The DOI matches its Crossref record; 4 of the 4 references it cites were found in a registry or an index.
Thermal properties of graphene: Fundamentals and applications
Open accessAbstract
Graphene is a two-dimensional (2D) material with over 100-fold anisotropy of heat flow between the in-plane and out-of-plane directions. High in-plane thermal conductivity is due to covalent sp ^2 bonding between carbon atoms, whereas out-of-plane heat flow is limited by weak van der Waals coupling. Herein, we review the thermal properties of graphene, including its specific heat and thermal conductivity (from diffusive to ballistic limits) and the influence of substrates, defects, and other atomic modifications. We also highlight practical applications in which the thermal properties of graphene play a role. For instance, graphene transistors and interconnects benefit from the high in-plane thermal conductivity, up to a certain channel length. However, weak thermal coupling with substrates implies that interfaces and contacts remain significant dissipation bottlenecks. Heat flow in graphene or graphene composites could also be tunable through a variety of means, including phonon scattering by substrates, edges, or interfaces. Ultimately, the unusual thermal properties of graphene stem from its 2D nature, forming a rich playground for new discoveries of heat-flow physics and potentially leading to novel thermal management applications.
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Cites
Thermal properties of graphene and nanostructured carbon materials
Balandin, A. A. (2011) · Nature Materials · doi:10.1038/nmat3064 · Cited by 6,244
Thermal Transport Measurements of Individual Multiwalled Nanotubes
Kim, P., Shi, L., Majumdar, A., & McEuen, P. L. (2001) · Physical Review Letters · doi:10.1103/physrevlett.87.215502 · Cited by 3,378
Two-Dimensional Phonon Transport in Supported Graphene
Seol, J. H., Jo, I., Moore, A. L., Lindsay, L., Aitken, Z. H., Pettes, M. T., Li, X., Yao, Z., Huang, R., Broido, D., et al. (2010) · Science · doi:10.1126/science.1184014 · Cited by 1,926
Thermal conduction in ultrathin pure and doped single-crystal silicon layers at high temperatures
Liu, W., & Asheghi, M. (2005) · Journal of Applied Physics · doi:10.1063/1.2149497 · Cited by 166
Cited by
Emerging challenges and materials for thermal management of electronics
Moore, A. L., & Shi, L. (2014) · Materials Today · doi:10.1016/j.mattod.2014.04.003 · Cited by 2,106
Graphene Plasmonics: Challenges and Opportunities
García de Abajo, F. J. (2014) · ACS Photonics · doi:10.1021/ph400147y · Cited by 1,254
Qiu, L., Zhu, N., Feng, Y., Michaelides, E. E., Żyła, G., Jing, D., Zhang, X., Norris, P. M., Markides, C. N., & Mahian, O. (2020) · Physics Reports · doi:10.1016/j.physrep.2019.12.001 · Cited by 523
Tribology of two-dimensional materials: From mechanisms to modulating strategies
Zhang, S., Ma, T., Erdemir, A., & Li, Q. (2019) · Materials Today · doi:10.1016/j.mattod.2018.12.002 · Cited by 407
Lian, G., Tuan, C.-C., Li, L., Jiao, S., Wang, Q., Moon, K.-S., Cui, D., & Wong, C.-P. (2016) · Chemistry of Materials · doi:10.1021/acs.chemmater.6b01595 · Cited by 382
Metadata
- Authors
- Pop, E., Varshney, V., & Roy, A. K.
- Venue
- MRS Bulletin
- Published
- 2012-11-23
- Volume
- 37
- Issue
- 12
- Pages
- 1273-1281
- ISSN
- 0883-7694 (ISSN-L)
- 1938-1425
- OpenAlex
- W2082215061
- Cited by
- 1,684
- References
- 4
- FWCI
- 30.12
- Type
- journal article
- Language
- en
- Open access
- green
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