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Cited by 294

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An Ultraviolet-Curable Mold for Sub-100-nm Lithography

Choi, Se-Jin, Yoo, Pil J., Baek, Seung J., Kim, Tae W., Lee, Hong H.·2004·Journal of the American Chemical Society

Abstract

We describe a novel UV-curable mold that is stiff enough for replicating dense sub-100-nm features even with a high aspect ratio. It also allows for flexibility when the mold is prepared on a flexible support such that large area replication can be accomplished. The composite material of the mold is inert to chemicals and solvents. The surface energy is made low with a small amount of releasing agent such that the mold can be removed easily and cleanly after patterning. In addition, the material allows self-replication of the mold. These unique features of the mold material should make the mold quite useful for various patterning purposes.

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Metadata

Authors
Choi, S.-J., Yoo, P. J., Baek, S. J., Kim, T. W., & Lee, H. H.
Venue
Journal of the American Chemical Society
Published
2004-06-01
Volume
126
Issue
25
Pages
7744-7745
ISSN
  • 0002-7863 (ISSN-L)
  • 1520-5126
OpenAlex
W1976988389
Cited by
294
References
0
FWCI
13.12
Type
journal article
Language
en
Open access
closed

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Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.