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Cited by 47Silicon Carbide Semiconductor TechnologiesElectromagnetic Compatibility and Noise SuppressionMultilevel Inverters and Converters

The DOI matches its Crossref record; 19 of the 19 references it cites were found in a registry or an index; none of the 12 sources its claims cite is checked for support yet.

Comprehensive investigation on current imbalance among parallel chips inside MW-scale IGBT power modules

Open access
Wu, Rui, Smirnova, Liudmila, Wang, Huai, Iannuzzo, Francesco, Blaabjerg, Frede·2015·2015 9th International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia)

Abstract

With the demands for increasing the power rating and improving reliability level of the high power IGBT modules, there are further needs of understanding how to achieve stable paralleling and identical current sharing between the chips. This paper investigates the stray parameters imbalance among parallel chips inside the 1.7 kV/1 kA high power IGBT modules at different frequencies by Ansys Q3D parastics extractor. The resulted current imbalance is further confirmed by experimental measurement.

Overview

CoChat Summary

TL;DR

This paper investigates stray-parameter imbalance among six parallel sections inside a 1.7 kV/1 kA IGBT power module and its effect on current sharing. Q3D extraction, PSpice simulation, and double-pulse experiments show that middle sections conduct more current and dissipate more turn-on loss, with the imbalance increasing at higher frequencies.

Key findings

  • The six parallel sections have unequal stray parameters: middle sections 2–4 have lower stray inductance and resistance than lateral sections. At 1 kHz, extracted \(L_x\) is 74, 46, 35, 48, 69, and 90 nH for sections 1–6, while \(R_x\) is 342, 225, 179, 213, 264, and 346 µΩ. At 5 MHz, \(L_x\) is 69, 42, 32, 42, 61, and 81 nH, while \(R_x\) rises to 10065, 6401, 4645, 5622, 7457, and 10171 µΩ.
  • Stray inductance is almost constant with frequency, but stray resistance increases with frequency due to skin and proximity effects; the resistance imbalance is higher at 5 MHz than at 1 kHz, implying more obvious current imbalance during switching transients.
  • PSpice simulation and experiments agree that sections 2–4 conduct more current than the other sections during turn-on. The turn-on loss of section 3 is almost twice that of section 6, and middle sections have higher accumulated energy loss.
  • At higher operating frequencies (1 kHz, 5 kHz, and 10 kHz with 50% duty cycle), total power loss increases significantly and the imbalance slightly increases. A second module from a different manufacturer with the same ratings also showed middle sections slightly more stressed than lateral ones.

Methods

  • A detailed CAD geometry of a commercial 1.7 kV/1 kA IGBT module was imported into ANSYS/Q3D, which uses FEM and MoM to extract stray resistance and inductance of the six sections from the power terminals to each section at frequencies from 1 kHz to 5 MHz. Simulations were performed separately at each frequency rather than using Q3D’s frequency sweep.
  • PSpice simulations used the Q3D-extracted parameters, a lumped-charge IGBT model, an 84 µH load inductance, and 600 V DC to study turn-on current sharing among the six sections.
  • Experimental validation used open modules without silicone gel, with a Rogowski coil inserted into each IGBT section. A non-destructive tester rated at 6 kA/1.1 kV was used for double-pulse tests; module A was tested at 700 V and 600 V, module B at the same conditions, and a frequency study was run at 1 kHz, 5 kHz, and 10 kHz with 50% duty cycle.

Limitations

  • The paper states that because the PSpice parameters were extracted at the specific IGBT switching frequency (5 MHz), the simulation results only accurately reflect current sharing during the switching transient; for conduction-state current sharing, parameters at a lower frequency should be included.
  • The paper states that Q3D simulations should be performed separately at each frequency because the finite-element mesh is optimized only for the simulated frequency, so accuracy could vary at frequencies significantly far from that solution frequency.
  • Evident from the text: the study analyzes only the upper leg of the half-bridge module, uses open modules without silicone gel or plastic frame, and validates with modules from only two manufacturers, so the findings may not fully represent packaged or broader population behavior.

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Integrity signals

Registry

Crossref · 10.1109/icpe.2015.7167881

Cites

19 of 19 references verified0 citation errors · 0 not checkable

Statistics

Nothing to recompute.

Verification

Claims the paper makes

16 Own result · 10 Sources not found · 10 Own interpretation · 3 Own method

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Citations

Cites

Show all 19 references

Research works printed but not linked: 2

  1. 0, Q3d extractor, v 6.0, user guide, ANSYS Inc Tech Rep
  2. wolfgang, 0, Examples for failures in power electronics systems, ECPE Tutorial on Reliability Power Electronic System 2007

Cited by

See all 47

Metadata

Authors
Wu, R., Smirnova, L., Wang, H., Iannuzzo, F., & Blaabjerg, F.
Affiliations
  • Aalborg University (DK)
  • Lappeenranta-Lahti University of Technology (FI)
  • Università degli studi di Cassino e del Lazio Meridionale (IT)
Venue
2015 9th International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia)
Publisher
IEEE
Published
2015-06
Pages
850-856
OpenAlex
W1896017968
Cited by
47
References
19
Citations by year
2026: 1 · 2025: 5 · 2024: 7 · 2023: 8 · 2022: 3 · 2021: 1 · 2020: 3 · 2019: 8 · 2018: 3 · 2017: 5 · 2016: 2 · 2015: 1
FWCI
4.58
Type
conference paper
Language
en
Open access
Locations
  • International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia) (publishedVersion)
  • VBN Forskningsportal (Aalborg Universitet) (submittedVersion)
  • Archivio Istituzionale della Ricerca - Università degli Studi di Cassino (submittedVersion)
Funders
Aalborg Universitet
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electromagnetic Compatibility and Noise Suppression
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
Keywords
IGBT modules, current sharing, current imbalance, stray parameters, parasitic parameters, high power IGBT, parasitic extraction

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Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.