Cited by 346Advanced Memory and Neural ComputingLow-power high-performance VLSI designParallel Computing and Optimization Techniques

15.3 A 351TOPS/W and 372.4GOPS Compute-in-Memory SRAM Macro in 7nm FinFET CMOS for Machine-Learning Applications

Dong, Qing, Sinangil, Mahmut E., Erbagci, Burak, Sun, Dar, Khwa, Win-San, Liao, Hung-Jen, Wang, Yih, Chang, Jonathan·2020·2020 IEEE International Solid- State Circuits Conference - (ISSCC)

Abstract

Compute-in-memory (CIM) parallelizes multiply-and-average (MAV) computations and reduces off-chip weight access to reduce energy consumption and latency, specifically for Al edge devices. Prior CIM approaches demonstrated tradeoffs for area, noise margin, process variation and weight precision. 6T SRAM [1]–[3] provides the smallest cell area for CIM, but cell stability limits the number of activated cells, resulting in low parallelization. 10T and twin-8T [4]–[5] isolate the read/write paths for noise margin improvement, however both require special design of the bit cell using logic layout rules, resulting in over a 2x area overhead compared to foundry yield-optimized 6T SRAMs. Furthermore, single-bit precision of weights, in prior work [1]–[4], cannot meet the requirement for high-precision operations and scalability for large neural networks.

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Crossref · 10.1109/isscc19947.2020.9062985

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  • Most compute-in-memory or near-memory approaches based on SRAMs and digital compute do not address the energy and time costs of reloading weights, making direct side-by-side comparisons against NVM-based weight-stationary approaches difficult; several NVM compute-in-memory studies have focused on the macro-level without accounting for data transport, control or chip infrastructure costs, and are,

    “Although several compute-in-memory or near-memory approaches based on SRAMs and digital compute35–38 have been presented in the literature, most of these do not address the energy and time costs of reloading weights, thus making direct side-by-side comparisons against NVM-based weight-stationary approaches difficult.”

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Authors
Dong, Q., Sinangil, M. E., Erbagci, B., Sun, D., Khwa, W.-S., Liao, H.-J., Wang, Y., & Chang, J.
Affiliations
  • Taiwan Semiconductor Manufacturing Company (United States) (US)
  • Taiwan Semiconductor Manufacturing Company (Taiwan) (TW)
Venue
2020 IEEE International Solid- State Circuits Conference - (ISSCC)
Publisher
IEEE
Published
2020-02
Pages
242-244
ISSN
0193-6530 (ISSN-L)
OpenAlex
W3015432327
Cited by
346
References
1
Citations by year
2026: 24 · 2025: 51 · 2024: 61 · 2023: 63 · 2022: 61 · 2021: 68 · 2020: 17 · 2012: 1
FWCI
73.47
Type
conference paper
Language
en
Open access
closed
Locations
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference (publishedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced Memory and Neural Computing
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Low-power high-performance VLSI design
  • Physical Sciences › Computer Science › Hardware and Architecture › Parallel Computing and Optimization Techniques
Keywords
in-memory computing, SRAM macro, 6T SRAM, machine learning accelerators, 7nm FinFET, noise margin, process variation, weight precision, edge devices, energy efficiency, 10T SRAM

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