Ultrathin Optoelectronic Device Packaging in Flexible Carriers
Open accessAbstract
This paper presents the development of an advanced packaging technique for commercially available optoelectronic devices. Vertical cavity surface emitting laser (VCSEL) diodes and photodiodes are thinned down to 20 μm thickness, and are embedded in flexible carriers, resulting in a 75-μm-thin package, which can be bent down to a bending radius of 2 mm. Electrical, optical, and mechanical characterization addresses the influence of thinning and embedding of bare optoelectronic chips on their main properties. Next to the embedded optoelectronics, also electrical ICs like amplifiers and drivers can be housed in the same thin flexible package, using an identical technology and layer build-up. Finally, this new packaging approach is demonstrated in two different integrated sensor applications and in an integrated optical interconnection. For the latter application, also waveguides and optical out-of-plane coupling elements are integrated in the package and the complete system reliability is assessed by accelerated aging tests.
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Even after thinning and die separation, millimeter-small, micrometer-thin individual dice have to be handled, mounted, aligned and assembled on the flexible substrates, and related challenges are far from trivial as they are radically different from wafer level processes.
“However, even after thinning and die separation, millimeter-small, micrometer-thin individual dice have to be handled, mounted, aligned and assembled on the flexible substrates, and related challenges are far from trivial as they are radically different from wafer level processes (Bosman et al. 2011).”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Bosman et al. 2011
Cites
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Highly Reliable Flexible Active Optical Links
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Self-citationFabrication Processes for Embedding Thin Chips in Flat Flexible Substrates
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Self-citationArteaga, M. A., Unold, H. J., Ostermann, J., et al. (2006) · IEEE Journal of Quantum Electronics · doi:10.1109/jqe.2005.861623 · Cited by 17 · see citing works
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Giagka, V., & Serdijn, W. A. (2018) · Bioelectronic Medicine · doi:10.1186/s42234-018-0010-y · Cited by 58 · see citing works
- Authors
- Bosman, E., Missinne, J., Hoe, B. V., Steenberge, G. V., Kalathimekkad, S., Erps, J. V., Milenkov, I., Panajotov, K., Gijseghem, T. V., Dubruel, P., Thienpont, H., & Daele, P. V.
- Affiliations
- Ghent University (BE)
- Vrije Universiteit Brussel (BE)
- ORCID
- Venue
- IEEE Journal of Selected Topics in Quantum Electronics
- Published
- 2011-05
- Volume
- 17
- Issue
- 3
- Pages
- 617-628
- ISSN
- 1077-260X (ISSN-L)
- 1558-4542
- OpenAlex
- W1828089955
- Cited by
- 48
- References
- 13
- Citations by year
- 2025: 2 · 2024: 1 · 2023: 1 · 2022: 1 · 2019: 2 · 2018: 3 · 2017: 3 · 2016: 5 · 2015: 5 · 2014: 6 · 2013: 5 · 2012: 10
- FWCI
- 5.59
- Type
- journal article
- Language
- en
- Open access
- green
- zenodo.org
- Locations
- IEEE Journal of Selected Topics in Quantum Electronics (publishedVersion)
- Ghent University Academic Bibliography (Ghent University) (submittedVersion)
- VUBIR (Vrije Universiteit Brussel) (submittedVersion)
- Zenodo (CERN European Organization for Nuclear Research) (submittedVersion, other-oa)
- Funders
- Fonds Wetenschappelijk Onderzoek
- Vlaamse regering
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Keywords
- optoelectronic packaging, flexible packaging, photodiode, thin packages, integrated sensors, waveguides, out-of-plane coupling
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