Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling

Selected failure mechanisms of modern power modules

Ciappa, M. (2002) · Microelectronics Reliability · doi:10.1016/s0026-2714(02)00042-2 · Cited by 1,039 · see citing works

Prognostics and Health Management of Electronics

PECHT, M. G. (2008) · Wiley eBooks · doi:10.1002/9780470385845 · Cited by 848 · see citing works

Prognostics and health management of electronics

Vichare, N. M., & PECHT, M. G. (2006) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2006.870387 · Cited by 434 · see citing works

Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

Wang, G. Z., Cheng, Z. N., Becker, K., et al. (1998) · Journal of Electronic Packaging · doi:10.1115/1.1371781 · Cited by 324 · see citing works

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

Darveaux, R. (2002) · Journal of Electronic Packaging · doi:10.1115/1.1413764 · Cited by 304 · see citing works

Fault Diagnosis and Reconfiguration for Multilevel Inverter Drive Using AI-Based Techniques

Khomfoi, S., & Tolbert, L. M. (2007) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2007.906994 · Cited by 284 · see citing works

Reliability of power cycling for igbt power semiconductor modules

Morozumi, A., Yamada, K., Miyasaka, T., Sumi, S., & Seki, Y. (2003) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2003.810661 · Cited by 256 · see citing works

Mechanical characterization of Sn–Ag-based lead-free solders

Amagai, M., Watanabe, M., Omiya, M., et al. (2002) · Microelectronics Reliability · doi:10.1016/s0026-2714(02)00017-3 · Cited by 245 · see citing works

Prognostic and Warning System for Power-Electronic Modules in Electric, Hybrid Electric, and Fuel-Cell Vehicles

Xiong, Y., Cheng, X., Shen, Z. J., Mi, C. C., Wu, H., & Garg, V. K. (2008) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2008.918399 · Cited by 226 · see citing works

Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics

Patil, N., Celaya, J. ́. R., Das, D., Goebel, K., & PECHT, M. G. (2009) · IEEE Transactions on Reliability · doi:10.1109/tr.2009.2020134 · Cited by 222 · see citing works

Design for reliability of power electronics modules

Lu, H., Bailey, C., & Yin, C. (2009) · Microelectronics Reliability · doi:10.1016/j.microrel.2009.07.055 · Cited by 191 · see citing works

Enhancing the reliability of modular medium-voltage drives

Hammond, P. W. (2002) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2002.803172 · Cited by 175 · see citing works

Failure modes and FEM analysis of power electronic packaging

Ye, H., Lin, M., & Basaran, C. (2002) · Finite Elements in Analysis and Design · doi:10.1016/s0168-874x(01)00094-4 · Cited by 167 · see citing works

Current Sensor Fault Detection, Isolation, and Reconfiguration for Doubly Fed Induction Generators

Rothenhagen, K., & Fuchs, F. W. (2009) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2009.2017562 · Cited by 152 · see citing works

Fault management of multicell converters

Turpin, C., Baudesson, P., Richardeau, F., Forest, F., & Meynard, T. A. (2002) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2002.803196 · Cited by 138 · see citing works

Three-Level Converter Topologies With Switch Breakdown Fault-Tolerance Capability

Ceballos, S., Pou, J., Robles, E., Gabiola, I., Zaragoza, J., Villate, J. L., & Boroyevich, D. (2008) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2008.917072 · Cited by 133 · see citing works

Use of opposition method in the test of high-power electronic converters

Forest, F., Huselstein, J.-J., Faucher, S., et al. (2006) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2006.870711 · Cited by 117 · see citing works

Reliability challenges of automotive power electronics

Scheuermann, U. (2009) · Microelectronics Reliability · doi:10.1016/j.microrel.2009.06.045 · Cited by 116 · see citing works

Simulation of uniaxial tensile properties for lead-free solders with modified Anand model

Bai, N., Chen, X., & Gao, H. X. (2008) · Materials & Design (1980-2015) · doi:10.1016/j.matdes.2008.04.032 · Cited by 105 · see citing works

