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Dry etching of polydimethylsiloxane for microfluidic systems

Garra, J., Long, T., Currie, J., Schneider, T., White, R., Paranjape, M.·2002·Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Abstract

A fluorine-based reactive ion etch (RIE) process has been developed to anisotropically dry etch the silicone elastomer polydimethylsiloxane (PDMS). This technique complements the standard molding procedure that makes use of forms made of thick SU-8 photoresist to produce features in the PDMS. Total gas pressure and the ratio of O2 to CF4 were varied to optimize etch rate. The RIE recipe developed in this study uses a 1:3 mixture of O2 to CF4 gas resulting in a highly directional and stable etch rate of approximately 20 μm per hour. Selective dry etching can be performed through a photolithographically patterned metal etch mask providing greater precision and alignment with preexisting molded features. The dry etch process is presented in this article along with a brief comparison to recently reported wet etch approaches.

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Metadata

Authors
Garra, J., Long, T., Currie, J., Schneider, T., White, R., & Paranjape, M.
Venue
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
Published
2002-05-01
Volume
20
Issue
3
Pages
975-982
ISSN
  • 0734-2101 (ISSN-L)
  • 1520-8559
OpenAlex
W2054598075
Cited by
188
References
0
FWCI
3.16
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Dry etching of polydimethylsiloxane for microfluidic systems. https://app.cochat.ai/papers/10.1116/1.1460896
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Garra, J., Long, T., Currie, J., Schneider, T., White, R., & Paranjape, M. (2002). Dry etching of polydimethylsiloxane for microfluidic systems. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. https://doi.org/10.1116/1.1460896

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.