Impact of active thermal management on power electronics design
Open accessAbstract
Power electronic system design is typically constrained by the thermal limitation so by the overall losses and the peak current. To stay within the maximum current, reached only during transients, the system is typically overrated. Active thermal management is used to control the maximum temperature and the temperature swing to reduce failures that are mostly caused by them. In this paper it is proposed to use the active thermal management to reduce the switching losses or to move them to less stressed devices, during transients, such as a module can reach an higher current, without violating thermal constraints, and the need of overdesign can be reduced. Hence an optimal and cost effective design of power electronics system is achieved.
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Cites
Grid Converters for Photovoltaic and Wind Power Systems
Teodorescu, R., Liserre, M., & Rodríguez, P. (2010) · Wiley eBooks · doi:10.1002/9780470667057 · Cited by 3,367 · see citing works
Self-citationTransitioning to Physics-of-Failure as a Reliability Driver in Power Electronics
Wang, H., Liserre, M., Blaabjerg, F., de Place Rimmen, P., Jacobsen, J. B., Kvisgaard, T., & Landkildehus, J. (2014) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2013.2290282 · Cited by 693 · see citing works
Self-citationActive thermal control of power electronic modules
Murdock, D. A., Torres, J. E. R., Connors, J. J., & Lorenz, R. D. (2006) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2005.863905 · Cited by 332 · see citing works
Optimal Control of Traction Motor Drives Under Electrothermal Constraints
Lemmens, J., Vanassche, P., & Driesen, J. (2014) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2014.2299765 · Cited by 158 · see citing works
Review of active thermal and lifetime control techniques for power electronic modules
Andresen, M., Liserre, M., & Buticchi, G. (2014) · 2014 16th European Conference on Power Electronics and Applications · doi:10.1109/epe.2014.6910822 · Cited by 81 · see citing works
Self-citationWeckert, M., & Roth‐Stielow, J. (2011) · European Conference on Power Electronics and Applications · Cited by 43 · see citing works
Robustness analysis of the efficiency in PV inverters
Pigazo, A., Liserre, M., Blaabjerg, F., & Kerekes, T. (2013) · Annual Conference of the IEEE Industrial Electronics Society (IECON) · doi:10.1109/iecon.2013.6700296 · Cited by 9 · see citing works
Self-citation
Flagged first, then by citations
Research works printed but not linked: 1
- Bartram M, Bloh J. Doubly-fed-machines in wind-turbine systems: is this application limiting the lifetime of IBTS-frequency-converters? In: IEEE Power Electron Special Conf 2004:2583-7.
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Liserre, M., Buticchi, G., Andresen, M., De Carne, G., Costa, L. F., & Zou, Z.-X. (2016) · IEEE Industrial Electronics Magazine · doi:10.1109/mie.2016.2551418 · Cited by 445 · see citing works
Self-citationA Review On Transient Thermal Management of Electronic Devices
Mathew, J. M., & Krishnan, S. (2021) · Journal of Electronic Packaging · doi:10.1115/1.4050002 · Cited by 196 · see citing works
Zheng, Q., Li, C., Rai, A., Leach, J. H., Broido, D. A., & Cahill, D. G. (2019) · Physical Review Materials · doi:10.1103/physrevmaterials.3.014601 · Cited by 177 · see citing works
A new design for hybrid cooling of Li-ion battery pack utilizing PCM and mini channel cold plates
Mousavi, S., Siavashi, M., & Zadehkabir, A. (2021) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2021.117398 · Cited by 177 · see citing works
Može, M., Senegačnik, M., Gregorčič, P., Hočevar, M., Zupančič, M., & Golobič, I. (2020) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.0c01594 · Cited by 148 · see citing works
