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Cited by 5Silicon Carbide Semiconductor TechnologiesMultilevel Inverters and ConvertersElectric Power Systems and Control

The DOI matches its Crossref record; 23 of the 24 references it cites were found in a registry or an index; none of the 15 sources its claims cite is checked for support yet.

Dynamic Paralleling Behaviors of High Power Trench and Fieldstop IGBTs

Open access
Wu, Yu, Sun, Yaojie, Lin, Yandan·2014·Journal of Power Electronics

Abstract

This paper demonstrates the dynamic behaviors of paralleled high power IGBTs using trench and fieldstop technologies. Four IGBTs are paralleled and standard deviation is adopted to represent the imbalance. Experiments are conducted under three different operation conditions and at different temperatures ranging from $-25^{\circ}C$ to $125^{\circ}C$ . The experimental results show that operation at very low and very high temperatures usually aggravates the switching behaviors. There is a trade-off between the balance and the losses at low temperatures. These results can help in the design of heat sinks in paralleling applications confronting very low temperatures.

Overview

CoChat Summary

TL;DR

This paper experimentally studies dynamic current-sharing behavior of four paralleled high-power trench/fieldstop IGBT modules across -25°C, 25°C, and 125°C under three operating conditions. It finds that 25°C generally gives the most balanced dynamic behavior, while very low and very high temperatures aggravate imbalance, with a trade-off between low-temperature switching losses and paralleling balance.

Key findings

  • Turn-on and turn-off di/dt imbalance, measured by standard deviation, is smallest at 25°C and rises at both lower and higher temperatures; the largest turn-on di/dt imbalance occurs at -25°C under each condition.
  • Turn-on loss E_on increases slightly at low temperature but more strongly above 25°C; SD E_on is smallest at 25°C and increases with higher output power, since condition A (357.5A/820V) is always higher than B (325A/600V), and B higher than C (35A/820V).
  • Turn-off E_off shows only a slight increase from -25°C to 25°C under conditions A and B, then a higher increase from 25°C to 125°C; SD E_off is highest at -25°C and rises linearly above 25°C, with temperature having a greater impact on E_off imbalance than output power level.
  • Reverse recovery current I_rec(max) increases linearly with temperature; SD I_rec(max) is smallest near 25°C, and at 125°C it is larger under each condition. High temperature also improves V_ce(max) balance, while condition B at 600V shows larger SD V_ce(max) than conditions A and C at 820V.

Methods

  • Four Infineon FF600R12ME4 half-bridge IGBT modules rated 1200V/600A, all with identical data codes, were paralleled and tested using a double-pulse test to extract turn-off behavior in the first pulse and turn-on behavior in the second pulse.
  • Three operating conditions were used: A = 357.5A per module, 820V DC bus; B = 325A per module, 600V DC bus; C = 35A per module, 820V DC bus. Each was tested at ambient temperatures of -25°C, 25°C, and 125°C.
  • Imbalance was quantified using standard deviation across four module average values, with each test repeated three times; dynamic parameters included di/dt, E_on, t_on, E_off, V_ce(max), t_f(off), and I_rec(max).

Limitations

  • The paper states that tests at high temperatures were only executed at 125°C, justified by prior research as sufficient to reflect a real trend.
  • The paper states that only dynamic behaviors are investigated, not static behavior, because dynamic behavior is more difficult to achieve in high-power applications.
  • Evident from the text: the study uses only four modules of a single device type and a limited set of operating conditions, so generalization to other IGBT technologies, module counts, or circuit layouts is not established.

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Integrity signals

Registry

Crossref · 10.6113/jpe.2014.14.4.788

Cites

23 of 23 references verified0 citation errors · 0 not checkable

Statistics

Nothing to recompute.

Verification

Claims the paper makes

34 Own interpretation · 31 Own result · 13 Sources not found · 3 No basis given · 1 Own method

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Self-check

Percentages, sums and reported differences re-computed from the paper’s own numbers.

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Citations

Cites

Research works printed but not linked: 1

  1. 2011, IEEE Trans. Power Electron., 26, 298

Cited by

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Metadata

Authors
Wu, Y., Sun, Y., & Lin, Y.
Affiliations
Fudan University (CN)
Venue
Journal of Power Electronics
Published
2014-07-20
Volume
14
Issue
4
Pages
788-795
ISSN
1598-2092 (ISSN-L)
OpenAlex
W2003368116
Cited by
5
References
24
Citations by year
2023: 1 · 2020: 2 · 2018: 1 · 2016: 1
FWCI
0.16
Type
journal article
Language
en
Open access
Locations
Journal of Power Electronics (publishedVersion)
Funders
  • National Natural Science Foundation of China (61374129)
  • Fudan University
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electric Power Systems and Control
Keywords
trench IGBT, dynamic balancing, switching behavior, temperature dependence, power losses, heat sinks

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Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

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