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Qubit compatible superconducting interconnects
Open accessAbstract
We present a fabrication process for fully superconducting interconnects compatible with superconducting qubit technology. These interconnects allow for the three dimensional integration of quantum circuits without introducing lossy amorphous dielectrics. They are composed of indium bumps several microns tall separated from an aluminum base layer by titanium nitride which serves as a diffusion barrier. We measure the whole structure to be superconducting (transition temperature of 1.1 K), limited by the aluminum. These interconnects have an average critical current of 26.8 mA, and mechanical shear and thermal cycle testing indicate that these devices are mechanically robust. Our process provides a method that reliably yields superconducting interconnects suitable for use with superconducting qubits.
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“Our results provide a natural explanation for the observations of short periods of signi cantly elevated error found in recent experiments with stabilizer codes [23, 24].”
From Resolving catastrophic error bursts from cosmic rays in large arrays of superconducting qubits (2022) · cites this paper as [23]
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“which is much larger than the typical QEC round time of 1 s [23, 24].”
From Resolving catastrophic error bursts from cosmic rays in large arrays of superconducting qubits (2022) · cites this paper as [23]
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Self-citationNorris, G. J., Michaud, L., Pahl, D., Kerschbaum, M., Eichler, C., Besse, J.-C., & Wallraff, A. J. (2024) · EPJ Quantum Technology · doi:10.1140/epjqt/s40507-023-00213-x · Cited by 15
Die-to-Wafer 3D Interconnections Operating at Sub-Kelvin Temperatures for Quantum Computation
Thomas, C., Charbonnier, J., Garnier, A., Bresson, N., Fournel, F., Renet, S., Franiatte, R., David, N., Thiney, V., Urdampilleta, M., et al. (2020) · Electronic System-Integration Technology Conference (ESTC) · doi:10.1109/estc48849.2020.9229657 · Cited by 9
Modeling Insights Into the Assembly Challenges of Focal Plane Arrays
Stoyanov, S., & Bailey, C. (2023) · IEEE Access · doi:10.1109/access.2023.3264806 · Cited by 8
Through-silicon-via Architecture of 3D Integration for Superconducting Quantum Computing Application
Yu, J. Y., Wang, Q., Zheng, Y. R., Song, C., Fang, J., Li, T., Wu, H., Wang, Z., & Cai, J. (2023) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc51909.2023.00316 · Cited by 8
Yang, Y.-T., Hu, C., Green, J., Zhang, P., Shakoorzadeh, N., Ambhore, P., Mogera, U., Ni, N., Wang, K. L., & Iyer, S. S. (2020) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc32862.2020.00291 · Cited by 8
Self-citationSuperconducting Molybdenum Multi-Chip Module Approach for Cryogenic and Quantum Applications
Shah, A., Peek, S. E., Yelamanchili, B., Gupta, V., Tuckerman, D. B., Cantaloube, C., Sellers, J. A., & Hamilton, M. C. (2022) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc51906.2022.00052 · Cited by 8
Optimization of the transmission cost of distributed quantum circuits based on merged transfer
Cheng, X., Chen, X., Cao, K., Zhu, P., Feng, S., & Guan, Z. (2023) · Quantum Information Processing · doi:10.1007/s11128-023-03927-0 · Cited by 8
Scanning tunneling Andreev microscopy of titanium nitride thin films
Liao, W.-T., Kohler, T., Osborn, K. D., Butera, R., Lobb, C. J., Wellstood, F. C., & Dreyer, M. (2019) · Physical review. B./Physical review. B · doi:10.1103/physrevb.100.214505 · Cited by 8
Silicon Hard-Stop Spacers for 3D Integration of Superconducting QubitsPreprint
(2019) · DSpace@MIT (Massachusetts Institute of Technology) · Cited by 9
Tunable compact on-chip superconducting switch
Zotova, J., Semenov, A. V., Wang, R., Zhou, Y., Astafiev, O. V., & Tsai, J.-S. (2024) · Physical Review Applied · doi:10.1103/physrevapplied.21.024059 · Cited by 7
Floquet analysis of frequency collisions
Heya, K., Malekakhlagh, M., Merkel, S., Kanazawa, N., & Pritchett, E. (2024) · Physical Review Applied · doi:10.1103/physrevapplied.21.024035 · Cited by 10
Nb-based superconducting silicon interconnect fabric for cryogenic electronics
Yang, Y.-T., Hu, C., Zhang, P., Shakoorzadeh, N., Ni, N., Wang, K. L., & Iyer, S. S. (2021) · Quantum Science and Technology · doi:10.1088/2058-9565/abe279 · Cited by 7
Self-citationLi, H., Chui, K.-J., Goh, S. C. K., Budoyo, R. P., Long, N. H., Ng, Y. C., Lau, D., Jaafar, N. B., Tan, Y. P., & Dumke, R. (2024) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc51529.2024.00078 · Cited by 6
