The DOI matches its Crossref record; 18 of the 20 references it cites were found in a registry or an index.
A high-yield microassembly structure for three-dimensional microelectrode arrays
Abstract
This paper presents a practical microassembly process for three-dimensional (3-D) microelectrode arrays for recording and stimulation in the central nervous system (CNS). Orthogonal lead transfers between the micromachined two-dimensional probes and a cortical surface platform are formed by attaching gold beams on the probes to pads on the platform using wire-free ultrasonic bonding. The low-profile (150 microns) outrigger design of the probes allows the bonding of fully assembled high-density arrays. Micromachined assembly tools allow the formation of a full 3-D probe array within 30 min. Arrays having up to 8 x 16 shanks on 200-micron centers have been realized and used to record cortical single units successfully. Active 3-D probe arrays containing on-chip CMOS signal processing circuitry have also been created using the microassembly approach. In addition, a dynamic insertion technique has been explored to allow the implantation of high-density probe arrays into feline cortex at high-speed and with minimal traumatic injury.
Overview
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“Because these approaches require special equipment or platforms, microneedle structures that are fabricated either by assembling 2D probe combs or etching bulk materials are expensive and time consuming.”
From A flexible three-dimensional electrode mesh: An enabling technology for wireless brain–computer interface prostheses (2016) · cites this paper as [8]
In the citing paper
“Some neural interface devices have been fabricated with high electrode densities; however, their designs have limited the use of these arrays to specific central nervous system structures, such as cortical grey matter (6.25 electrodes/mm 2 [12,13]; >150 electrodes/mm 2 [17,18]) or hippocampal slices (<11 electrodes/mm 2 [19]).”
From A new high-density (25 electrodes/mm2) penetrating microelectrode array for recording and stimulating sub-millimeter neuroanatomical structures (2013) · cites this paper as [12]
Citations
Cites
A method for the study of undecalcified bones and teeth with attached soft tissues*
Donath, K., & Breuner, G. (1982) · Journal of Oral Pathology and Medicine · doi:10.1111/j.1600-0714.1982.tb00172.x · Cited by 1,640
Gamma (40-100 Hz) oscillation in the hippocampus of the behaving rat
Bragin, A., Jando, G., Nadasdy, Z., Hetke, J., Wise, K., & Buzsaki, G. (1995) · The Journal of Neuroscience · doi:10.1523/jneurosci.15-01-00047.1995 · Cited by 1,527
Self-citationCampbell, P. K., Jones, K. E., Huber, R. J., Horch, K. W., & Normann, R. A. (1991) · IEEE Transactions on Biomedical Engineering · doi:10.1109/10.83588 · Cited by 881
Factors influencing the biocompatibility of insertable silicon microshafts in cerebral cortex
Edell, D. J., Toi, V. V., McNeil, V. M., & Clark, L. D. (1992) · IEEE Transactions on Biomedical Engineering · doi:10.1109/10.141202 · Cited by 481
A three-dimensional microelectrode array for chronic neural recording
Hoogerwerf, A. C., & Wise, K. D. (1994) · IEEE Transactions on Biomedical Engineering · doi:10.1109/10.335862 · Cited by 372
Self-citationA method for pneumatically inserting an array of penetrating electrodes into cortical tissue
Rousche, P. J., & Normann, R. A. (1992) · Annals of Biomedical Engineering · doi:10.1007/bf02368133 · Cited by 305
A high-yield IC-compatible multichannel recording array
Najafi, K., Wise, K. D., & Mochizuki, T. (1985) · IEEE Transactions on Electron Devices · doi:10.1109/t-ed.1985.22102 · Cited by 303
Self-citationSingle-unit neural recording with active microelectrode arrays
Bai, Q., & Wise, K. D. (2001) · IEEE Transactions on Biomedical Engineering · doi:10.1109/10.936367 · Cited by 214
Self-citationSilicon ribbon cables for chronically implantable microelectrode arrays
Hetke, J. F., Lund, J. L., Najafi, K., Wise, K. D., & Anderson, D. J. (1994) · IEEE Transactions on Biomedical Engineering · doi:10.1109/10.284959 · Cited by 174
Self-citationAn implantable CMOS circuit interface for multiplexed microelectrode recording arrays
Ji, J., & Wise, K. D. (1992) · IEEE Journal of Solid-State Circuits · doi:10.1109/4.121568 · Cited by 172
Self-citation
Flagged first, then by citations
2 of the 20 references couldn’t be matched to a known paper.
