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Power semiconductor device figure of merit for high-frequency applications

Baliga, B.J.·1989·IEEE Electron Device Letters

Abstract

A figure of merit (the Baliga high-frequency figure of merit) is derived for power semiconductor devices operating in high-frequency circuits. Using this figure of merit, it is predicted that the power losses incurred in the power device will increase as the square root of the operating frequency and approximately in proportion to the output power. By relating the device power dissipation to the intrinsic material parameters, it is shown that the power loss can be reduced by using semiconductors with larger mobility and critical electric field for breakdown. Examination of data in the literature indicates that significant performance improvement can be achieved by replacing silicon with gallium arsenide, silicon carbide, or semiconducting diamond.>

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Metadata

Authors
Baliga, B. J.
Venue
IEEE Electron Device Letters
Published
1989-10
Volume
10
Issue
10
Pages
455-457
ISSN
  • 0741-3106 (ISSN-L)
  • 1558-0563
OpenAlex
W2103947167
Cited by
1,070
References
0
FWCI
2.35
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Power semiconductor device figure of merit for high-frequency applications. https://app.cochat.ai/papers/10.1109/55.43098
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Baliga, B. J. (1989). Power semiconductor device figure of merit for high-frequency applications. IEEE Electron Device Letters. https://doi.org/10.1109/55.43098

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Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.