The DOI matches its Crossref record; 27 of the 27 references it cites were found in a registry or an index.
Smart Packaging: Opportunities and Challenges
Open accessAbstract
The global market for smart packaging is expected to reach $26.7bn by 2024. Smart packaging refers to packaging systems with embedded sensor technology used with foods, pharmaceuticals, and many other types of products. It is used to extend shelf life, monitor freshness, display information on quality, and improve product and customer safety. In addition, smart packaging offers new business opportunities based on digitization and thus fits into the broader realm of Industry 4.0. In this paper, the authors provide an introductory overview of smart packaging and discuss its underlying base technologies. This is followed by a presentation of potential benefits and emerging opportunities in the packaging sector, contrasted by a number of challenges that first have to be overcome for smart packaging to reach its full potential. Finally, conclusions are drawn and an outlook towards the future, critical research areas to work in, and potential lessons to be learned from associated areas are presented.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
The Internet of Things: A survey
Atzori, L., Iera, A., & Morabito, G. (2010) · Computer Networks · doi:10.1016/j.comnet.2010.05.010 · Cited by 15,613
Food waste within food supply chains: quantification and potential for change to 2050
Parfitt, J., Barthel, M., & Macnaughton, S. (2010) · Philosophical Transactions of the Royal Society B: Biological Sciences · doi:10.1098/rstb.2010.0126 · Cited by 3,197
Food packaging — Principles and practice
Smith, J. P. (1993) · Food Research International · doi:10.1016/0963-9969(93)90058-q · Cited by 999
Active Packaging Technologies with an Emphasis on Antimicrobial Packaging and its Applications
Suppakul, P., Miltz, J., Sonneveld, K., & Bigger, S. W. (2003) · Journal of Food Science · doi:10.1111/j.1365-2621.2003.tb05687.x · Cited by 882
Intelligent Packaging: Concepts and Applications
Yam, K. L., Takhistov, P. T., & Miltz, J. (2005) · Journal of Food Science · doi:10.1111/j.1365-2621.2005.tb09052.x · Cited by 858
Kerry, J. P., O’Grady, M. N., & Hogan, S. A. (2006) · Meat Science · doi:10.1016/j.meatsci.2006.04.024 · Cited by 855
Active and intelligent packaging systems for a modern society
Realini, C. E., & Marcos, B. (2014) · Meat Science · doi:10.1016/j.meatsci.2014.06.031 · Cited by 693
Intelligent food packaging: the next generation
Vanderroost, M., Ragaert, P., Devlieghere, F., & De Meulenaer, B. (2014) · Trends in Food Science & Technology · doi:10.1016/j.tifs.2014.06.009 · Cited by 668
An overview of the intelligent packaging technologies in the food sector
Ghaani, M., Cozzolino, C. A., Castelli, G., & Farris, S. (2016) · Trends in Food Science & Technology · doi:10.1016/j.tifs.2016.02.008 · Cited by 664
Industrial Big Data as a Result of IoT Adoption in Manufacturing
Mourtzis, D., Vlachou, E., & Milas, N. (2016) · Procedia CIRP · doi:10.1016/j.procir.2016.07.038 · Cited by 452
Cited by
A comprehensive review on metallic implant biomaterials and their subtractive manufacturing
Davis, R., Singh, A., Jackson, M. J., Coelho, R. T., Prakash, D., Charalambous, C. P., Ahmed, W., da Silva, L. R. R., & Lawrence, A. A. (2022) · The International Journal of Advanced Manufacturing Technology · doi:10.1007/s00170-022-08770-8 · Cited by 380
Metadata
- Authors
- Schaefer, D., & Cheung, W. M.
- Venue
- Procedia CIRP
- Publisher
- Elsevier BV
- Published
- 2018
- Volume
- 72
- Pages
- 1022-1027
- ISSN
- 2212-8271 (ISSN-L)
- OpenAlex
- W2810248371
- Cited by
- 365
- References
- 27
- FWCI
- 17.68
- Type
- journal article
- Language
- en
- Open access
- diamond
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Smart Packaging: Opportunities and Challenges. https://app.cochat.ai/papers/10.1016/j.procir.2018.03.240
- The paper
- Schaefer, D., & Cheung, W. M. (2018). Smart Packaging: Opportunities and Challenges. Procedia CIRP. https://doi.org/10.1016/j.procir.2018.03.240
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.