Research works printed but not linked: 1
- lund, 1994, chip-level encapsulation of implantable cmos microelectrode arrays, Tech Dig IEEE Solid-State Sensors and Actuators Workshop, 29
Cited by
Sorted by citations
Items 201–243 of 243
Kim, J., Kim, S., & Lee, K. (2017) · Japanese Journal of Applied Physics · doi:10.7567/jjap.56.06gn13 · Cited by 2
Moxon, K. A. (2007) · Springer eBooks · doi:10.1007/0-306-48610-5_4 · Cited by 2
A Microfabricated Deep Brain Stimulation Electrode
Lin, C. (2009) · OhioLink ETD Center (Ohio Library and Information Network) · Cited by 2
A Microsystem with Varying-Length Electrode Arrays for Auditory Nerve Prostheses
Wu, J. C., Feng, W., Tang, W. C., & Zeng, F. (2006) · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · doi:10.1109/iembs.2006.259698 · Cited by 1
Review of Microelectrode Fabrication
Liu, P. C., Zhou, J., Li, S. L., & Ma, H. M. (2012) · Advanced materials research · doi:10.4028/www.scientific.net/amr.565.503 · Cited by 1
High Aspect-Ratio Neural Probes using Conventional Blade Dicing
Goncalves, S. B., Ribeiro, J. F., da Silva, A. F., & Correia, J. H. (2016) · Journal of Physics Conference Series · doi:10.1088/1742-6596/757/1/012011 · Cited by 1
Integration of Process-Incompatible Materials for Microfabricated Polymer-Based Neural Interfaces
Hess‐Dunning, A. (2011) · OhioLink ETD Center (Ohio Library and Information Network) · Cited by 1
Development of three dimensional neural sensing device by stacking method
Chiou, J., & Chang, C. (2010) · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · doi:10.1109/icsens.2010.5690940 · Cited by 1
Gerhardt, G. A., & Tresco, P. A. (2008) · Springer eBooks · doi:10.1007/978-1-4020-8705-9_2 · Cited by 1
Electrophysiological Techniques for Studying Tactile Perception in Rats
Öztürk, S., Devecıoğlu, İ., Vardar, B., Duvan, F. T., & Güçlü, B. (2023) · Neuromethods · doi:10.1007/978-1-0716-3068-6_16 · Cited by 1
Micromachining Techniques for Realization of Three-Dimensional Microelectrode Arrays
Rajaraman, S. (2014) · Springer eBooks · doi:10.1007/978-1-4899-8038-0_5 · Cited by 1
Si Micro Probe and SiO2 Micro Tube Array Integrated with nMOSFETs
Takei, K., Kawashima, T., Takao, H., Sawada, K., & Ishida, M. (2007) · International Conference on Solid-State Sensors, Actuators and Microsystems · doi:10.1109/sensor.2007.4300400 · Cited by 1
MEMS as implantable neuroprobes
Govindarajan, A. V., Je, M., Park, W., & Achyuta, A. K. H. (2012) · Elsevier eBooks · doi:10.1533/9780857096272.4.359 · Cited by 1
High density nanowire electrodes for intracortical microstimulation
Puttaswamy, S. V., Shi, Q., Steele, D. A., Fishlock, S. J., Lee, C., & McLaughlin, J. A. (2019) · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · doi:10.1109/embc.2019.8857305 · Cited by 1
Baek, D.-H., Ahn, S., Kim, H. S., & Kim, D. W. (2020) · Journal of Medical and Biological Engineering · doi:10.1007/s40846-020-00540-9 · Cited by 1