Superconducting-Semiconducting Voltage-Tunable Qubits in the Third Dimension
Hazard, T., Kerman, A. J., Serniak, K., & Tahan, C. (2023) · Physical Review Applied · doi:10.1103/physrevapplied.20.034056 · Cited by 8
Indium Bump Bonding: Advanced Integration Techniques for Low-Temperature Detectors and Readout
Lucas, T. J., Biesecker, J., Doriese, W. B., Duff, S. M., Durkin, M., Lew, R. A., Ullom, J. N., Vissers, M. R., & Schmidt, D. R. (2024) · Journal of Low Temperature Physics · doi:10.1007/s10909-024-03104-2 · Cited by 6
Paradkar, A., Nicaise, P., Dakroury, K., Resare, F., & Wieczorek, W. (2025) · Applied Physics Letters · doi:10.1063/5.0235266 · Cited by 6
Solving the Element Detecting Problem in Graphs via Quantum Walk Search Algorithm (QWSA)
Gill, S. K., Kaur, G., Shankar, G., & Veeramanickam (2023) · Lecture notes in networks and systems · doi:10.1007/978-981-19-7982-8_36 · Cited by 6
Malik, S., Jiang, W., Mayor, F. M., Makihara, T., & Safavi‐Naeini, A. H. (2023) · Applied Physics Letters · doi:10.1063/5.0157516 · Cited by 6
Superconducting TSV contact for cryoelectronic devices
Filippov, I. A., Anikanov, A., Rykov, A., Mumlyakov, A. M., Шибалов, М. В., Trofimov, I. V., Porokhov, N. V., Anufriev, Y., & Tarkhov, M. A. (2023) · Superconductor Science and Technology · doi:10.1088/1361-6668/ad1460 · Cited by 6
Advantages of a modular high-level quantum programming framework
Steiger, D. S., Häner, T., & Troyer, M. (2019) · Microprocessors and Microsystems · doi:10.1016/j.micpro.2019.02.003 · Cited by 6
Superconducting and Silicon-Based Semiconductor Quantum Computers: A review
Jia, Z.-L., Fu, Y., Cao, Z. X., Cheng, W., Zhao, Y., Dou, M., Duan, P., Kong, W., Cao, G., Li, H.-O., et al. (2022) · IEEE Nanotechnology Magazine · doi:10.1109/mnano.2022.3175394 · Cited by 5
Demonstration of 90 000 superconductive bump connections for massive quantum computing
Araga, Y., Nakagawa, H., Hashino, M., & Kikuchi, K. (2023) · Japanese Journal of Applied Physics · doi:10.35848/1347-4065/acbebf · Cited by 6
Hughes, G. D., Peek, S. E., Shah, A., Hamilton, M. C., & Adams, M. L. (2024) · IEEE Transactions on Applied Superconductivity · doi:10.1109/tasc.2024.3351620 · Cited by 5
Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration
Cirulis, I., Zschenderlein, U., Braun, S., Radestock, M., Pantou, R., Vogel, K., Selbmann, F., Kurth, S., Wunderle, B., & Kühn, H. (2023) · European Microelectronics and Packaging Conference · doi:10.23919/empc55870.2023.10418420 · Cited by 4
Design of Scalable Superconducting Quantum Circuits Using Flip-Chip Assembly
Park, S. H., Baek, D., Park, I., & Hahn, S. (2023) · IEEE Transactions on Applied Superconductivity · doi:10.1109/tasc.2023.3244142 · Cited by 5
Leung, N., Lu, Y., Chakram, S., Naik, R., Earnest, N., Ma, R., Jacobs, K. A., Cleland, A. N., & Schuster, D. (2018) · arXiv (Cornell University) · doi:10.48550/arxiv.1804.02028 · Cited by 4
Metadata
- Authors
- Foxen, B., Mutus, J. Y., Lucero, E., Graff, R., Megrant, A., Chen, Y., Quintana, C., Burkett, B., Kelly, J., Jeffrey, E., Yang, Y., Yu, A., Arya, K., Barends, R., Chen, Z., Chiaro, B., Dunsworth, A., Fowler, A., Gidney, C., Giustina, M., Huang, T., Klimov, P., Neeley, M., Neill, C., Roushan, P., Sank, D., Vainsencher, A., Wenner, J., White, T. C., & Martinis, J. M.
- Affiliations
- University of California, Santa Barbara (US)
- Google (United States) (US)
- Corresponding author
- Martinis, John M
- ORCID
- Venue
- Quantum Science and Technology
- Publisher
- IOP Publishing
- Published
- 2017-11-29
- Volume
- 3
- Issue
- 1
- Pages
- 014005
- ISSN
- 2058-9565 (ISSN-L)
- OpenAlex
- W2748822299
- Cited by
- 143
- References
- 22
- Citations by year
- 2026: 8 · 2025: 10 · 2024: 27 · 2023: 22 · 2022: 17 · 2021: 21 · 2020: 14 · 2019: 10 · 2018: 11 · 2017: 3
- FWCI
- 5.69
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Licence
- Locations
- Quantum Science and Technology (publishedVersion, cc-by)
- arXiv (Cornell University) (submittedVersion)
- arXiv (Cornell University)
- Funders
- Division of Graduate Education (DGE- 1144085)
- Google (JMGI01)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Superconducting and THz Device Technology
- Physical Sciences › Physics and Astronomy › Atomic and Molecular Physics, and Optics › Quantum Information and Cryptography
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Superconducting Materials and Applications
- Keywords
- superconducting interconnects, superconducting qubits, indium bumps, critical current, mechanical robustness, thermal cycling, fabrication techniques
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