Reliability Considerations for Parallel Performance of Semiconductor Switches in High-Power Switching Power Supplies

Abdi, B., Ranjbar, A. H., Gharehpetian, G. B., et al. (2009) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2009.2014306 · Cited by 93 · see citing works

Degradation behavior of 600V–200A IGBT modules under power cycling and high temperature environment conditions

Berkani, M., Khatir, Z., Ousten, J.-P., Badel, F., Dupont, L., & Lefebvre, S. (2007) · Microelectronics Reliability · doi:10.1016/j.microrel.2007.07.027 · Cited by 83 · see citing works

How to Select the System Voltage of MV Drives—A Comparison of Semiconductor Expenses

Sayago, J., Bruckner, T., & Bernet, S. (2008) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2008.924032 · Cited by 77 · see citing works

Fault-Tolerant Reconfiguration System for Asymmetric Multilevel Converters Using Bidirectional Power Switches

Barriuso, P., Dixon, J., Flores, P., et al. (2008) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2008.2005680 · Cited by 69 · see citing works

Temperature-Level Effect on Solder Lifetime During Thermal Cycling of Power Modules

Berkani, M., Khatir, Z., Ousten, J.-P., & Lefebvre, S. (2008) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2008.2002354 · Cited by 48 · see citing works

Boundary element analysis of thermal fatigue effects on high power IGBT modules

Khatir, Z., & Lefebvre, S. (2004) · Microelectronics Reliability · doi:10.1016/j.microrel.2004.02.007 · Cited by 47 · see citing works

Mechanical Properties of Lead-Free Solders

Darveaux, R., & Reichman, C. (2007) · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2007.373872 · Cited by 42 · see citing works

High temperature reliability on automotive power modules verified by power cycling tests up to 150°C

Coquery, G., Lefranc, G., Licht, T., Lallemand, R., Seliger, N., & Berg, H. (2003) · Microelectronics Reliability · doi:10.1016/s0026-2714(03)00318-4 · Cited by 39 · see citing works

Effects of uni-axial mechanical stress on IGBT characteristics

Usui, M., Ishiko, M., Hotta, K., et al. (2005) · Microelectronics Reliability · doi:10.1016/j.microrel.2005.07.078 · Cited by 26 · see citing works

Precursor parameter identification for power supply prognostics and health management

Zhang, H., Kang, R., Luo, M., et al. (2009) · International Conference on Reliability, Maintainability and Safety · doi:10.1109/icrms.2009.5269961 · Cited by 25 · see citing works

Reliability of Lead-Free BGA Assembly: Correlation Between Accelerated Ageing Tests and FE Simulations

Guédon-Gracia, A., Woirgard, E., & Zardini, C. (2008) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2008.2000895 · Cited by 17 · see citing works

A study of the threshold-voltage suitability as an application-related reliability indicator for planar-gate non-punch-through IGBTs

Castellazzi, A., Ciappa, M., Fïchtner, W., et al. (2007) · Microelectronics Reliability · doi:10.1016/j.microrel.2007.07.035 · Cited by 12 · see citing works

A New Algorithm for Real-Time Multiple Open-Circuit Fault Diagnosis in Voltage-Fed PWM Motor Drives by the Reference Current Errors

Estima, J. O., & Marques Cardoso, A. J. (2013) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2012.2188877 · Cited by 377 · see citing works

Automotive Traction Inverters: Current Status and Future Trends

Reimers, J., Dorn-Gomba, L., Mak, C., & Emadi, A. (2019) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2019.2897899 · Cited by 375 · see citing works

Continuous maintenance and the future – Foundations and technological challenges

Roy, R., Stark, R., Tracht, K., Takata, S., & Mori, M. (2016) · CIRP Annals · doi:10.1016/j.cirp.2016.06.006 · Cited by 309 · see citing works

A Robust Observer-Based Method for IGBTs and Current Sensors Fault Diagnosis in Voltage-Source Inverters of PMSM Drives

