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Hybrid memory cube (HMC)
Abstract
This article consists of a collection of slides from the author's conference presentation on the special features, system design, system architectures; processing capabilities, and targeted markets for Micron's Hybrid Memory Cube (HMC).
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Cited by
Memory devices and applications for in-memory computing
Sebastian, A., Le Gallo, M., Khaddam-Aljameh, R., & Eleftheriou, E. (2020) · Nature Nanotechnology · doi:10.1038/s41565-020-0655-z · Cited by 2,289
In-memory computing with resistive switching devices
Ielmini, D., & Wong, H.-S. P. (2018) · Nature Electronics · doi:10.1038/s41928-018-0092-2 · Cited by 2,298
“Another solution is the introduction of memory chips with enhanced bandwidth, such as the hybrid memory cube (HMC) 7 , and high bandwidth memory (HBM) 8 , where high data-transfer rate and high memory density are achieved by stacking multiple memory chips by through-silicon via (TSV) interconnects.”
BackgroundResistive switching materials for information processing
Wang, Z., Wu, H., Burr, G. W., Hwang, C. S., Wang, K. L., Xia, Q., & Yang, J. J. (2020) · Nature Reviews Materials · doi:10.1038/s41578-019-0159-3 · Cited by 1,214
An overview of through-silicon-via technology and manufacturing challenges
Gambino, J. P., Adderly, S. A., & Knickerbocker, J. U. (2015) · Microelectronic Engineering · doi:10.1016/j.mee.2014.10.019 · Cited by 317
Opportunities for Nonvolatile Memory Systems in Extreme-Scale High-Performance Computing
Vetter, J. S., & Mittal, S. (2015) · Computing in Science & Engineering · doi:10.1109/mcse.2015.4 · Cited by 95
Metadata
- Authors
- Pawlowski, J. T.
- Venue
- 2011 IEEE Hot Chips 23 Symposium (HCS)
- Publisher
- IEEE
- Published
- 2011-08
- Pages
- 1-24
- OpenAlex
- W2474451066
- Cited by
- 391
- References
- 0
- FWCI
- 6.20
- Type
- conference paper
- Language
- en
- Open access
- closed
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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
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How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
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- CoChat. (2026). Citation check: Hybrid memory cube (HMC). https://app.cochat.ai/papers/10.1109/hotchips.2011.7477494
- The paper
- Pawlowski, J. T. (2011). Hybrid memory cube (HMC). 2011 IEEE Hot Chips 23 Symposium (HCS). https://doi.org/10.1109/hotchips.2011.7477494
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
