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Qubit compatible superconducting interconnects
Open accessAbstract
We present a fabrication process for fully superconducting interconnects compatible with superconducting qubit technology. These interconnects allow for the three dimensional integration of quantum circuits without introducing lossy amorphous dielectrics. They are composed of indium bumps several microns tall separated from an aluminum base layer by titanium nitride which serves as a diffusion barrier. We measure the whole structure to be superconducting (transition temperature of 1.1 K), limited by the aluminum. These interconnects have an average critical current of 26.8 mA, and mechanical shear and thermal cycle testing indicate that these devices are mechanically robust. Our process provides a method that reliably yields superconducting interconnects suitable for use with superconducting qubits.
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“Our results provide a natural explanation for the observations of short periods of signi cantly elevated error found in recent experiments with stabilizer codes [23, 24].”
From Resolving catastrophic error bursts from cosmic rays in large arrays of superconducting qubits (2022) · cites this paper as [23]
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“which is much larger than the typical QEC round time of 1 s [23, 24].”
From Resolving catastrophic error bursts from cosmic rays in large arrays of superconducting qubits (2022) · cites this paper as [23]
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Metadata
- Authors
- Foxen, B., Mutus, J. Y., Lucero, E., Graff, R., Megrant, A., Chen, Y., Quintana, C., Burkett, B., Kelly, J., Jeffrey, E., Yang, Y., Yu, A., Arya, K., Barends, R., Chen, Z., Chiaro, B., Dunsworth, A., Fowler, A., Gidney, C., Giustina, M., Huang, T., Klimov, P., Neeley, M., Neill, C., Roushan, P., Sank, D., Vainsencher, A., Wenner, J., White, T. C., & Martinis, J. M.
- Affiliations
- University of California, Santa Barbara (US)
- Google (United States) (US)
- Corresponding author
- Martinis, John M
- ORCID
- Venue
- Quantum Science and Technology
- Publisher
- IOP Publishing
- Published
- 2017-11-29
- Volume
- 3
- Issue
- 1
- Pages
- 014005
- ISSN
- 2058-9565 (ISSN-L)
- OpenAlex
- W2748822299
- Cited by
- 143
- References
- 22
- Citations by year
- 2026: 8 · 2025: 10 · 2024: 27 · 2023: 22 · 2022: 17 · 2021: 21 · 2020: 14 · 2019: 10 · 2018: 11 · 2017: 3
- FWCI
- 5.69
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Licence
- Locations
- Quantum Science and Technology (publishedVersion, cc-by)
- arXiv (Cornell University) (submittedVersion)
- arXiv (Cornell University)
- Funders
- Division of Graduate Education (DGE- 1144085)
- Google (JMGI01)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Superconducting and THz Device Technology
- Physical Sciences › Physics and Astronomy › Atomic and Molecular Physics, and Optics › Quantum Information and Cryptography
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Superconducting Materials and Applications
- Keywords
- superconducting interconnects, superconducting qubits, indium bumps, critical current, mechanical robustness, thermal cycling, fabrication techniques
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