Palko, J. W., Lee, H., Zhang, C., Dusseault, T. J., Maitra, T., Won, Y., Agonafer, D. D., Moss, J., Houshmand, F., Rong, G., et al. (2017) · Advanced Functional Materials · doi:10.1002/adfm.201703265 · Cited by 141 · see citing works
Intelligent Gate Drivers for Future Power Converters
Henn, J., Lüdecke, C., Laumen, M., Beushausen, S., Kalker, S., van der Broeck, C. H., Engelmann, G., & Doncker, R. W. D. (2021) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2021.3112337 · Cited by 105 · see citing works
Farhadi, M., Fard, M. T., Abapour, M., & Hagh, M. T. (2017) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2017.2683534 · Cited by 84 · see citing works
An additively manufactured manifold-microchannel heat sink for high-heat flux cooling
Kong, D., Jung, E., Kim, Y., Manepalli, V. V., Rah, K. J., Kim, H. S., Hong, Y., Choi, H. G., Agonafer, D. D., & Lee, H. (2023) · International Journal of Mechanical Sciences · doi:10.1016/j.ijmecsci.2023.108228 · Cited by 75 · see citing works
Thermal Stress Based Model Predictive Control of Electric Drives
Falck, J., Buticchi, G., & Liserre, M. (2017) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2017.2772198 · Cited by 74 · see citing works
Self-citationForced air cooled heat sink with uniformly distributed temperature of power electronic modules
Buennagel, C., Monir, S., Sharp, A., Anuchin, A., Durieux, O., Uria, I., & Vagapov, Y. (2021) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2021.117560 · Cited by 73 · see citing works
Review of Active Thermal Control for Power Electronics: Potentials, Limitations, and Future Trends
Ibrahim, A., Salem, M., Jamil, M. K. M., Outeiro, M. T., & Desa, M. K. M. (2024) · IEEE Open Journal of Power Electronics · doi:10.1109/ojpel.2024.3376086 · Cited by 65 · see citing works
Otaki, D., Nonaka, H., & Yamada, N. (2021) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2021.122263 · Cited by 59 · see citing works
Heat transfer performance and optimization of a close-loop R410A flash evaporation spray cooling
Lin, Y.-K., Zhou, Z., Fang, Y., Tang, H.-L., & Chen, B. (2019) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2019.113966 · Cited by 58 · see citing works
Wang, Y., Liu, P., Liu, D., Deng, F., & Chen, Z. (2020) · IEEE Transactions on Energy Conversion · doi:10.1109/tec.2020.3002670 · Cited by 48 · see citing works
Sun, B. N., & Li, J. (2024) · Energy Conversion and Management · doi:10.1016/j.enconman.2024.118293 · Cited by 45 · see citing works
Moisture thermal battery with autonomous water harvesting for passive electronics cooling
Zeng, J., Zhang, X., Chung, K. M., Feng, T., Zhang, H., Prasher, R., & Chen, R. (2023) · Cell Reports Physical Science · doi:10.1016/j.xcrp.2023.101250 · Cited by 43 · see citing works
Active thermal cycle reduction of power modules via gate resistance manipulation
van der Broeck, C. H., Ruppert, L. A., Lorenz, R. D., & Doncker, R. W. D. (2018) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2018.8341539 · Cited by 42 · see citing works
Experimental investigation on heat transfer characteristics of R1336mzz flash spray cooling
Zhang, Z., Li, Q., & Hu, D. (2020) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2020.115277 · Cited by 39 · see citing works
Farhadi, M., Abapour, M., & Sabahi, M. (2016) · Engineering Failure Analysis · doi:10.1016/j.engfailanal.2016.06.010 · Cited by 37 · see citing works
Dreiling, R., Zimmermann, S., Reibstirn, M., Nguyen-Xuan, T., Schreivogel, P., & di Mare, F. (2023) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2023.120338 · Cited by 36 · see citing works
Castro, R. P., da Silva, P. D., & Pires, L. C. (2024) · Applied Sciences · doi:10.3390/app14146158 · Cited by 39 · see citing works