Jlassi, I., Estima, J. O., El Khil, S. K., Bellaaj, N. M., & Cardoso, A. J. M. (2017) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2016.2616398 · Cited by 284 · see citing works

A Comprehensive Review Toward the State-of-the-Art in Failure and Lifetime Predictions of Power Electronic Devices

Hanif, A., Yu, Y., DeVoto, D., & Khan, F. (2019) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2018.2860587 · Cited by 272 · see citing works

Power Cycling Reliability of Power Module: A Survey

Durand, C., Klingler, M., Coutellier, D., & Naceur, H. (2016) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2016.2516044 · Cited by 239 · see citing works

Evaluation of $V_{\rm ce}$ Monitoring as a Real-Time Method to Estimate Aging of Bond Wire-IGBT Modules Stressed by Power Cycling

Smet, V., Forest, F., Huselstein, J.-J., Rashed, A., & Richardeau, F. (2013) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2012.2196894 · Cited by 232 · see citing works

Multiple Open-Circuit Faults Diagnosis in Back-to-Back Converters of PMSG Drives for Wind Turbine Systems

Jlassi, I., Estima, J. O., Khojet El Khil, S., Mrabet Bellaaj, N., & Marques Cardoso, A. J. (2015) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2342506 · Cited by 212 · see citing works

Advanced Accelerated Power Cycling Test for Reliability Investigation of Power Device Modules

Choi, U.-M., Joergensen, S., & Blaabjerg, F. (2016) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2016.2521899 · Cited by 200 · see citing works

Current Similarity Analysis-Based Open-Circuit Fault Diagnosis for Two-Level Three-Phase PWM Rectifier

Wu, F., & Zhao, J. (2017) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2016.2587339 · Cited by 82 · see citing works

Role of Threshold Voltage Shift in Highly Accelerated Power Cycling Tests for SiC MOSFET Modules

Luo, H., Iannuzzo, F., & Turnaturi, M. (2020) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2894717 · Cited by 82 · see citing works

Constant <italic>ΔT<sub>j</sub> </italic> Power Cycling Strategy in DC Mode for Top-Metal and Bond-Wire Contacts Degradation Investigations

Tran, S.-H., Khatir, Z., Lallemand, R., Ibrahim, A., Ousten, J.-P., Ewanchuk, J., & Mollov, S. V. (2019) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2018.2847234 · Cited by 26 · see citing works

AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters

Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2023.3271251 · Cited by 24 · see citing works

Failure Mechanism Analysis of Bond Wire of High Power IGBT under Different Load Current

Fu, H., Li, Y., Li, Q., et al. (2022) · IEEE International Electrical and Energy Conference (CIEEC) · doi:10.1109/cieec54735.2022.9846435 · Cited by 8 · see citing works

Thermal analysis and reliability assessment of power module under power cycling test using global- local finite element method

Chiang, Y.-C., Hsu, F.-M., Su, Y.-F., et al. (2014) · International Microsystems, Packaging, Assembly and Circuits Technology Conference · doi:10.1109/impact.2014.7048442 · Cited by 8 · see citing works

Online electro-thermal model for real time junction temperature estimation for insulated gate bipolar transistor (IGBT)

Sathik, M. H. M., Jet, T. K., Kandasamy, K., et al. (2016) · IEEE Annual Southern Power Electronics Conference · doi:10.1109/spec.2016.7846197 · Cited by 7 · see citing works

Thermal Analysis and Test Condition Definition of Power cycling Tests for a 6-in-1 Double Side Cooling SiC Power Module

Tang, G. (2022) · IEEE Electronics Packaging Technology Conference (EPTC) · doi:10.1109/eptc56328.2022.10013156 · Cited by 4 · see citing works

Study on Effect of Junction Temperature Swing Duration on Lifetime of Transfer Molded Power IGBT Modules

Choi, U., Blaabjerg, F., & Jorgensen, S. (2017) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2016.2618917 · Cited by 112 · see citing works