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Cited by 12Advanced Welding Techniques AnalysisMicrostructure and mechanical propertiesIntermetallics and Advanced Alloy Properties

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Formation of Intermetallic Compounds in Al–Cu Interface via Cold Roll Bonding: Review

Shajari, Y., Akbari, A., Seyedraoufi, Z. S., Porhonar, M., Bakhtiari, H., Razavi, S. H., Abdolmaleki, H., Khanzadeh, M. R.·2022·Surface Engineering and Applied Electrochemistry
DOI 10.3103/s1068375522010112
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Abstract

The composites consisting of similar or dissimilar metallic layers with different physical properties are vastly applicable. Among various methods for producing these composites, cold roll bonding (CRB) is considered to be more efficient and more cost-effective than other bonding processes. Nowadays, Al-Cu layer composite bonds are favorable in different industries due to their low price, well conductibility, high corrosion resistance, high deformation, and good electrical conduction. This review paper deals with the investigations of the Al-Cu cold rolling process, of the bonding mechanism of metallic layers during CRB, and of the effect of the roll bond strength parameters such as initial thickness, for one. Roll bonding has three levels: (1) physical touch; (2) activating surfaces in touch; (3) interaction between bonding metals. CRB is supposed to be an in-plane strain, and the normal stress distributed on the top and bottom rollers is homogeneous. Annealing before and after rolling, the direction and speed of rolling, the amount of thickness reduction, and the lubrication conditions on the Al–Cu bond through the roll bonding process were studied. The effect of different annealing conditions on the produced intermetallic compounds at the Al–Cu rolling bond interface and the growth of the intermetallic phases and their impact on the CRB parameters was examined. The thickness of intermetallic compounds, thickness reduction under the rolling process, the rolling speed, the a…

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Authors
Shajari, Y., Akbari, A., Seyedraoufi, Z. S., Porhonar, M., Bakhtiari, H., Razavi, S. H., Abdolmaleki, H., & Khanzadeh, M. R.
Affiliations
  • Materials and Energy Research Center (IR)
  • Islamic Azad University, Tehran (IR)
  • Islamic Azad University, Karaj (IR)
  • Iran University of Science and Technology (IR)
  • Islamic Azad University of Majlesi (IR)
Corresponding author
  • Shajari, Y.
  • Seyedraoufi, Z. S.
ORCID
Venue
Surface Engineering and Applied Electrochemistry
Publisher
Allerton Press
Published
2022-02
Volume
58
Issue
1
Pages
41-50
ISSN
  • 1068-3755 (ISSN-L)
  • 1934-8002
DOI
10.3103/s1068375522010112
OpenAlex
W4220833658
Cited by
12
References
0
Citations by year
2026: 5 · 2025: 2 · 2024: 3 · 2023: 2
FWCI
0.66
Type
journal article
Language
en
Open access
closed
Licence
Locations
Surface Engineering and Applied Electrochemistry (publishedVersion)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
  • Physical Sciences › Engineering › Mechanical Engineering › Intermetallics and Advanced Alloy Properties
Keywords
cold roll bonding, Al-Cu composites, intermetallic compounds, metal matrix composites, bonding mechanism, bond strength, annealing temperature, rolling speed, thickness reduction, interfacial reaction, Cu/Al interface

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