The DOI matches its Crossref record; 4 of the 4 references it cites were found in a registry or an index.
Measuring Methods for the Investigation of In-Plane and Cross-Plane Thermal Conductivity of Thin Films
Abstract
The characterization of the thermal properties of thin film materials is important both for understanding of their structure and conduction mechanisms and for their technical applications. Thermal conductivity and diffusivity are crucial parameters for the design of integrated devices, thermal microsensors and actuators. Reliable system simulation and design optimization of such devices is based on the accurate determination of thermophysical properties. It is therefore highly desirable to acquire such data. Usually, thermal properties of thin films differ considerably from the bulk values, since the parasitic surface effects are much stronger due to the smaller dimensions and aspect ratios. The measurement of these properties is sophisticated and associated with various problems. We report on steady‐state and transient methods for the characterization of in‐plane and cross‐plane film properties by using microelectrothermal chips.
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In the laser flash method, sample holder heating can lead to significant error if not properly accounted for.
“Another criticism of the laser flash method is that the effect of sample holder heating could lead to significant error in the measurements if not accounted for properly [73].”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [73]
Citations
Cites
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Zhao, D., Qian, X., Gu, X., Jajja, S. A., & Yang, R. (2016) · Journal of Electronic Packaging · doi:10.1115/1.4034605 · Cited by 559
Metadata
- Authors
- Völklein, F., Reith, H., & Meier, A.
- Venue
- physica status solidi (a)
- Publisher
- Wiley
- Published
- 2012-12-17
- Volume
- 210
- Issue
- 1
- Pages
- 106-118
- ISSN
- 1862-6300
- 1862-6319
- Cited by
- 62
- References
- 4
- Language
- en
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