Cited by 2Mesoporous Materials and CatalysisSemiconductor materials and devicesCopper Interconnects and Reliability

The DOI matches its Crossref record; 14 of the 14 references it cites were found in a registry or an index.

Improvement of electrical properties of surfactant-templated mesoporous silica thin films by plasma treatment

Jung, Sang-Bae, Park, Hyung-Ho·2006·Thin Solid Films

Overview

Integrity signals

Registry

Crossref · 10.1016/j.tsf.2005.08.082

Cites

14 of 14 references verified0 citation errors · 0 not checkable

Statistics

Recomputing p-values needs the paper’s full text.

Verification

Claims the paper makes

We couldn’t retrieve this paper’s full text, so its claims and self-check weren’t run. The registry and citation checks still apply.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

  • Highly polarizable species are responsible for the observed loss of electrical characteristics, such as leakage current density and dielectric constant.

    “The highly polarizable species described were shown to be responsible for the observed loss of electrical characteristics, such as leakage current density and dielectric constant [83,84].”

Citations

Cites

Flagged first, then by citations

Research works printed but not linked: 1

  1. Chiang, 1999, Solid State Technol., 10, 42

Cited by

Sorted by citations

Metadata

Authors
Jung, S.-B., & Park, H.-H.
Affiliations
Yonsei University (KR)
Corresponding author
Park, Hyung-Ho
Venue
Thin Solid Films
Publisher
Elsevier BV
Published
2006-05
Volume
506-507
Pages
360-363
ISSN
0040-6090 (ISSN-L)
OpenAlex
W2003814914
Cited by
2
References
14
Citations by year
2025: 1
FWCI
0.20
Type
journal article
Language
en
Open access
closed
Locations
Thin Solid Films (publishedVersion)
Topics
  • Physical Sciences › Materials Science › Materials Chemistry › Mesoporous Materials and Catalysis
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
  • Physical Sciences › Materials Science › Electronic, Optical and Magnetic Materials › Copper Interconnects and Reliability
Keywords
mesoporous silica films, surfactant templating, plasma treatment, low-k dielectrics, electrical properties, current density, pore ordering, ion bombardment, hydrogen plasma, oxygen plasma, argon plasma, structural defects

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

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