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Cited by 2Silicon Carbide Semiconductor TechnologiesPulsed Power Technology ApplicationsMultilevel Inverters and Converters

The DOI matches its Crossref record; 26 of the 26 references it cites were found in a registry or an index.

Static Current Balancing Strategy for Parallel IGBTs Based on Parametric Compensation

Peng, Lan, Huang, Haihong, Wang, Haixin·2024·IEEE Transactions on Plasma Science

Abstract

Insulated gate bipolar transistor (IGBT) parallel connection is an effective way to solve the problem, which is the gradual increase in the capacity of the magnetic confinement power supply in a Tokamak device. Static current balance (SCB) is one of the key factors for the safe and stable operation of a parallel IGBT system. Therefore, to improve the stability of parallel IGBT systems, it is very important to study the current difference in the parallel IGBTs under various parameter differences. However, the existing results have focused mainly on device parameter matching through device screening, driving parameter matching using the active gate driving (AGD) method, or single parasitic parameter (PP) matching. These research results do not analyze the matching strategy between multiple parameters, which are the device parameter and the PP. The study showed that the collector inductance, emitter parasitic inductance, emitter parasitic resistance, collector equivalent resistance, and equivalent series voltage of the IGBTs have a significant impact on the SCB of the parallel IGBTs. When these five parameters are mismatched, there exists an equilibrium point that can reduce the static current difference (SCD) between the parallel IGBTs under the total influence of these parameter differences. Therefore, a current difference model (CDM) is created to analyze the equilibrium point of multiple parameter mismatches. The experimental results show that the multiparameter compensation scheme implemented by the CDM can effectively reduce the current difference between parallel IGBTs, which provides a feasible reference for device selection and circuit design.

Overview

Integrity signals

Registry

Crossref · 10.1109/tps.2024.3446817

Cites

26 of 26 references verified0 citation errors · 0 not checkable

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Verification

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Citations

Cites

Show all 26 references

Research works printed but not linked: 1

  1. Cao, 2023, Influence of parameter dispersion of parallel press-pack IGBT chips on, 43, 8025

Metadata

Authors
Peng, L., Huang, H., & Wang, H.
Affiliations
Hefei University of Technology (CN)
Venue
IEEE Transactions on Plasma Science
Published
2024-07
Volume
52
Issue
7
Pages
2907-2916
ISSN
  • 0093-3813 (ISSN-L)
  • 1939-9375
OpenAlex
W4402040341
Cited by
2
References
26
Citations by year
2026: 1 · 2025: 1
FWCI
0.19
Type
journal article
Language
en
Open access
closed
Locations
IEEE Transactions on Plasma Science (publishedVersion)
Funders
Regional Innovation and Development Joint Fund of the National Natural Science Foundation of China (U22A20225)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Pulsed Power Technology Applications
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
Keywords
parasitic inductance, parasitic resistance, equilibrium points

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Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.