Vetter, R. J., Olsson, R. H., Hetke, J. F., Williams, J. C., Pellinen, D. S., Wise, K. D., & Kipke, D. R. (2004) · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · doi:10.1109/iembs.2003.1280169 · Cited by 1
Self-citationRajaraman, S., Zhao, Y., Wu, X., Kim, S.-H., & Allen, M. G. (2008) · Cited by 1
Polymer-Based Implantable Electrodes: State of the Art and Future Prospects
Koch, K. P., Ramachandran, A., Poppendieck, W., Feili, D., & Hoffmann, K. (2006) · MRS Proceedings · doi:10.1557/proc-0926-cc06-01 · Cited by 1
Selective stimulation and measurement in the cochlear nucleus with the spike microelectrode array
Mase, F., Takahashi, H., Ejiri, T., Nakao, M., Nakamura, N., Kaga, K., & Hervé, T. (2005) · Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) · doi:10.1109/iembs.2001.1019014 · Cited by 1
Design Method of 3-D Active Silicon Neural Microelectrode Biosensor Based on MEMS Technology
Wang, D., Zhang, G., & Li, X. (2006) · World Congress on Intelligent Control and Automation · doi:10.1109/wcica.2006.1713603 · Cited by 1
Bioethics and Legal Aspects of Potential Health and Environmental Risks of Nanotechnology
Solodoukhina, D. (2007) · NATO science for peace and security series · doi:10.1007/978-1-4020-6076-2_11 · Cited by 1
Huang, R. K.-J. (2010) · CaltechTHESIS (California Institute of Technology) · doi:10.7907/vmzb-0n20 · Cited by 1
NEXT GENERATION OF CORTICAL DEVICES
Rousche, P. J., & Kipke, D. R. (2004) · Series on bioengineering and biomedical engineering · doi:10.1142/9789812561763_0041 · Cited by 1
Progress in Peripheral Neural Interfaces
Qiao, S., Mauser, K. A., & Yoshida, K. (2013) · Wiley eBooks · doi:10.1002/9781118628522.ch4 · Cited by 1
Song, E., Lu, Y., & Zhang, H. (2025) · Wiley eBooks · doi:10.1002/9783527845507.ch6 · Cited by 1
Brain-machine interfaces using thin-film silicon microelectrode arrays
Kipke, D. R. (2004) · IEEE International Symposium on Circuits and Systems proceedings · doi:10.1109/iscas.2004.1329691
A 32-site 3-D CMOS electronic interfaces to the nervous system
Li, H., Wang, D., Li, X., & Wu, T. (2011) · International Conference on Fluid Power and Mechatronics · doi:10.1109/fpm.2011.6045875
Implantable Multichannel Silicon-based neural probe
Weihua, P., Hongda, C., Ruoxin, Z., xiaohong, S., Zhu, L., & Lin, L. (2007) · IEEE/LEOS Summer Topical Meetings · doi:10.1109/leosst.2007.4288346
Smart Stimulators for Retinal Prosthesis A Flexible and Extendable Microchip-Based Stimulator
Ohta, J., Tokuda, T., Kagawa, K., Furumiya, T., Uehara, A., Terasawa, Y., Ozawa, M., Fujikado, T., & Tano, Y. (2006)
Statements on Societal Implications
Kalil, T. A., Gingrich, N., Armstrong, J. A., Brown, J., Duguid, P., Yonas, G., Picraux, S. T., Crow, M. M., Sarewitz, D., Garcés, J., et al. (2001) · Springer eBooks · doi:10.1007/978-94-017-3012-9_6
Micro/nanoscale needle technology for brain
Kawano, T. (2016) · IEEE International Conference on Nanotechnology (IEEE-NANO) · doi:10.1109/nano.2016.7751568