A Review of Prognostics and Health Management for Power Semiconductor Modules
Degrenne, N., Ewanchuk, J., David, E., Boldyrjew-Mast, R., & Mollov, S. V. (2015) · Annual Conference of the PHM Society · doi:10.36001/phmconf.2015.v7i1.2763 · Cited by 35 · see citing works
Nor, A. K. M., Pedapati, S. R., & Muhammad, M. B. (2021) · Ain Shams Engineering Journal · doi:10.1016/j.asej.2021.02.015 · Cited by 35 · see citing works
Tuersun, Y., Lin, W., Huang, X., Qiu, W., Luo, P., Huang, M., & Chu, S. (2022) · Carbon · doi:10.1016/j.carbon.2022.03.053 · Cited by 35 · see citing works
Reliability of Power Semiconductor Modules: A State-of-the-Art Review
Agirrezabala, E., Aizpuru, I., Garrido, D., & Portillo, A. (2025) · IEEE Open Journal of Power Electronics · doi:10.1109/ojpel.2025.3576994 · Cited by 34 · see citing works
Palko, J. W., Lee, H., Agonafer, D. D., Zhang, C., Jung, K. W., Moss, J., Wilbur, J. D., Dusseault, T. J., Barako, M. T., Houshmand, F., et al. (2016) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.2016.7517728 · Cited by 33 · see citing works
Özkan, G., Hoang, P. H., Badr, P. R., Edrington, C. S., & Papari, B. (2021) · International Journal of Electrical Power & Energy Systems · doi:10.1016/j.ijepes.2021.107057 · Cited by 26 · see citing works
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
Paret, P. P., Finegan, D. P., & Narumanchi, S. V. J. (2022) · Journal of Electronic Packaging · doi:10.1115/1.4056306 · Cited by 24 · see citing works
Thermal-based finite control set model predictive control for IGBT power electronic converters
Falck, J., Andresen, M., & Liserre, M. (2016) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2016.7855513 · Cited by 24 · see citing works
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Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2023.3271251 · Cited by 24 · see citing works
“These includetheuseofhardwareredundancy[17],[18],activethermal control[19],[20],anddevicestateofhealthmonitoring[21], [22],[23].”
Review and analysis of thermal management for proton exchange membrane fuel cell hybrid power system
Zhang, X., Ma, X., Zhang, Z., Du, H., Wu, Z., Li, Z., & Shuai, S. (2025) · Renewable Energy · doi:10.1016/j.renene.2025.122716 · Cited by 21 · see citing works
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Torchio, R., Conte, F., Scarpa, M., Filippini, M., Pase, F., Toso, F., Nasab, P. S., Marson, E., Viroli, A., Posa, P., et al. (2025) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2025.3531695 · Cited by 20 · see citing works
Antonopoulos, A., D’Arco, S., Hernes, M., & Peftitsis, D. (2020) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2020.3004093 · Cited by 19 · see citing works
Ghaisas, G., & Krishnan, S. (2021) · Transactions of Indian National Academy of Engineering · doi:10.1007/s41403-021-00268-1 · Cited by 19 · see citing works
A Detailed Thermal Resistance Network Analysis of FCBGA Package
Dang, H., Lu, Y., Du, Y., Zhang, X., Zhang, Q., Ma, W., & Zhang, X. (2023) · Journal of Thermal Science · doi:10.1007/s11630-023-1903-y · Cited by 16 · see citing works
Adly, M., & Strunz, K. (2018) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2018.2873753 · Cited by 16 · see citing works
Laser Surface Engineering for Boiling Heat Transfer Applications
Zupančič, M., & Gregorčič, P. (2021) · Springer eBooks · doi:10.1007/978-3-030-59565-4_12 · Cited by 14 · see citing works
Zhang, J., Du, X., & Qian, C. (2021) · Applied Energy · doi:10.1016/j.apenergy.2021.116476 · Cited by 13 · see citing works
Batunlu, C., & Albarbar, A. (2015) · Electronics · doi:10.3390/electronics4040947 · Cited by 13 · see citing works
Unraveling interfacial thermal transport in β-Ga2O3/h-BN van der Waals heterostructures
