Highly Integrated 4 Tbps Silicon Photonic IC for Compute Fabric Connectivity
Abstract
In this work we present the design and performance of a high bandwidth, low power, low latency, and high-density Silicon Photonic integrated circuit (SiPIC) for compute interconnects. The SiPIC has more than 4 Tbps bandwidth over eight standard single mode fiber pairs. Each fiber pair carries eight DWDM transmit and receive channels operating at 32 Gbps NRZ. We integrate all photonic components and functions including lasers, semiconductor optical amplifiers (SOAs), modulators, photodetectors, spot size convertors and V-grooves onto a single silicon die. Device design and performance details are discussed.
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For co-packaged optics (CPO) to succeed, high-performance computing to scale, and disaggregated computing to become a reality, silicon photonics will be pivotal.
“For co-packaged optics (CPO) to succeed, high-performance computing to scale22, and disaggregated computing to become a reality42, silicon photonics will be pivotal.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [22]
Microring-modulator (MRM)-based IMDD transceivers demonstrated the multiplexing and energy-efficiency benefits of PIC technology.
“Microring-modulator (MRM)-based IMDD transceivers (see Fig. 2a) demonstrated the multiplexing and energy-efficiency benefits of PIC technology20–22.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [22]
For photonics, InP integration has paved the path for laser integration in HVM of IMDD transceivers and is being used for SOA integration.
“For photonics, it has paved the path for laser integration in HVM of IMDD transceivers19 and is being used for SOA integration22.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [22]
Heterogeneous integration strategies include bonding III-V chips to Si with coarse alignment followed by post-processing the Si wafer to make quantum-well (QW) lasers.
“They include bonding III-V chips to Si with coarse alignment followed by post-processing the Si wafer to make quantum-well (QW) lasers (Fig. 3e)14,18,19,22.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [22]
Placing redundant lasers helps improve the failure-in-time (FIT) rates.
“Placing redundant lasers helps improve the failure-in-time (FIT) rates22.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [22]
It is likely that scale-out will be supported first by bonding multiple single-wavelength lasers.
“It is likely that scale-out will be supported first by bonding multiple single-wavelength lasers22.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [22]
The linewidth of passive SMLLs is usually lower than DFB arrays.
“The linewidth of passive SMLLs111 is usually lower than DFB arrays22.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [22]
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- Authors
- Fathololoumi, S., Malouin, C., Hui, D., Al-hemyari, K., Nguyen, K., Seddighian, P., Chen, Y.-J., Wang, Y., Yan, A., Defrees, R., Liljeberg, T., & Liao, L.
- Affiliations
- Intel (United States) (US)
- Venue
- 2022 IEEE Symposium on High-Performance Interconnects (HOTI)
- Publisher
- IEEE
- Published
- 2022-08
- Pages
- 1-4
- ISSN
- 1550-4794 (ISSN-L)
- OpenAlex
- W4313069675
- Cited by
- 25
- References
- 11
- Citations by year
- 2026: 3 · 2025: 7 · 2024: 9 · 2023: 5 · 2022: 1
- FWCI
- 8.90
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- IEEE Symposium on High-Performance Interconnects (HOTI) (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced Photonic Communication Systems
- Keywords
- silicon photonics integrated circuits, dense wavelength division multiplexing, semiconductor optical amplifier, silicon modulators, photodetectors, spot-size converter, silicon lasers, low latency, low power consumption
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