The DOI matches its Crossref record.
Transmission electron microscopy of an ultrasonically consolidated copper–aluminum interface
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In the citing paper
“In another study, Sietins et al. [35,37] reported a very thin layer (less than 10 µm) of intermetallic phases at the interface of bonded materials.”
From Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture (2024) · cites this paper as [35]
In the citing paper
“However, based on the study of Sietins et al. [37,54] and some other studies [25,42], the thickness of intermetallic phases is very thin (less than 10 µm) and it might affect the hardness gradient.”
From Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture (2024) · cites this paper as [54]
Citations
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No references could be resolved yet.
Research works printed but not linked: 27
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Cited by
Sorted by citations
Interdiffusion of Elements During Ultrasonic Additive Manufacturing
Pagan, M., Petrie, C., Leonard, D., Sridharan, N., Zinkle, S., & Babu, S. S. (2021) · Metallurgical and Materials Transactions A · doi:10.1007/s11661-020-06131-2 · Cited by 23
Behvar, A., Shakil, S. I., Pirgazi, H., Norfolk, M., & Haghshenas, M. (2024) · The International Journal of Advanced Manufacturing Technology · doi:10.1007/s00170-024-13490-2 · Cited by 18
“Using transmission electron microscopy (TEM), Sietins et al. [35] identified the concentration profile and Al–Cu compounds for a Cu/Al LMC fabricated by UAM.”
Metadata
- Authors
- Sietins, J. M., Gillespie, J. W., & Advani, S. G.
- Affiliations
- University of Delaware (US)
- Corresponding author
- Gillespie, John W.
- Venue
- Journal of Materials Research
- Published
- 2014-07-28
- Volume
- 29
- Issue
- 17
- Pages
- 1970-1977
- ISSN
- 0884-1616 (ISSN-L)
- 0884-2914
- 2044-5326
- OpenAlex
- W2122917245
- Cited by
- 30
- References
- 0
- Citations by year
- 2026: 1 · 2025: 3 · 2024: 2 · 2023: 2 · 2022: 6 · 2021: 3 · 2020: 2 · 2019: 6 · 2018: 1 · 2017: 2 · 2016: 1 · 2015: 1
- FWCI
- 1.56
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Journal of materials research/Pratt's guide to venture capital sources (publishedVersion)
- Funders
- Army Research Laboratory
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
- Physical Sciences › Engineering › Mechanics of Materials › Ultrasonics and Acoustic Wave Propagation
- Keywords
- copper-aluminum interface, ultrasonic consolidation, interfacial bonding, dissimilar metal joining, interfacial microstructure
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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
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