Cited by 921Advanced Memory and Neural ComputingFerroelectric and Negative Capacitance DevicesPhase-change materials and chalcogenides

The DOI matches its Crossref record; 89 of the 89 references it cites were found in a registry or an index.

Electrochemical metallization memories—fundamentals, applications, prospects

Open access

Abstract

This review focuses on electrochemical metallization memory cells (ECM), highlighting their advantages as the next generation memories. In a brief introduction, the basic switching mechanism of ECM cells is described and the historical development is sketched. In a second part, the full spectra of materials and material combinations used for memory device prototypes and for dedicated studies are presented. In a third part, the specific thermodynamics and kinetics of nanosized electrochemical cells are described. The overlapping of the space charge layers is found to be most relevant for the cell properties at rest. The major factors determining the functionality of the ECM cells are the electrode reaction and the transport kinetics. Depending on electrode and/or electrolyte material electron transfer, electro-crystallization or slow diffusion under strong electric fields can be rate determining. In the fourth part, the major device characteristics of ECM cells are explained. Emphasis is placed on switching speed, forming and SET/RESET voltage, R(ON) to R(OFF) ratio, endurance and retention, and scaling potentials. In the last part, circuit design aspects of ECM arrays are discussed, including the pros and cons of active and passive arrays. In the case of passive arrays, the fundamental sneak path problem is described and as well as a possible solution by two anti-serial (complementary) interconnected resistive switches per cell. Furthermore, the prospects of ECM with regard to further scalability and the ability for multi-bit data storage are addressed.

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Registry

Crossref · 10.1088/0957-4484/22/25/254003

Cites

89 of 89 references verified0 citation errors · 0 not checkable

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  • This effect explains the observations in ECM devices that lower threshold voltages are typically required during programming processes compared with those for the initial forming process.

    “This effect explains the observations in ECM devices that lower threshold voltages are typically required during programming processes, compared with those for the initial forming process 22,27,28 .”

    From Observation of conducting filament growth in nanoscale resistive memories (2012) · cites this paper as [27]

    Section 3.3 (page unavailable) distinguishes the initial forming cycle from later switching cycles and suggests that forming may leave a nano-channel that aids subsequent filament growth. This supports the proposed mechanism, but the passage does not state that programming threshold voltages are typically lower than forming voltages. (LLM, conf=0.78)

    Experimental — accuracy not yet measured
  • In the case of high cation concentrations such as in solid electrolyte (e.g., chalcogenide)-based devices, the reduction of cations and the crystallization of filaments will require significant space expansion, and the reduction/crystallization process can become the rate-limiting process.

    “in the case of high cation concentrations such as in solid electrolyte (for example, chalcogenide)-based devices, the reduction of cations and the crystallization of filaments will require significant space expansion 27 , and the reduction/crystallization process can become the rate-limiting process.”

    From Observation of conducting filament growth in nanoscale resistive memories (2012) · cites this paper as [27]

    Split into 2 atoms — 1 confirmed, 1 partially supported, 0 disputed, 0 misattributed, 0 unverifiable. Expand the claim to see per-atom verdicts.

    Experimental — accuracy not yet measured
  • Filament growth is determined by three dynamic processes: anodic dissolution of the metal component at the active electrode; transport of the metal ions through the dielectrics; and reduction of metal ions and crystallization of conducting filaments.

    “In general, the filament growth is determined by three dynamic processes 27 : (i) the anodic dissolution of the metal component at the active electrode; (ii) the transport of the metal ions through the dielectrics; and (iii) the reduction of metal ions and the crystallization of conducting filaments.”
  • Filament formation involves oxidation, ion transport and reduction processes, all of which are thermodynamically driven and require overcoming specific activation energies.

    “Filament formation involves oxidation, ion transport and reduction processes, all of which are thermodynamically driven (5,18) and require overcoming specific activation energies.”
  • The results obtained with memristive devices based on cation migration inside a solid-state electrolyte can be generalized to other cation or anion based memristive systems.

    “but the results can be generalized to other cation (5) or anion (e.g. oxygen vacancy in oxides) (6) based memristive systems as well.”

