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Cited by 396

The DOI matches its Crossref record; 15 of the 15 references it cites were found in a registry or an index.

A Flexible Polymer Tactile Sensor: Fabrication and Modular Expandability for Large Area Deployment

Lee, Hyung-Kew, Chang, Sun-Il, Yoon, Euisik·2006·Journal of Microelectromechanical Systems

Abstract

In this paper, we propose and demonstrate a modular expandable capacitive tactile sensor using polydimethylsiloxsane (PDMS) elastomer. A sensor module consists of 16times16 tactile cells with 1 mm spatial resolution, similar to that of human skin, and interconnection lines for expandability. The sensor has been fabricated by using five PDMS layers bonded together. In order to customize the sensitivity of a sensor, we cast PDMS by spin coating and cured it on a highly planarized stage for uniform thickness. The cell size is 600times600 mum2and initial capacitance of each cell is about 180 fF. Tactile response of a cell has been measured using a commercial force gauge having 1 mN resolution and a motorized z-axis precision stage with 100 nm resolution. The fabricated cell shows a sensitivity of 3%/mN within the full scale range of 40 mN (250 kPa). Four tactile modules have been successfully attached by using anisotropic conductive paste to demonstrate expandability of the proposed sensors. Various tactile images have been successfully captured by single sensor module as well as the expanded 32times32 array sensors

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Metadata

Authors
Lee, H.-K., Chang, S.-I., & Yoon, E.
Venue
Journal of Microelectromechanical Systems
Published
2006-12
Volume
15
Issue
6
Pages
1681-1686
ISSN
1057-7157 (ISSN-L)
OpenAlex
W2127045241
Cited by
396
References
15
FWCI
6.58
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: A Flexible Polymer Tactile Sensor: Fabrication and Modular Expandability for Large Area Deployment. https://app.cochat.ai/papers/10.1109/jmems.2006.886021
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Lee, H.-K., Chang, S.-I., & Yoon, E. (2006). A Flexible Polymer Tactile Sensor: Fabrication and Modular Expandability for Large Area Deployment. Journal of Microelectromechanical Systems. https://doi.org/10.1109/jmems.2006.886021

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