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Cited by 294

The DOI matches its Crossref record; 109 of the 109 references it cites were found in a registry or an index.

Silicon‐Compatible Photodetectors: Trends to Monolithically Integrate Photosensors with Chip Technology

Yang, Wei, Chen, Jiaxin, Zhang, Yong, Zhang, Yujia, He, Jr‐Hau, Fang, Xiaosheng·2019·Advanced Functional Materials

Abstract

Encouraged by the increasing requirements of intelligent equipment, silicon integrated circuit–compatible photodetectors that support single‐chip photonic–electronic systems have gained considerable progresses. Advanced materials have resulted in enhanced device performance based on traditional photovoltaic effect and photoconductive effect, and novel device designs have catalyzed new working mechanisms combing rapid photoresponse and high responsivity gain. Surprising applications are developed using monolithic photonic–electronic platforms, and the developing integration strategies keep pace with the developing complementary metal‐oxide‐semiconductor techniques as well as nonsilicon substrates. Here, the recent developments in silicon‐compatible photodetectors, both in device advances and their integration routes, are reviewed. Meanwhile, the progresses, challenges, and possible future directions in this field are discussed and concluded.

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Crossref · 10.1002/adfm.201808182

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Metadata

Authors
Yang, W., Chen, J., Zhang, Y., Zhang, Y., He, J., & Fang, X.
Venue
Advanced Functional Materials
Publisher
Wiley
Published
2019-02-25
Volume
29
Issue
18
ISSN
  • 1616-301X (ISSN-L)
  • 1616-3028
OpenAlex
W2915398296
Cited by
294
References
109
FWCI
15.51
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Silicon‐Compatible Photodetectors: Trends to Monolithically Integrate Photosensors with Chip Technology. https://app.cochat.ai/papers/10.1002/adfm.201808182
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Yang, W., Chen, J., Zhang, Y., Zhang, Y., He, J., & Fang, X. (2019). Silicon‐Compatible Photodetectors: Trends to Monolithically Integrate Photosensors with Chip Technology. Advanced Functional Materials. https://doi.org/10.1002/adfm.201808182

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