The DOI matches its Crossref record; 4 of the 4 references it cites were found in a registry or an index.
Heat Conduction across Monolayer and Few-Layer Graphenes
Open accessAbstract
We report the thermal conductance G of Au/Ti/graphene/SiO(2) interfaces (graphene layers 1 ≤ n ≤ 10) typical of graphene transistor contacts. We find G ≈ 25 MW m(-2) K(-1) at room temperature, four times smaller than the thermal conductance of a Au/Ti/SiO(2) interface, even when n = 1. We attribute this reduction to the thermal resistance of Au/Ti/graphene and graphene/SiO(2) interfaces acting in series. The temperature dependence of G from 50 ≤ T ≤ 500 K also indicates that heat is predominantly carried by phonons through these interfaces. Our findings suggest that metal contacts can limit not only electrical transport but also thermal dissipation from submicrometer graphene devices.
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Cites
Superior Thermal Conductivity of Single-Layer Graphene
Balandin, A. A., Ghosh, S., Bao, W., Calizo, I., Teweldebrhan, D., Miao, F., & Lau, C. N. (2008) · Nano Letters · doi:10.1021/nl0731872 · Cited by 13,823
Two-Dimensional Phonon Transport in Supported Graphene
Seol, J. H., Jo, I., Moore, A. L., Lindsay, L., Aitken, Z. H., Pettes, M. T., Li, X., Yao, Z., Huang, R., Broido, D., et al. (2010) · Science · doi:10.1126/science.1184014 · Cited by 1,926
Thermal conductance of epitaxial interfaces
Costescu, R. M., Wall, M. A., & Cahill, D. G. (2003) · Physical Review B · doi:10.1103/physrevb.67.054302 · Cited by 486
Self-citationThermal conductance of metal-metal interfaces
Gundrum, B. C., Cahill, D. G., & Averback, R. S. (2005) · Physical Review B · doi:10.1103/physrevb.72.245426 · Cited by 417
Self-citation
Cited by
Thermal properties of graphene and nanostructured carbon materials
Balandin, A. A. (2011) · Nature Materials · doi:10.1038/nmat3064 · Cited by 6,244
Progress, Challenges, and Opportunities in Two-Dimensional Materials Beyond Graphene
Butler, S. Z., Hollen, S. M., Cao, L., Cui, Y., Gupta, J. A., Gutiérrez, H. R., Heinz, T. F., Hong, S. S., Huang, J., Ismach, A. F., et al. (2013) · ACS Nano · doi:10.1021/nn400280c · Cited by 4,878
Emerging challenges and materials for thermal management of electronics
Moore, A. L., & Shi, L. (2014) · Materials Today · doi:10.1016/j.mattod.2014.04.003 · Cited by 2,106
Thermal Conductivity and Phonon Transport in Suspended Few-Layer Hexagonal Boron Nitride
Jo, I., Pettes, M. T., Kim, J., Watanabe, K., Taniguchi, T., Yao, Z., & Shi, L. (2013) · Nano Letters · doi:10.1021/nl304060g · Cited by 770
Jiang, P., Qian, X., & Yang, R. (2018) · Journal of Applied Physics · doi:10.1063/1.5046944 · Cited by 424
Metadata
- Authors
- Koh, Y. K., Bae, M.-H., Cahill, D. G., & Pop, E.
- Venue
- Nano Letters
- Publisher
- American Chemical Society (ACS)
- Published
- 2010-10-05
- Volume
- 10
- Issue
- 11
- Pages
- 4363-4368
- ISSN
- 1530-6984 (ISSN-L)
- 1530-6992
- OpenAlex
- W2035979687
- Cited by
- 355
- References
- 4
- FWCI
- 10.19
- Type
- journal article
- Language
- en
- Open access
- green
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