The DOI matches its Crossref record; 4 of the 4 references it cites were found in a registry or an index.
Tough and Water‐Insensitive Self‐Healing Elastomer for Robust Electronic Skin
Abstract
An electronic (e‐) skin is expected to experience significant wear and tear over time. Therefore, self‐healing stretchable materials that are simultaneously soft and with high fracture energy, that is high tolerance of damage or small cracks without propagating, are essential requirements for the realization of robust e‐skin. However, previously reported elastomers and especially self‐healing polymers are mostly viscoelastic and lack high mechanical toughness. Here, a new class of polymeric material crosslinked through rationally designed multistrength hydrogen bonding interactions is reported. The resultant supramolecular network in polymer film realizes exceptional mechanical properties such as notch‐insensitive high stretchability (1200%), high toughness of 12 000 J m−2, and autonomous self‐healing even in artificial sweat. The tough self‐healing materials enable the wafer‐scale fabrication of robust and stretchable self‐healing e‐skin devices, which will provide new directions for future soft robotics and skin prosthetics.
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Kim, D.-H., Lu, N., Ma, R., Kim, Y.-S., Kim, R.-H., Wang, S., Wu, J., Won, S. M., Tao, H., Islam, A., et al. (2011) · Science · doi:10.1126/science.1206157 · Cited by 4,836
Self-citationAn ultra-lightweight design for imperceptible plastic electronics
Kaltenbrunner, M., Sekitani, T., Reeder, J., Yokota, T., Kuribara, K., Tokuhara, T., Drack, M., Schwödiauer, R., Graz, I., Bauer-Gogonea, S., et al. (2013) · Nature · doi:10.1038/nature12314 · Cited by 2,485
Stretchable silicon nanoribbon electronics for skin prosthesis
Kim, J., Lee, M., Shim, H. J., Ghaffari, R., Cho, H. R., Son, D., Jung, Y. H., Soh, M., Choi, C., Jung, S., et al. (2014) · Nature Communications · doi:10.1038/ncomms6747 · Cited by 1,435
Self-citationTough Stimuli-Responsive Supramolecular Hydrogels with Hydrogen-Bonding Network Junctions
Guo, M., Pitet, L. M., Wyss, H. M., Vos, M., Dankers, P. Y. W., & Meijer, E. W. (2014) · Journal of the American Chemical Society · doi:10.1021/ja500205v · Cited by 627
Cited by
Yang, J. C., Mun, J., Kwon, S. Y., Park, S., Bao, Z., & Park, S. (2019) · Advanced Materials · doi:10.1002/adma.201904765 · Cited by 1,641
Self-citationYe, Y., Zhang, Y., Chen, Y., Han, X., & Jiang, F. (2020) · Advanced Functional Materials · doi:10.1002/adfm.202003430 · Cited by 826
Kang, J., Tok, J. B.-H., & Bao, Z. (2019) · Nature Electronics · doi:10.1038/s41928-019-0235-0 · Cited by 706
Self-citationLi, Z., Zhu, Y., Niu, W., Yang, X., Jiang, Z., Lu, Z., Liu, X., & Sun, J. (2021) · Advanced Materials · doi:10.1002/adma.202101498 · Cited by 668
Song, Y., Liu, Y., Qi, T., & Li, G. L. (2018) · Angewandte Chemie International Edition · doi:10.1002/anie.201807622 · Cited by 646
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Metadata
- Authors
- Kang, J., Son, D., Wang, G. N., Liu, Y., Lopez, J., Kim, Y., Oh, J. Y., Katsumata, T., Mun, J., Lee, Y., Jin, L., Tok, J. B. ‐., & Bao, Z.
- Venue
- Advanced Materials
- Publisher
- Wiley
- Published
- 2018-02-09
- Volume
- 30
- Issue
- 13
- Pages
- e1706846-e1706846
- ISSN
- 0935-9648 (ISSN-L)
- 1521-4095
- OpenAlex
- W2791987429
- Cited by
- 1,124
- References
- 4
- FWCI
- 56.92
- Type
- journal article
- Language
- en
- Open access
- closed
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- Kang, J., Son, D., Wang, G. N., Liu, Y., Lopez, J., Kim, Y., Oh, J. Y., Katsumata, T., Mun, J., Lee, Y., Jin, L., Tok, J. B. ‐., & Bao, Z. (2018). Tough and Water‐Insensitive Self‐Healing Elastomer for Robust Electronic Skin. Advanced Materials. https://doi.org/10.1002/adma.201706846
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