The DOI matches its Crossref record; 2 of the 2 references it cites were found in a registry or an index.
Direct liquid cooling module with high reliability solder joining technology for automotive applications
Abstract
We developed the direct-liquid-cooling IGBT module which enabled downsizing of a power control unit for HEV system and high reliability simultaneously. This module eliminates thermal grease by unifying a ceramic substrate and a heat sink. It contributes this module realized the reduction of thermal resistance 30 % compared to the conventional indirect liquid cooling type. High thermal conductive Si3N4ceramics for the substrate and lightweight aluminum heat sink that are suitable for automotive use demand are applied. The technological challenge of this module is to overcome the decrease of the reliability of the joint by large CTE mismatch between substrate and heat sink. We developed the Sn-Sb based solder material which can attain high reliability for automotive use with large CTE mismatch components. And IGBT module with this new solder is applied to HEV.
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In the citing paper
“Direct liquid cooling improves heat removal by bringing coolant into direct contact with the chip or substrate surface, thereby reducing TBR and increasing heat-transfer efficiency [29,50,51].”
From Thermal Management of Wide-Bandgap Power Semiconductors: Strategies and Challenges in SiC and GaN Power Devices (2025) · cites this paper as [51]
Citations
Cites
Reliability of power cycling for igbt power semiconductor modules
Morozumi, A., Yamada, K., Miyasaka, T., Sumi, S., & Seki, Y. (2003) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2003.810661 · Cited by 256
Self-citationImproved life of IGBT module suitable for electric propulsion system
Nishiura, A., & Morozumi, A. (2009) · Cited by 3
Self-citation
Research works printed but not linked: 2
- uhlemann, 2012, A new base plate concept on the basis of aluminum-copper clad material, ISBN 978-3-8007-3431-3 "Proceedings PCIM Europe 2012 Conference, 680
- sasaki, 2010, Small size, low thermal resistance and high reliability packaging technologies of igbt module for wind power applications, ISBN 978-3-8007-3229-6 "Proceedings PCIM Europe 2010 Conference, 267
Cited by
Sorted by citations
Han, G., Kim, J., Park, S., & Bae, W. (2025) · Electronics · doi:10.3390/electronics14214193 · Cited by 34
“…clogging [55] • High-frequency RF amplifiers (e.g., GaN MMIC) • Dense power modules [29] Direct Liquid • R th reduction: ≈ 30% (vs. indirect) [51] • Eliminates TIM layer • Improved heat-transfer efficiency [50] • CTE mismatch risk • Potential leakage and corrosion risk [50] • Automotive…”
Metadata
- Authors
- Morozumi, A., Hokazono, H., Nishimura, Y., Ikeda, Y., Nabetani, Y., & Takahashi, Y.
- Affiliations
- Fuji Electric (Japan) (JP)
- University of Yamanashi (JP)
- Venue
- 2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD)
- Publisher
- IEEE
- Published
- 2013-05
- Pages
- 109-112
- ISSN
- 1063-6854 (ISSN-L)
- OpenAlex
- W2144906639
- Cited by
- 38
- References
- 2
- Citations by year
- 2026: 4 · 2025: 4 · 2024: 3 · 2022: 8 · 2021: 1 · 2019: 1 · 2018: 1 · 2017: 2 · 2016: 5 · 2015: 2 · 2014: 5 · 2013: 2
- FWCI
- 5.68
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Optimization
- Keywords
- direct liquid cooling, IGBT modules, ceramic substrates, silicon nitride ceramics, aluminum heat sink, thermal resistance, thermal expansion mismatch, joint reliability, automotive electronics
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