Cited by 57Advancements in Photolithography TechniquesAdvanced optical system designIndustrial Vision Systems and Defect Detection

The DOI matches its Crossref record.

Projection Printing Characterization:

Bossung, John W.·1977·SPIE Proceedings

Abstract

Projection printing eliminates the problems introduced by hard-contacting the mask to the wafer while maintaining the high resolution requirements of the integrated circuit manufacturer. Certain advantages of projection printing are obvious: the wafers are not contaminated or damaged by contact with the mask, and the mask will not wear out. Less obvious are the steps required to maximize the advantages of projection printing, thereby reducing costs and increasing yields. This paper considers photoresist choices, suggests some procedures to determine process variables, and discusses mask costs and quality effects.

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Integrity signals

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Crossref · 10.1117/12.955357

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Metadata

Authors
Bossung, J. W.
Affiliations
PerkinElmer (United States) (US)
Corresponding author
Bossung, John W.
Venue
SPIE Proceedings
Publisher
SPIE
Published
1977-08-08
Volume
0100
Pages
80-85
ISSN
0277-786X (ISSN-L)
OpenAlex
W2046658518
Cited by
57
References
0
Citations by year
2026: 3 · 2025: 1 · 2024: 4 · 2023: 3 · 2022: 4 · 2021: 3 · 2019: 1 · 2018: 1 · 2015: 4 · 2014: 1 · 2013: 2
FWCI
0.00
Type
conference paper
Language
en
Open access
closed
Locations
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (publishedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advancements in Photolithography Techniques
  • Physical Sciences › Physics and Astronomy › Atomic and Molecular Physics, and Optics › Advanced optical system design
  • Physical Sciences › Engineering › Industrial and Manufacturing Engineering › Industrial Vision Systems and Defect Detection
Keywords
projection printing, photolithography, process parameter optimization, integrated circuit fabrication, wafer contamination, yield improvement

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