The DOI matches its Crossref record; 7 of the 7 references it cites were found in a registry or an index.
Residual stress analysis of SiO2 films deposited by plasma-enhanced chemical vapor deposition
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PECVD SiO2 has intrinsic stress highly dependent on the choice of precursor, RF power, substrate temperature, and gas flow rate.
“One such example is SiO2 obtained through PECVD, which has an intrinsic stress highly dependent on the choice of precursor, RF power, substrate temperature, and gas flow rate [154].”
From Metal Oxide Thin Films for Advanced Photonic Applications (2026) · cites this paper as [154]
Citations
Cites
Characterization of Plasma‐Deposited Silicon Dioxide
Adams, A. C., Alexander, F. B., Capio, C. D., & Smith, T. E. (1981) · Journal of The Electrochemical Society · doi:10.1149/1.2127680 · Cited by 144
Deposition of Plasma Silicon Oxide Thin Films in a Production Planar Reactor
Hollahan, J. R. (1979) · Journal of The Electrochemical Society · doi:10.1149/1.2129196 · Cited by 48
DeCrosta, D. A., Hackenberg, J., & Linn, J. H. (1996) · Journal of The Electrochemical Society · doi:10.1149/1.1836586 · Cited by 36
Dynamics of deep level trapping in space charge regions
Jonscher, A. K. (1990) · Solid-State Electronics · doi:10.1016/0038-1101(90)90019-b · Cited by 31
Stability of plasma-deposited SiO2 films evaluated using stress and IR measurements
GOKAN, H., Morimoto, A., & Murahata, M. (1987) · Thin Solid Films · doi:10.1016/0040-6090(87)90251-3 · Cited by 22
Carlson, A. C., Wu, T. H. T., & Liang, H. K. (1993) · Journal of The Electrochemical Society · doi:10.1149/1.2056157 · Cited by 7
Secondary Scars Above the Nipple
Weiss, H. A. (1983) · Annals of Plastic Surgery · doi:10.1097/00000637-198307000-00020 · Cited by 2
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Research works printed but not linked: 1
- J.J. Hsieh, D.E. Ibbotson, J.A. Mucha, D.L. Flamm, VMIC Conference, 411 (1989).
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Corrosion protection and mechanical performance of SiO2 films deposited via PECVD on OT59 brass
Moretti, G., Guidi, F., Canton, R., Battagliarin, M., & Rossetto, G. (2005) · Anti-Corrosion Methods and Materials · doi:10.1108/00035590510615758 · Cited by 15
Low-Temperature Plasma-Enhanced Atomic Layer Deposition of SiO2 Using Carbon Dioxide
Zhu, Z., Sippola, P., Ylivaara, O. M. E., Modanese, C., Sabatino, M. D., Mizohata, K., Merdes, S., Lipsanen, H. K., & Savin, H. I. (2019) · Nanoscale Research Letters · doi:10.1186/s11671-019-2889-y · Cited by 13
Tuning the shape and curvature of micromachined cantilevers using multiple plasma treatments
Su, W.-S., Lee, S.-T., Lin, C.-Y., Tsai, M.-S., Yip, M., & Fang, W. (2005) · Sensors and Actuators A Physical · doi:10.1016/j.sna.2005.11.010 · Cited by 8
Deposition and characterization of Si-rich silicon oxide films using HMDS for integrated photonics
Tomar, V. K., & Gautam, D. K. (2007) · Materials Science in Semiconductor Processing · doi:10.1016/j.mssp.2007.11.005 · Cited by 7
Thin film stress measurement by fiber optic strain gage
Quintero, S. M. M., Quirino, W. G., Triques, A. L. C., Valente, L. C. G., Braga, A. M. B., Achete, C. A., & Cremona, M. (2005) · Thin Solid Films · doi:10.1016/j.tsf.2005.08.215 · Cited by 7
Tuning the Mechanical Properties of SiO2 Thin Film for MEMS Application
Su, W.-S., Fang, W., & Tsai, M.-S. (2003) · MRS Proceedings · doi:10.1557/proc-795-u8.25 · Cited by 4
Study of Birefringence and Stress Distribution of SiO2 Film Optical Waveguide on Silicon Wafer
Sun, Q., Sun, D., Shang, H., Yu, T., Chang, L., Sun, Z., Xing, W., & Dong, M. (2019) · Coatings · doi:10.3390/coatings9050316 · Cited by 4
Su, W.-S., Huang, H.-Y., & Fang, W. (2008) · Japanese Journal of Applied Physics · doi:10.1143/jjap.47.5242 · Cited by 3
Fabrication of electro-thermally driven tunable plate with Au/SiO2 bimorph beams
Minhas, A., Kumar, A., Bansal, D., Mehta, K., Bajpai, A., Kumar, P., & Rangra, K. (2018) · Microsystem Technologies · doi:10.1007/s00542-018-4209-3 · Cited by 3
Metal Oxide Thin Films for Advanced Photonic Applications
Stîngescu, M.-L., Șopronyi, M.-A., Antohe, Ș., & Scărișoreanu, N.-D. (2026) · Crystals · doi:10.3390/cryst16030164 · Cited by 2
Li, H., Zhang, S., Wang, Y., & Lv, G. (2026) · IEEE Access · doi:10.1109/access.2026.3659345
Metadata
- Authors
- Choi, J.-K., Lee, J., Yoo, J.-B., Maeng, J.-S., & Kim, Y.-M.
- Affiliations
- Sungkyunkwan University (KR)
- Corresponding author
- Choi, Jin-Kyung
- ORCID
- Yoo, Ji-Beom
- Venue
- Surface and Coatings Technology
- Publisher
- Elsevier BV
- Published
- 2000-09
- Volume
- 131
- Issue
- 1-3
- Pages
- 153-157
- ISSN
- 0257-8972 (ISSN-L)
- OpenAlex
- W1983265996
- Cited by
- 10
- References
- 7
- Citations by year
- 2026: 1 · 2019: 2 · 2018: 1
- FWCI
- 0.43
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Surface and Coatings Technology (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
- Physical Sciences › Engineering › Mechanics of Materials › Metal and Thin Film Mechanics
- Physical Sciences › Materials Science › Electronic, Optical and Magnetic Materials › Copper Interconnects and Reliability
- Keywords
- residual stress, SiO2 thin films, silica, plasma-enhanced chemical vapor deposition, HMDS, silane, RF power, growth temperature, deposition parameters
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