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Silicon Carbide Power MOSFET Model and Parameter Extraction Sequence
Abstract
A compact circuit simulator model is used to describe the performance of a 2-kV, 5-A 4-H silicon carbide (SiC) power DiMOSFET and to perform a detailed comparison with the performance of a widely used 400-V, 5-A Si power MOSFET. The model's channel current expressions are unique in that they include the channel regions at the corners of the square or hexagonal cells that turn on at lower gate voltages and the enhanced linear region transconductance due to diffusion in the nonuniformly doped channel. It is shown that the model accurately describes the static and dynamic performance of both the Si and SiC devices and that the diffusion-enhanced channel conductance is essential to describe the SiC DiMOSFET on-state characteristics. The detailed device comparisons reveal that both the on-state performance and switching performance at 25degC are similar between the 400-V Si and 2-kV SiC MOSFETs, with the exception that the SiC device requires twice the gate drive voltage. The main difference between the devices is that the SiC has a five times higher voltage rating without an increase in the specific on-resistance. At higher temperatures (above 100degC), the Si device has a severe reduction in conduction capability, whereas the SiC on-resistance is only minimally affected
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Cited by
Characterization, Modeling, and Application of 10-kV SiC MOSFET
Wang, J., Zhao, T., Li, J., Huang, A. Q., Callanan, R., Husna, F., & Agarwal, A. (2008) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2008.926650 · Cited by 398
Parallel Connection of Silicon Carbide MOSFETs—Challenges, Mechanism, and Solutions
Li, H., Zhao, S., Wang, X., Ding, L., & Mantooth, H. A. (2023) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2023.3278270 · Cited by 135
Self-citationFarhadi, M., Yang, F., Pu, S., Vankayalapati, B. T., & Akin, B. (2021) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2021.3049394 · Cited by 93
Xu, Y., Ho, C. N. M., Ghosh, A., & Muthumuni, D. (2021) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2021.3058227 · Cited by 29
Impact of device aging in the compact electro-thermal modeling of SiC power MOSFETs
Ceccarelli, L., Bahman, A. S., & Iannuzzo, F. (2019) · Microelectronics Reliability · doi:10.1016/j.microrel.2019.06.028 · Cited by 26
Metadata
- Authors
- McNutt, T. R., Hefner, A. R., Mantooth, H. A., Berning, D., & Ryu, S.-H.
- Venue
- IEEE Transactions on Power Electronics
- Published
- 2007-03
- Volume
- 22
- Issue
- 2
- Pages
- 353-363
- ISSN
- 0885-8993 (ISSN-L)
- OpenAlex
- W2146719088
- Cited by
- 256
- References
- 0
- FWCI
- 9.45
- Type
- journal article
- Language
- en
- Open access
- closed
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- McNutt, T. R., Hefner, A. R., Mantooth, H. A., Berning, D., & Ryu, S.-H. (2007). Silicon Carbide Power MOSFET Model and Parameter Extraction Sequence. IEEE Transactions on Power Electronics. https://doi.org/10.1109/tpel.2006.889890
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