Cited by 3Photonic and Optical DevicesSemiconductor Lasers and Optical DevicesPhotonic Crystals and Applications

InGaAsP/InP membrane gain sections for III-V/SiNx heterogeneous photonic integration

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Heidelberger, Christopher, Santis, Christos T., Plant, Jason J., Morissette, Erin M., Kharas, Dave, Swint, Reuel B., Yariv, Amnon, Juodawlkis, Paul W.·2021·Conference on Lasers and Electro-Optics

Abstract

We present a fabrication process for 200 nm thick InGaAsP/InP membrane gain sections ( = 1550 nm) suitable for heterogeneous integration with SiN x PICs. The structures exhibit desired electrical performance and support lasing.

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Crossref · 10.1364/cleo_si.2021.sth2h.1

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  • Exemplar demonstrations of a heterogeneous PIC platform include high-power (>300 mW) low-noise lasers incorporating flip-chipped semiconductor optical amplifiers, surface-bonded optical gain media, and low-loss surface-bonded thin-film lithium-niobate (TFLN) waveguides.

    “Exemplar demonstrations of such a heterogeneous PIC platform include high-power (>300 mW) low-noise lasers incorporating flip-chipped semiconductor optical amplifiers (figure 3(d)) [17], surface-bonded optical gain media (figure 3(c)) [18,19], and low-loss surface-bonded thin-film lithium-niobate (TFLN) waveguides (figure 3(b)) [20].”

    From 2022 Roadmap on integrated quantum photonics (2022) · cites this paper as [19]

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  • 2022 Roadmap on integrated quantum photonics

    Moody, G., Sorger, V. J., Blumenthal, D. J., Juodawlkis, P. W., Loh, W., Sorace-Agaskar, C., Jones, A. E., Balram, K. C., Matthews, J. C. F., Laing, A., et al. (2022) · Journal of Physics: Photonics · doi:10.1088/2515-7647/ac1ef4 · Cited by 6 · see citing works

    “Exemplar demonstrations of such a heterogeneous PIC platform include high-power (>300 mW) low-noise lasers incorporating flip-chipped semiconductor optical amplifiers (figure 3(d)) [17], surface-bonded optical gain media (figure 3(c)) [18, 19], and low-loss surface-bonded thin-film lithium-niobate (TFLN) waveguides (f…”
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Authors
Heidelberger, C., Santis, C. T., Plant, J. J., Morissette, E. M., Kharas, D., Swint, R. B., Yariv, A., & Juodawlkis, P. W.
Affiliations
  • MIT Lincoln Laboratory (US)
  • California Institute of Technology (US)
Corresponding author
Heidelberger, Christopher
Venue
Conference on Lasers and Electro-Optics
Published
2021
Pages
STh2H.1
OpenAlex
W3194322916
Cited by
3
References
6
Citations by year
2022: 1 · 2021: 2
FWCI
1.18
Type
conference paper
Language
en
Open access
Locations
  • Conference on Lasers and Electro-Optics (publishedVersion)
  • CaltechAUTHORS (California Institute of Technology) (submittedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
  • Physical Sciences › Physics and Astronomy › Atomic and Molecular Physics, and Optics › Photonic Crystals and Applications
Keywords
InGaAsP/InP, silicon nitride photonic integrated circuits, 1.55 μm lasers, semiconductor lasers

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