The DOI matches its Crossref record; 31 of the 31 references it cites were found in a registry or an index.
Uplink Wave-Domain Combiner for Stacked Intelligent Metasurfaces Accounting for Hardware Limitations
Open accessAbstract
Refractive metasurfaces (RMTSs) offer a promising solution to improve energy efficiency of wireless systems. To address the limitations of single-layer RMTSs, stacked intelligent metasurfaces (SIMs), which form the desired precoder and combiner in the wave domain, have been proposed. However, previous analyses have overlooked hardware non-idealities that significantly affect SIM performance. In this paper, we study the achievable sum-rate of SIM antennas in an uplink scenario, accounting for hardware constraints. We propose a system model that includes noise and hardware effects, formulate a non-convex sum-rate optimization problem, and solve it using gradient ascent and interior point methods. We compare SIMs and digital phased arrays (DPAs) under Rayleigh fading and 3GPP channels with two conditions: an equal number of$\mathbf{R F}$chains and an equal physical aperture size. Our results show SIMs outperform DPAs under equal number of RF chains but underperform DPAs with equal aperture size.
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Rezvani et al. investigated a SIM-aided uplink communication scenario and proposed an interior point method to maximize the sum rate while accounting for hardware imperfections; the results showed that SIM can outperform digital phased arrays with the same number of radiofrequency chains under realistic 3GPP channels.
“By contrast, Rezvani et al. [84] investigated a SIM-aided uplink communication scenario, proposing an interior point method to maximize the sum rate while accounting for hardware imperfections. The results showed that SIM can outperform digital phased arrays with the same number of RF chains under realistic 3GPP channels.”
From Emerging Technologies in Intelligent Metasurfaces: Shaping the Future of Wireless Communications (2026) · cites this paper as [84]
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Metadata
- Authors
- Rezvani, M., Adve, R., Sediq, A. B., & El-Keyi, A.
- Affiliations
- University of Toronto (CA)
- Ericsson (Canada) (CA)
- Dept. of Electrical and Computer Engineering, University of Toronto,Toronto,Canada
- Venue
- ICC 2025 - IEEE International Conference on Communications
- Publisher
- IEEE
- Published
- 2025-06-08
- Pages
- 2424-2429
- ISSN
- 1550-3607 (ISSN-L)
- OpenAlex
- W4414538632
- Cited by
- 12
- References
- 29
- Citations by year
- 2026: 6 · 2025: 6
- FWCI
- 26.18
- Type
- conference paper
- Language
- en
- Open access
- green
- arxiv.org
- Locations
- International Conference on Communications (publishedVersion)
- arXiv (Cornell University) (submittedVersion, cc-by)
- arXiv (Cornell University) (cc-by)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced Wireless Communication Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced Antenna and Metasurface Technologies
- Physical Sciences › Materials Science › Electronic, Optical and Magnetic Materials › Metamaterials and Metasurfaces Applications
- Keywords
- stacked intelligent metasurfaces, uplink transmission, sum rate maximization, non-convex optimization, RF chains, Rayleigh fading, energy efficiency
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