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Cited by 369

The DOI matches its Crossref record; 130 of the 130 references it cites were found in a registry or an index.

Strain engineering in two-dimensional nanomaterials beyond graphene

Open access
Deng, Shikai, Sumant, Anirudha V., Berry, Vikas·2018·Nano Today

Abstract

Abstract Strain engineering is the process of tuning a material's properties by altering its mechanical or structural attributes. Atomically thin two-dimensional nanomaterials (2DNMs), which have been extensively studied in recent years, are particularly well-suited for strain engineering because they can withstand large strain. Thermal vibration, surface adhesion, substrate deformation, pre-stretched substrate, epitaxial grown, thermal expansion mismatch, substrate topography modification, pressurized blisters and tip indentation can lead to strain in 2DNMs. Strain in 2DNMs can modify their atomic structure, lattice vibration, thermal conductivity, electronic and optical, electrical and device performance, and chemical activities. This review focuses on the structural and mechanical properties of various 2DNMs, different experimental strategies to induce strain and modify properties, and applications of strained 2DNMs. Also, the review proposes prospective research areas for future strain engineering studies in 2DNMs.

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Crossref · 10.1016/j.nantod.2018.07.001

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Metadata

Authors
Deng, S., Sumant, A. V., & Berry, V.
Venue
Nano Today
Publisher
Elsevier BV
Published
2018-10
Volume
22
Pages
14-35
ISSN
1748-0132 (ISSN-L)
OpenAlex
W2885182639
Cited by
369
References
130
FWCI
12.65
Type
journal article
Language
en
Open access
bronze

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CoChat. (2026). Citation check: Strain engineering in two-dimensional nanomaterials beyond graphene. https://app.cochat.ai/papers/10.1016/j.nantod.2018.07.001
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Deng, S., Sumant, A. V., & Berry, V. (2018). Strain engineering in two-dimensional nanomaterials beyond graphene. Nano Today. https://doi.org/10.1016/j.nantod.2018.07.001

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

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