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Citations

Cites

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Research works printed but not linked: 27

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  3. Kund M Beitel G Pinnow C-U Roehr T Schumann J Symanczyk R Ufert K-D Mueller G, 2005, IEDM Tech. Dig., 754
  4. Gopalan C Ma Y Gallo T Wang J Runnion E Saenz J Koushan F Hollmer S, 2010, Proc. IEEE Int. Memory Workshop, 50
  5. Tiedke S, 2010, Nanoelectronics Days 2010
  6. Kim S-W Nishi Y, 2007, Proc. Non-Volatile Memory Symp. (NVMTS), 75
  7. Sakamoto T Banno N Iguchi N Kawaura H Sunamura H Fujieda S Terabe K Hasegawa T Aono M, 2007, Symp. on VLSI Technology Dig. of Tech. Papers, 38
  8. Rahaman S Z Maikap S Chiu H C Lin C-H Wu T-Y Chen Y S Tzeng P-J Chen F Kao M-J Tsai M-J, 2009, Proc. IEEE Int. Memory Workshop, 21
  9. Symanczyk R, 2003, Proc. Non-Volatile Memory Technology Symp., 17
  10. Kozicki M N Gopalan C Balakrishnan M Park M Mitkova M, 2004, NVMTS: Proc. Non-Volatile Memory Technology Symp., 10
  11. Schindler C Meier M Waser R Kozicki M N, 2007, Proc. Non-Volatile Memory Symp., 81
  12. Yi J Kim S-W Nishi Y Hwang Y-T Chung S-W Hong S-J Park S-W, 2008, NVMTS: Proc. Non-Volatile Memory Technology Symp., 32
  13. Schindler C Meier M Waser R Kozicki M N, 2007, Proc. IEEE Non-Volatile Memory Technology Symp., 82
  14. Banno N Sakamoto T Fujieda S Aono M, 2008, Proc. Fourth Annual Int. Reliability Symp., 707
  15. Liu Q, 2010, Nano
  16. Sakamoto T Banno N Iguchi N Kawaura H Kaeriyama S Mizuno M Terabe K Hasegawa T Aono M, 2005, IEDM Tech. Dig., 475
  17. Swaroop B West W C Martinez G Kozicki M N Akers L A, 1998, Proc. 1998 IEEE Int. Symp. on Circuits and Systems, 33
  18. Wang W Gibby A Wang Z Chen T W Fujita S Griffin P Nishi Y Wong S, 2006, IEDM Tech. Dig., 11
  19. Baliga S R Thermadam S C P Kamalanathan D Allee D R Kozicki M N, 2007, Proc. Non-Volatile Memory Symp., 85
  20. Gopalan C, Solid State Electron.
  21. Abe K Tendulkar M P Jameson J R Griffin P B Nomura K Fujita S Nishi Y, 2008, ICICDT: Proc. Int. Conf. on IC Design and Technology, 203
  22. Kozicki M N Balakrishnan M Gopalan C Ratnakumar C Mitkova M, 2005, NVMTS: Proc. of Non-Volatile Memory Technology Symp., 83
  23. Balakrishnan M Kozicki M N Gopalan C Mitkova M, 2005, Device Research Conf. Digest, 47
  24. Stratan I, 2006, J. Optoelectron. Adv. Mater., 8, 2117
  25. Kamalanathan D Baliga S Thermadam S C P Kozicki M, 2007, Proc. Non-Volatile Memory Symp., 90
  26. Kuegeler C Nauenheim C Meier M Ruediger A Waser R, 2008, NVMTS: Proc. Non-Volatile Memory Technology Symp., 59
  27. Li Y, 2010, Appl. Phys. Lett., 31, 117

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Metadata

Authors
Valov, I., Waser, R., Jameson, J. R., & Kozicki, M. N.
Affiliations
  • Forschungszentrum Jülich (DE)
  • Arizona State University (US)
Venue
Nanotechnology
Published
2011-05-16
Volume
22
Issue
25
Pages
254003
ISSN
  • 0957-4484 (ISSN-L)
  • 1361-6528
OpenAlex
W1995363833
Cited by
921
References
89
Citations by year
2026: 38 · 2025: 31 · 2024: 52 · 2023: 53 · 2022: 60 · 2021: 70 · 2020: 72 · 2019: 64 · 2018: 72 · 2017: 78 · 2016: 78 · 2015: 75 · 2014: 64 · 2013: 64 · 2012: 41
FWCI
39.88
Type
journal article
Language
en
Open access
Locations
  • Nanotechnology (publishedVersion)
  • PubMed (publishedVersion)
  • CINECA IRIS Institutional Research Information System (University of Bari Aldo Moro) (submittedVersion)
  • JuSER (Forschungszentrum Jülich) (submittedVersion)
  • RWTH Publications (RWTH Aachen) (submittedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced Memory and Neural Computing
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Ferroelectric and Negative Capacitance Devices
  • Physical Sciences › Materials Science › Materials Chemistry › Phase-change materials and chalcogenides
Keywords
resistive switching, depletion region, electrode kinetics, switching speed, endurance and retention, sneak paths, multi-bit storage, memory scaling, non-volatile memory

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