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Thermal Challenges in Next-Generation Electronic Systems
Abstract
Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.
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Cited by
Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials
Shahil, K. M. F., & Balandin, A. A. (2012) · Nano Letters · doi:10.1021/nl203906r · Cited by 1,467
Thermal properties of graphene and multilayer graphene: Applications in thermal interface materials
Shahil, K. M. F., & Balandin, A. A. (2012) · Solid State Communications · doi:10.1016/j.ssc.2012.04.034 · Cited by 829
Lin, Z., Liu, Y., Raghavan, S., Moon, K.-S., Sitaraman, S. K., & Wong, C.-P. (2013) · ACS Applied Materials & Interfaces · doi:10.1021/am401939z · Cited by 469
High temperature thermal management with boron nitride nanosheets
Wang, Y., Xu, L., Yang, Z., Xie, H., Jiang, P., Dai, J., Luo, W., Yao, Y., Hitz, E., Yang, R., et al. (2018) · Nanoscale · doi:10.1039/c7nr07058f · Cited by 66
Cooling Limits for GaN HEMT Technology
Won, Y., Cho, J., Agonafer, D., Asheghi, M., & Goodson, K. E. (2013) · 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) · doi:10.1109/csics.2013.6659222 · Cited by 57
Metadata
- Authors
- Garimella, S. V., Fleischer, A. S., Murthy, J. Y., Keshavarzi, A., Prasher, R., Patel, C., Bhavnani, S. H., Venkatasubramanian, R., Mahajan, R., Joshi, Y., Sammakia, B., Myers, B. A., Chorosinski, L., Baelmans, M., Sathyamurthy, P., & Raad, P. E.
- Venue
- IEEE Transactions on Components and Packaging Technologies
- Published
- 2008-12
- Volume
- 31
- Issue
- 4
- Pages
- 801-815
- ISSN
- 1521-3331 (ISSN-L)
- OpenAlex
- W2132090496
- Cited by
- 505
- References
- 0
- FWCI
- 10.85
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: Thermal Challenges in Next-Generation Electronic Systems. https://app.cochat.ai/papers/10.1109/tcapt.2008.2001197
- The paper
- Garimella, S. V., Fleischer, A. S., Murthy, J. Y., Keshavarzi, A., Prasher, R., Patel, C., Bhavnani, S. H., Venkatasubramanian, R., Mahajan, R., Joshi, Y., Sammakia, B., Myers, B. A., Chorosinski, L., Baelmans, M., Sathyamurthy, P., & Raad, P. E. (2008). Thermal Challenges in Next-Generation Electronic Systems. IEEE Transactions on Components and Packaging Technologies. https://doi.org/10.1109/tcapt.2008.2001197
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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