The DOI matches its Crossref record; 18 of the 20 references it cites were found in a registry or an index.
A high-yield microassembly structure for three-dimensional microelectrode arrays
Abstract
This paper presents a practical microassembly process for three-dimensional (3-D) microelectrode arrays for recording and stimulation in the central nervous system (CNS). Orthogonal lead transfers between the micromachined two-dimensional probes and a cortical surface platform are formed by attaching gold beams on the probes to pads on the platform using wire-free ultrasonic bonding. The low-profile (150 microns) outrigger design of the probes allows the bonding of fully assembled high-density arrays. Micromachined assembly tools allow the formation of a full 3-D probe array within 30 min. Arrays having up to 8 x 16 shanks on 200-micron centers have been realized and used to record cortical single units successfully. Active 3-D probe arrays containing on-chip CMOS signal processing circuitry have also been created using the microassembly approach. In addition, a dynamic insertion technique has been explored to allow the implantation of high-density probe arrays into feline cortex at high-speed and with minimal traumatic injury.
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In the citing paper
“Because these approaches require special equipment or platforms, microneedle structures that are fabricated either by assembling 2D probe combs or etching bulk materials are expensive and time consuming.”
From A flexible three-dimensional electrode mesh: An enabling technology for wireless brain–computer interface prostheses (2016) · cites this paper as [8]
In the citing paper
“Some neural interface devices have been fabricated with high electrode densities; however, their designs have limited the use of these arrays to specific central nervous system structures, such as cortical grey matter (6.25 electrodes/mm 2 [12,13]; >150 electrodes/mm 2 [17,18]) or hippocampal slices (<11 electrodes/mm 2 [19]).”
From A new high-density (25 electrodes/mm2) penetrating microelectrode array for recording and stimulating sub-millimeter neuroanatomical structures (2013) · cites this paper as [12]
Citations
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Self-citationA method for pneumatically inserting an array of penetrating electrodes into cortical tissue
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Self-citationSingle-unit neural recording with active microelectrode arrays
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Self-citationAn implantable CMOS circuit interface for multiplexed microelectrode recording arrays
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Self-citation
Research works printed but not linked: 1
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Cited by
Sorted by citations
Microneedles for drug and vaccine delivery
Kim, Y., Park, J., & Prausnitz, M. R. (2012) · Advanced Drug Delivery Reviews · doi:10.1016/j.addr.2012.04.005 · Cited by 1,776
Wireless Implantable Microsystems: High-Density Electronic Interfaces to the Nervous System
Wise, K. D., Anderson, D. J., Hetke, J. F., Kipke, D. R., & Najafi, K. (2004) · Proceedings of the IEEE · doi:10.1109/jproc.2003.820544 · Cited by 656
Self-citationMaterials for flexible bioelectronic systems as chronic neural interfaces
Song, E., Li, J., Won, S. M., Bai, W., & Rogers, J. A. (2020) · Nature Materials · doi:10.1038/s41563-020-0679-7 · Cited by 498
Chronic Neural Recording Using Silicon-Substrate Microelectrode Arrays Implanted in Cerebral Cortex
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Kipke, D. R., Vetter, R. J., Williams, J. C., & Hetke, J. F. (2003) · IEEE Transactions on Neural Systems and Rehabilitation Engineering · doi:10.1109/tnsre.2003.814443 · Cited by 364
Metadata
- Authors
- Bai, Q., Wise, K. D., & Anderson, D. J.
- Affiliations
- University of Michigan (US)
- Venue
- IEEE Transactions on Biomedical Engineering
- Published
- 2000-03
- Volume
- 47
- Issue
- 3
- Pages
- 281-289
- ISSN
- 0018-9294 (ISSN-L)
- OpenAlex
- W2161272185
- Cited by
- 245
- References
- 20
- Citations by year
- 2025: 5 · 2023: 4 · 2022: 8 · 2021: 6 · 2020: 7 · 2019: 5 · 2018: 6 · 2017: 7 · 2016: 14 · 2015: 8 · 2014: 7 · 2013: 11 · 2012: 7
- FWCI
- 2.84
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- IEEE Transactions on Biomedical Engineering (publishedVersion)
- PubMed (publishedVersion)
- Topics
- Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Analog and Mixed-Signal Circuit Design
- Keywords
- microassembly, ultrasonic bonding, cortical recording, single-unit recording, neurostimulation
- MeSH terms
- Animals, Auditory Cortex, Brain, Cats, Electrodes, Implanted, Electroencephalography, Equipment Design, Gold, Guinea Pigs, Microelectrodes, Signal Processing, Computer-Assisted, Silicon, Microscopy, Confocal
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