So, S., & Lee, J. (2024) · Materials Today Physics · doi:10.1016/j.mtphys.2024.101506 · Cited by 11 · see citing works
Karakassides, A., Ganguly, A., Salmas, C. E., Sharma, P. K., & Papakonstantinou, P. (2023) · ACS Omega · doi:10.1021/acsomega.3c01951 · Cited by 10 · see citing works
Thermal Analysis of Power Rectifiers in Steady-State Conditions
Pleşca, A., & Mihet‐Popa, L. (2020) · Energies · doi:10.3390/en13081942 · Cited by 10 · see citing works
Ibrahim, A., & Sujod, M. Z. (2020) · IEEE Symposium on Industrial Electronics & Applications (ISIEA) · doi:10.1109/isiea49364.2020.9188096 · Cited by 9 · see citing works
Enhancing Lifetime of Power Electronic Modules via Thermal Buffers
Stippich, A., van der Broeck, C. H., & Doncker, R. W. D. (2020) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce44975.2020.9236041 · Cited by 9 · see citing works
Zero-ventilated self-cooled induction heating device: Topology and component engineering
Paul, A. K. (2022) · Power Electronic Devices and Components · doi:10.1016/j.pedc.2022.100013 · Cited by 9 · see citing works
Hatam-Lee, S. M., Gordiz, K., & Rajabpour, A. (2021) · Journal of Applied Physics · doi:10.1063/5.0055708 · Cited by 8 · see citing works
IGBT Thermal Stress Reduction Using Advance Control Strategy
Soulatiantork, P., Alghassi, A., Faifer, M., & Perinpanayagam, S. (2017) · Procedia CIRP · doi:10.1016/j.procir.2016.09.040 · Cited by 7 · see citing works
Strategy for enhancing reliability and lifetime of DC-AC inverters used for wind turbines
Batunlu, C., & Albarbar, A. (2018) · Microelectronics Reliability · doi:10.1016/j.microrel.2018.04.006 · Cited by 7 · see citing works
Yi, M., Qiu, Y., Wu, P., Sun, G., Zhu, W., & Wang, L. (2025) · Microelectronics Reliability · doi:10.1016/j.microrel.2025.115607 · Cited by 6 · see citing works
Lan, D., Li, G., Zeng, Q. H., Yi, G., Ding, S., Qiao, L., Gao, F., & Li, S. (2026) · Chip · doi:10.1016/j.chip.2025.100188 · Cited by 4 · see citing works
Lin, Y., Kwon, H., Chen, H., Gupta, M. P., Degner, M. W., Asheghi, M., Mantooth, H. A., & Goodson, K. E. (2024) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm55375.2024.10709623 · Cited by 4 · see citing works
He, W., Zhu, Y., Liu, Z., Ying, Z., & Zu, W. (2024) · Energies · doi:10.3390/en17133249 · Cited by 4 · see citing works
Temperature Gradient Improvement of Power Semiconductor Modules Cooled Using Forced Air Heat Sink
Sharp, A., Monir, S., Vagapov, Y., & Day, R. (2022) · International Symposium on Industrial Electronics and Applications (INDEL) · doi:10.1109/indel55690.2022.9965507 · Cited by 4 · see citing works
Sharp, A., Monir, S., Dumeril, V., Belloc, C., Akinsolu, M. O., & Vagapov, Y. (2026) · Case Studies in Thermal Engineering · doi:10.1016/j.csite.2026.107746 · Cited by 3 · see citing works
Numerical Investigation of Heat Transfer Enhancement Due to Flow Agitators Between Fins
Patki, A., & Krishnan, S. (2021) · Journal of Thermal Science and Engineering Applications · doi:10.1115/1.4051135 · Cited by 3 · see citing works
Fan, P., Huang, S., Wang, H., Luo, D., Li, H., & Sun, M. (2018) · Microelectronics Reliability · doi:10.1016/j.microrel.2018.07.036 · Cited by 3 · see citing works
Kwon, H., Park, J., Joo, S., Hong, S., & Mun, J. (2016) · Journal of Korean Powder Metallurgy Institute · doi:10.4150/kpmi.2016.23.3.195 · Cited by 3 · see citing works
Thermal Analysis of Power Electronics: Review
Albarbar, A., & Batunlu, C. (2017) · Springer eBooks · doi:10.1007/978-3-319-59828-4_2 · Cited by 3 · see citing works
Fan, P., Huang, S., Wang, H., Li, H., & Luo, D. (2018) · Microelectronics Reliability · doi:10.1016/j.microrel.2018.03.040 · Cited by 3 · see citing works
Multiphase Natural Convection Heat Sink for Information and Communications Technology Applications
