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Microstructural Evolution and Mechanical Properties of Intermetallics at the CuW/Al Interface with a Ni Interlayer

Wang, Chan, Liang, Shuhua, Cao, Fei·2019·Advanced Engineering Materials
DOI 10.1002/adem.201801273
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Abstract

In this work, the interface of a CuW/Al composite with and without a nickel (Ni) interlayer during solid‐state diffusion bonding is investigated. The effects of different intermetallic compounds (IMCs) forms at the interface on the microstructure and mechanical properties are analyzed. Electroless deposition of a Ni interlayer onto the surface of CuW effectively inhibits the formation of the Al 2 Cu phase and the thickness of the IMCs layer is greatly decreased. Meanwhile, the type of IMCs is changed, and the indentation hardness is slightly reduced. Compared with the CuW/Al composites without Ni interlayer, the CuW/Al composites with Ni interlayer provide a desirable ≈50% increase in the shear strength, which can reach 30 MPa at 550 °C. Additionally, the interface with Ni interlayer mainly consists of Al 3 Ni 2 and Al 3 Ni, and the first‐principles calculation shows that Al 3 Ni 2 exhibits a structural stability superior to Al 3 Ni. Experimental and calculation results consistently indicate that Al 3 Ni 2 forms first because of the low formation enthalpy.

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Metadata

Authors
Wang, C., Liang, S., & Cao, F.
Venue
Advanced Engineering Materials
Publisher
Wiley
Published
2019-03-22
Volume
21
Issue
7
ISSN
  • 1438-1656
  • 1527-2648
DOI
10.1002/adem.201801273
Cited by
9
Language
en
Licence
onlinelibrary.wiley.com/termsAndConditions#vor (vor)
Funders
  • National Natural Science Foundation of China (51631002, 51371139, 51834009)
  • Education Department of Shaanxi Province

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CoChat. (2026). Citation check: Microstructural Evolution and Mechanical Properties of Intermetallics at the CuW/Al Interface with a Ni Interlayer. https://app.cochat.ai/papers/10.1002/adem.201801273
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Wang, C., Liang, S., & Cao, F. (2019). Microstructural Evolution and Mechanical Properties of Intermetallics at the CuW/Al Interface with a Ni Interlayer. Advanced Engineering Materials. https://doi.org/10.1002/adem.201801273