.ai/papers/10.1088/2053-1591/ab2d8f
- The paper
- Guan, F., Jiang, W., Li, G., Jiang, H., Zhu, J., & Fan, Z. (2019). Interfacial bonding mechanism and pouring temperature effect on Al/Cu bimetal prepared by a novel compound casting process. Materials Research Express. https://doi.org/10.1088/2053-1591/ab2d8f
