The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.
A Review of SiC Power Module Packaging: Layout, Material System and Integration
Open accessAbstract
mAIn fIgure-of-merIt compArIsons for WBg And sI poWer semIconductorsSi GaAs 6H-SiC 4H-SiC GaN Diamond
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
Silicon carbide benefits and advantages for power electronics circuits and systems
Elasser, A., & Chow, T. P. (2002) · Proceedings of the IEEE · doi:10.1109/jproc.2002.1021562 · Cited by 537
Cited by
Electric Drive Technology Trends, Challenges, and Opportunities for Future Electric Vehicles
Husain, I., Ozpineci, B., Islam, M. S., Gurpinar, E., Su, G.-J., Yu, W., Chowdhury, S., Xue, L., Rahman, D., & Sahu, R. (2021) · Proceedings of the IEEE · doi:10.1109/jproc.2020.3046112 · Cited by 608
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
Lee, H., Smet, V., & Tummala, R. (2020) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2951801 · Cited by 526
A Survey of EMI Research in Power Electronics Systems With Wide-Bandgap Semiconductor Devices
Zhang, B., & Wang, S. (2020) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2953730 · Cited by 367
A Review of High-Speed GaN Power Modules: State of the Art, Challenges, and Solutions
Emon, A. I., Mustafeez-ul-Hassan, Mirza, A. B., Kaplun, J., Vala, S. S., & Luo, F. (2023) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2022.3232265 · Cited by 151
A New Complete Condition Monitoring Method for SiC Power MOSFETs
Ugur, E., Xu, C., Yang, F., Pu, S., & Akin, B. (2021) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2020.2970668 · Cited by 126
Metadata
- Authors
- Huazhong University of Science and Technology, & Chen, C.
- Venue
- CPSS Transactions on Power Electronics and Applications
- Publisher
- China Power Supply Society
- Published
- 2017-09
- Volume
- 2
- Issue
- 3
- Pages
- 170-186
- ISSN
- 2475-742X (ISSN-L)
- OpenAlex
- W2765994353
- Cited by
- 310
- References
- 1
- FWCI
- 7.50
- Type
- journal article
- Language
- en
- Open access
- diamond
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: A Review of SiC Power Module Packaging: Layout, Material System and Integration. https://app.cochat.ai/papers/10.24295/cpsstpea.2017.00017
- The paper
- Huazhong University of Science and Technology, & Chen, C. (2017). A Review of SiC Power Module Packaging: Layout, Material System and Integration. CPSS Transactions on Power Electronics and Applications. https://doi.org/10.24295/cpsstpea.2017.00017
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
