The DOI matches its Crossref record; 19 of the 19 references it cites were found in a registry or an index; none of the 12 sources its claims cite is checked for support yet.
Comprehensive investigation on current imbalance among parallel chips inside MW-scale IGBT power modules
Open accessAbstract
With the demands for increasing the power rating and improving reliability level of the high power IGBT modules, there are further needs of understanding how to achieve stable paralleling and identical current sharing between the chips. This paper investigates the stray parameters imbalance among parallel chips inside the 1.7 kV/1 kA high power IGBT modules at different frequencies by Ansys Q3D parastics extractor. The resulted current imbalance is further confirmed by experimental measurement.
Overview
CoChat Summary
TL;DR
This paper investigates stray-parameter imbalance among six parallel sections inside a 1.7 kV/1 kA IGBT power module and its effect on current sharing. Q3D extraction, PSpice simulation, and double-pulse experiments show that middle sections conduct more current and dissipate more turn-on loss, with the imbalance increasing at higher frequencies.
Key findings
- The six parallel sections have unequal stray parameters: middle sections 2–4 have lower stray inductance and resistance than lateral sections. At 1 kHz, extracted \(L_x\) is 74, 46, 35, 48, 69, and 90 nH for sections 1–6, while \(R_x\) is 342, 225, 179, 213, 264, and 346 µΩ. At 5 MHz, \(L_x\) is 69, 42, 32, 42, 61, and 81 nH, while \(R_x\) rises to 10065, 6401, 4645, 5622, 7457, and 10171 µΩ.
- Stray inductance is almost constant with frequency, but stray resistance increases with frequency due to skin and proximity effects; the resistance imbalance is higher at 5 MHz than at 1 kHz, implying more obvious current imbalance during switching transients.
- PSpice simulation and experiments agree that sections 2–4 conduct more current than the other sections during turn-on. The turn-on loss of section 3 is almost twice that of section 6, and middle sections have higher accumulated energy loss.
- At higher operating frequencies (1 kHz, 5 kHz, and 10 kHz with 50% duty cycle), total power loss increases significantly and the imbalance slightly increases. A second module from a different manufacturer with the same ratings also showed middle sections slightly more stressed than lateral ones.
Methods
- A detailed CAD geometry of a commercial 1.7 kV/1 kA IGBT module was imported into ANSYS/Q3D, which uses FEM and MoM to extract stray resistance and inductance of the six sections from the power terminals to each section at frequencies from 1 kHz to 5 MHz. Simulations were performed separately at each frequency rather than using Q3D’s frequency sweep.
- PSpice simulations used the Q3D-extracted parameters, a lumped-charge IGBT model, an 84 µH load inductance, and 600 V DC to study turn-on current sharing among the six sections.
- Experimental validation used open modules without silicone gel, with a Rogowski coil inserted into each IGBT section. A non-destructive tester rated at 6 kA/1.1 kV was used for double-pulse tests; module A was tested at 700 V and 600 V, module B at the same conditions, and a frequency study was run at 1 kHz, 5 kHz, and 10 kHz with 50% duty cycle.
Limitations
- The paper states that because the PSpice parameters were extracted at the specific IGBT switching frequency (5 MHz), the simulation results only accurately reflect current sharing during the switching transient; for conduction-state current sharing, parameters at a lower frequency should be included.
- The paper states that Q3D simulations should be performed separately at each frequency because the finite-element mesh is optimized only for the simulated frequency, so accuracy could vary at frequencies significantly far from that solution frequency.
- Evident from the text: the study analyzes only the upper leg of the half-bridge module, uses open modules without silicone gel or plastic frame, and validates with modules from only two manufacturers, so the findings may not fully represent packaged or broader population behavior.
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Claims the paper makes
16 Own result · 10 Sources not found · 10 Own interpretation · 3 Own method
A result the paper reports from its own data — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“The imbalance of stray resistance is also higher at 5 MHz than 1 kHz.”
§ Comprehensive Investigation on Current Imbalance among Parallel Chips inside MW-Scale IGBT Power Modules > III. EXTRACTION OF STRAY PARAMETERS
plainstates an association- Asserted: passes — The authors put it forward as true.
- Checkable: passes — It can be checked against evidence.
- Load-bearing: passes — The paper’s conclusions depend on it.
- Based: passes — The paper gives a reason why it holds.
A result the paper reports from its own data — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“By comparing Fig. 10 and Fig. 14, it can be seen that middle sections are slightly more stressed than the lateral ones.”
§ Comprehensive Investigation on Current Imbalance among Parallel Chips inside MW-Scale IGBT Power Modules > B. Experimental Results
plainstates an association- Asserted: passes — The authors put it forward as true.
- Checkable: passes — It can be checked against evidence.
- Load-bearing: unclear — It is unclear whether the paper’s conclusions depend on it.
- Based: passes — The paper gives a reason why it holds.
A result the paper reports from its own data — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“It is noted that the stray inductance is almost constant with frequency, while the stray resistance increases with frequency rising due to skin and proximity effects.”
§ Comprehensive Investigation on Current Imbalance among Parallel Chips inside MW-Scale IGBT Power Modules > III. EXTRACTION OF STRAY PARAMETERS
plain- Asserted: passes — The authors put it forward as true.
- Checkable: passes — It can be checked against evidence.
- Load-bearing: passes — The paper’s conclusions depend on it.
- Based: passes — The paper gives a reason why it holds.
A result the paper states — it cites no source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“Furthermore, the observed imbalance phenomenon is frequency-dependent.”
§ Comprehensive Investigation on Current Imbalance among Parallel Chips inside MW-Scale IGBT Power Modules > V. CONCLUSION
plainstates an association- Asserted: passes — The authors put it forward as true.
