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A review of microstructure evolution during ultrasonic additive manufacturing
Open accessAbstract
Abstract Ultrasonic additive manufacturing (UAM) is a solid-state metal additive manufacturing process, with the combination of layer by layer ultrasonic seam welding and CNC machining. Due to the friction and deformation at the bonding interface, the ultrasonic softening effect and temperature generated, the microstructure of the substrate materials is evolving constantly. In this paper, in order to better understand the bonding mechanisms, the good practice and the capability of UAM, and the influence of different key process parameters on bonding quality, the microstructure evolution during UAM is reviewed in detail. Defects can be generated at the UAM bonding interface, but by choosing the right material combination and the right process parameters, defects can be reduced to minimum. Plastic deformation is very important for the bonding between layers during UAM, and plastic flow is important for redistribution of oxide layer, forming of mechanical interlocks, filling micro-valleys on the mating surface, and filling the gaps when embedding elements. UAM process can cause recrystallization and grain refinement at the welding interface and the intimate bulk materials around, and it will also gradually change the texture from rolling texture to shear texture. In the meantime, when further layers of materials are deposited on the top of the existing part, the microstructure will have some accumulative change. In order to reduce the defects number and increase the strength, sometimes, heat treatment needs to be carried out to the as-deposited parts, which will change the microstructure as well. Finally, the relevant research is summarised and the perspectives of further research are recommended.
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“During deposition, the substrate was preheated to 50 °C, as this has been demonstrated to improve plastic flow and adhesion [6,38].”
From Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture (2024) · cites this paper as [38]
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Cited by
Sorted by citations
Behvar, A., Shakil, S. I., Pirgazi, H., Norfolk, M., & Haghshenas, M. (2024) · The International Journal of Advanced Manufacturing Technology · doi:10.1007/s00170-024-13490-2 · Cited by 18
“During deposition, the substrate was preheated to 50 °C, as this has been demonstrated to improve plastic flow and adhesion [6, 38].”
Metadata
- Authors
- Li, D.
- Affiliations
- University of Warwick (GB)
- Corresponding author
- Li, Dezhi
- ORCID
- Li, Dezhi
- Venue
- The International Journal of Advanced Manufacturing Technology
- Published
- 2021-01-22
- Volume
- 113
- Issue
- 1-2
- Pages
- 1-19
- ISSN
- 0268-3768 (ISSN-L)
- 1433-3015
- OpenAlex
- W3124001430
- Cited by
- 77
- References
- 0
- Citations by year
- 2026: 12 · 2025: 22 · 2024: 20 · 2023: 8 · 2022: 12 · 2021: 3
- FWCI
- 4.60
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Locations
- The International Journal of Advanced Manufacturing Technology (publishedVersion, cc-by)
- Warwick Research Archive Portal (University of Warwick) (acceptedVersion)
- Funders
- Innovate UK
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Additive Manufacturing Materials and Processes
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
- Keywords
- ultrasonic additive manufacturing, microstructure evolution, bonding interface, plastic deformation, mechanical interlocking, recrystallization, grain refinement, texture changes, heat treatment, bonding defects, process parameters
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