Lesage, F. J., Aladji, M., & Eugenie, R. (2024) · Thermal Engineering · doi:10.1134/s0040601524700149 · Cited by 2 · see citing works
Modeling semiconductors and application to the losses of chopper and inverter type converters
Hanini, W., Rtibi, W., & Ayadi, M. (2020) · International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET) · doi:10.1109/iraset48871.2020.9092010 · Cited by 2 · see citing works
Nguyen, T. V., & Ha, X. V. (2021) · Intelligent systems reference library · doi:10.1007/978-3-030-57835-0_6 · Cited by 2 · see citing works
Piovesan, T., Sartori, H. C., Bender, V. C., & Pinheiro, J. R. (2021) · Eletrônica de Potência · doi:10.18618/rep.2021.1.0040 · Cited by 2 · see citing works
Enhanced thermal management of a 48 V powertrain for electric motorbikes
Miguel-Espinar, C., Heredero-Peris, D., & Montesinos‐Miracle, D. (2021) · European Conference on Power Electronics and Applications · doi:10.23919/epe21ecceeurope50061.2021.9570449
Ahmed, A. S., & Omar, R. G. (2024) · Journal of Engineering and Sustainable Development · doi:10.31272/jeasd.28.1.8
Performance and Sustainability Analysis of Power Distribution Systems with High Solar PV Integration
Alam, M. S., Hamadi, A., Afshar, S., & Arefifar, S. A. (2025) · International Symposium on Multidisciplinary Studies and Innovative Technologies (ISMSIT) · doi:10.1109/ismsit67332.2025.11267816
Agirrezabala, E., Cancho, A. P., Aizpuru, I., Garrido, D., Lajas, M., & Schmies, S. (2026) · IEEE Open Journal of Power Electronics · doi:10.1109/ojpel.2026.3666479
Enhancing Overload Capability of Electric Truck Inverters via Active Thermal Control
Agirrezabala, E., Pascal, Y., Debbadi, K., Liserre, M., Aizpuru, I., & Garrido, D. (2025) · IEEE Vehicle Power and Propulsion Conference (VPPC) · doi:10.1109/vppc66000.2025.11392945
Self-citationKim, J., Park, J., Son, J. S., & Jin, H. (2026) · SSRN Electronic Journal · doi:10.2139/ssrn.6668946
Zhuo, Y., Liang, D., Ou, J., Zhang, Y., Yu, G., Zhu, Z. Q., & Xu, D. (2026) · World Electric Vehicle Journal · doi:10.3390/wevj17090465
Ramesh, K. N., Sharma, T. K., & Rao, G. A. P. (2026) · International Communications in Heat and Mass Transfer · doi:10.1016/j.icheatmasstransfer.2026.112468
Blocking State-Enabled Induction Heating in Bipolar Transistors
Baca-Arroyo, R. (2026) · Electronics · doi:10.3390/electronics15174022
Kim, J., Park, J., Son, J. S., & Jin, H. (2026) · SSRN Electronic Journal · doi:10.2139/ssrn.7498805
- Authors
- Andresen, M., & Liserre, M.
- Affiliations
- Christian-Albrechts-Universität zu Kiel (DE)
- Corresponding author
- Andresen, M.
- ORCID
- Liserre, M.
- Venue
- Microelectronics Reliability
- Publisher
- Elsevier BV
- Published
- 2014-09
- Volume
- 54
- Issue
- 9-10
- Pages
- 1935-1939
- ISSN
- 0026-2714 (ISSN-L)
- OpenAlex
- W1987046761
- Cited by
- 74
- References
- 7
- Citations by year
- 2026: 8 · 2025: 6 · 2024: 8 · 2023: 6 · 2022: 4 · 2021: 15 · 2020: 8 · 2019: 2 · 2018: 5 · 2017: 5 · 2016: 5 · 2015: 2
- FWCI
- 2.13
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Licence
- Locations
- Microelectronics Reliability (publishedVersion, cc-by-nc-nd)
- MACAU: Open Access Repository of Kiel University (University Library Kiel) (submittedVersion)
- Multimedialen Archiv und Publikationsserver der Christian-Albrechts-Universität zu Kiel (Christian-Albrechts-Universität zu Kiel) (submittedVersion, other-oa)
- Funders
- European Commission (2007–2013, FP/2007-2013)/ERC, FP/2007/2013)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced DC-DC Converters
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Optimization
- Keywords
- active thermal control, power electronics design, switching losses, thermal constraints, transient current, temperature swing, power electronics reliability
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