Implantable Flexible Sensors for Neural Recordings
Yamagiwa, S., Sawahata, H., & Kawano, T. (2018) · Wiley eBooks · doi:10.1002/9783527804856.ch15
Micro/nano-scale needle devices for the brain
Kawano, T. (2017) · International Symposium on Micro-NanoMechatronics and Human Science · doi:10.1109/mhs.2017.8305244
Electrodes for Cell Sensors Interfacing
Ben‐Yoav, H., Ragones, H., Pandey, R., Fiaschi, G., & Shacham‐Diamand, Y. (2020) · Springer eBooks · doi:10.1007/978-3-319-47405-2_125-1
Tchekalarova, J., Kortenska, L., Boynov, K., & Marinov, P. (2020) · European Neuropsychopharmacology · doi:10.1016/j.euroneuro.2020.09.127
Electrodes for Cell Sensors Interfacing
Ben‐Yoav, H., Ragones, H., Pandey, R., Fiaschi, G., & Shacham‐Diamand, Y. (2021) · Springer eBooks · doi:10.1007/978-3-030-23217-7_125
Neuroflex: Intraneural and Extraneural Flexible Sensor Architectures for Neural Probing
Patil, A. C., & Thakor, N. V. (2022) · Handbook of Neuroengineering · doi:10.1007/978-981-15-2848-4_16-2
Zjajo, A. (2016) · Springer eBooks · doi:10.1007/978-3-319-31541-6_1
Audet, S. A., Carney, J. K., Haubrich, G., Ruben, D. A., Herrmann, E., Larik, V. C. M. H., Receveur, R. A. M., Scott, E., Vaughn, G., & Hasmi, K. (2016) · Elsevier eBooks · doi:10.1016/b978-0-12-803581-8.10161-4
Neuroflex: Intraneural and Extraneural Flexible Sensor Architectures for Neural Probing
Patil, A. C., & Thakor, N. V. (2023) · Handbook of Neuroengineering · doi:10.1007/978-981-16-5540-1_16
RETRACTED: Monolithic three-dimensional neural probes from deterministic rolling of soft electronicsPreprint
Qiang, Y., & Fang, H. (2025) · Research Square · doi:10.21203/rs.3.rs-6051081/v1
RetractedAudet, S. A., Carney, J., Haubrich, G., Rubén, D. T.-S., Herrmann, E., Vaughn, G., Larik, V. C. M. H., Receveur, R. A. M., & Scott, E. R. (2008) · Elsevier eBooks · doi:10.1016/b978-0-323-95478-5.00054-6
Metadata
- Authors
- Bai, Q., Wise, K. D., & Anderson, D. J.
- Affiliations
- University of Michigan (US)
- Venue
- IEEE Transactions on Biomedical Engineering
- Published
- 2000-03
- Volume
- 47
- Issue
- 3
- Pages
- 281-289
- ISSN
- 0018-9294 (ISSN-L)
- OpenAlex
- W2161272185
- Cited by
- 245
- References
- 20
- Citations by year
- 2025: 5 · 2023: 4 · 2022: 8 · 2021: 6 · 2020: 7 · 2019: 5 · 2018: 6 · 2017: 7 · 2016: 14 · 2015: 8 · 2014: 7 · 2013: 11 · 2012: 7
- FWCI
- 2.84
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- IEEE Transactions on Biomedical Engineering (publishedVersion)
- PubMed (publishedVersion)
- Topics
- Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Analog and Mixed-Signal Circuit Design
- Keywords
- microassembly, ultrasonic bonding, cortical recording, single-unit recording, neurostimulation
- MeSH terms
- Animals, Auditory Cortex, Brain, Cats, Electrodes, Implanted, Electroencephalography, Equipment Design, Gold, Guinea Pigs, Microelectrodes, Signal Processing, Computer-Assisted, Silicon, Microscopy, Confocal
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