- Checkable: passes — It can be checked against evidence.
- Load-bearing: passes — The paper’s conclusions depend on it.
- Based: passes — The paper gives a reason why it holds.
A result the paper reports from its own data — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“The difference in the inductances and resistances of different sections is observed.”
§ Comprehensive Investigation on Current Imbalance among Parallel Chips inside MW-Scale IGBT Power Modules > III. EXTRACTION OF STRAY PARAMETERS
plainstates an association- Asserted: passes — The authors put it forward as true.
- Checkable: passes — It can be checked against evidence.
- Load-bearing: passes — The paper’s conclusions depend on it.
- Based: passes — The paper gives a reason why it holds.
18 more claims
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- It may state two separate claims as one. 11
- Probably not a substantial claim. 10
Citations
Cites
Electromagnetic scattering by surfaces of arbitrary shape
Rao, S., Wilton, D. R., & Glisson, A. W. (1982) · IEEE Transactions on Antennas and Propagation · doi:10.1109/tap.1982.1142818 · Cited by 5,432
An Industry-Based Survey of Reliability in Power Electronic Converters
Yang, S., Bryant, A. T., Mawby, P., Xiang, D., Ran, L., & Tavner, P. J. (2011) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2011.2124436 · Cited by 2,058
Power Electronics Converters for Wind Turbine Systems
Blaabjerg, F., Liserre, M., & Ma, K. (2011) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2011.2181290 · Cited by 923
Self-citationToward Reliable Power Electronics: Challenges, Design Tools, and Opportunities
Wang, H., Liserre, M., & Blaabjerg, F. (2013) · IEEE Industrial Electronics Magazine · doi:10.1109/mie.2013.2252958 · Cited by 919
Self-citationLutz, J., Schlangenotto, H., Scheuermann, U., & Doncker, R. D. (2011) · Springer eBooks · doi:10.1007/978-3-642-11125-9 · Cited by 709
High performance Rogowski current transducers
Ray, W. F., & Hewson, C. R. (2002) · IEEE Industry Applications Society Annual Meeting (IAS) · doi:10.1109/ias.2000.882606 · Cited by 214
Dynamic Characterization of Parallel-Connected High-Power IGBT Modules
Chen, N., Chimento, F., Nawaz, M., & Wang, L. (2015) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2014.2330075 · Cited by 65
Physical CAD Model for High-Voltage IGBTs Based on Lumped-Charge Approach
Iannuzzo, F., & Busatto, G. (2004) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2004.830085 · Cited by 56
Self-citationStray inductance estimation with detailed model of the IGBT module
Popova, L., Juntunen, R., Musikka, T., Lohtander, M., Silventoinen, P., Pyrhönen, O., & Pyrhonen, J. J. (2013) · European Conference on Power Electronics and Applications · doi:10.1109/epe.2013.6631852 · Cited by 45
Azar, R., Udrea, R., Ng, W. T., Dawson, F., Findlay, W., & Waind, P. (2008) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2007.909182 · Cited by 40
Research works printed but not linked: 2
- 0, Q3d extractor, v 6.0, user guide, ANSYS Inc Tech Rep
- wolfgang, 0, Examples for failures in power electronics systems, ECPE Tutorial on Reliability Power Electronic System 2007
Cited by
Overview of high voltage sic power semiconductor devices: development and application
Ji, S., Zhang, Z., & Wang, F. (2017) · CES Transactions on Electrical Machines and Systems · doi:10.23919/tems.2017.8086104 · Cited by 216
Yang, F., Wang, Z., Liang, Z., & Wang, F. (2018) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2018.2870248 · Cited by 106
Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module
DiMarino, C., Mouawad, B., Johnson, C. M., Wang, M., Tan, Y., Lu, G., Boroyevich, D., & Burgos, R. P. (2019) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2944138 · Cited by 104
Zeng, Z., Zhang, X., & Li, X. (2019) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2900497 · Cited by 97
Reduction of parasitic capacitance in 10 kV SiC MOSFET power modules using 3D FEM
Jørgensen, A. B., Christensen, N. H., Dalal, D. N., Sonderskov, S. D., Bęczkowski, S., Uhrenfeldt, C., & Munk‐Nielsen, S. (2017) · European Conference on Power Electronics and Applications · doi:10.23919/epe17ecceeurope.2017.8098962 · Cited by 60
Metadata
- Authors
- Wu, R., Smirnova, L., Wang, H., Iannuzzo, F., & Blaabjerg, F.
- Affiliations
- Aalborg University (DK)
- Lappeenranta-Lahti University of Technology (FI)
- Università degli studi di Cassino e del Lazio Meridionale (IT)
- Venue
- 2015 9th International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia)
- Publisher
- IEEE
- Published
- 2015-06
- Pages
- 850-856
- OpenAlex
- W1896017968
- Cited by
- 47
- References
- 19
- Citations by year
- 2026: 1 · 2025: 5 · 2024: 7 · 2023: 8 · 2022: 3 · 2021: 1 · 2020: 3 · 2019: 8 · 2018: 3 · 2017: 5 · 2016: 2 · 2015: 1
- FWCI
- 4.58
- Type
- conference paper
- Language
- en
- Open access
- green
- vbn.aau.dk
- Locations
- International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia) (publishedVersion)
- VBN Forskningsportal (Aalborg Universitet) (submittedVersion)
- Archivio Istituzionale della Ricerca - Università degli Studi di Cassino (submittedVersion)
- Funders
- Aalborg Universitet
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electromagnetic Compatibility and Noise Suppression
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
- Keywords
- IGBT modules, current sharing, current imbalance, stray parameters, parasitic parameters, high power IGBT, parasitic extraction
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