Thermal conductance of metal-metal interfaces
Abstract
The thermal conductance of interfaces between Al and Cu is measured in the temperature range $78<T<298\phantom{\rule{0.3em}{0ex}}\mathrm{K}$ using time-domain thermoreflectance. The samples are prepared by magnetron sputter deposition of a $100\phantom{\rule{0.3em}{0ex}}\mathrm{nm}$ thick film of Al on top of layers of Cu on sapphire substrates. The chemical abruptness of the Al-Cu interface is systematically varied by ion-beam mixing using $1\phantom{\rule{0.3em}{0ex}}\mathrm{MeV}$ Kr ions. The thermal conductance of the as-deposited Al-Cu interface is $4\phantom{\rule{0.3em}{0ex}}\mathrm{GW}\phantom{\rule{0.2em}{0ex}}{\mathrm{m}}^{\ensuremath{-}2}\phantom{\rule{0.2em}{0ex}}{\mathrm{K}}^{\ensuremath{-}1}$ at room temperature, an order-of-magnitude larger than the phonon-mediated thermal conductance of typical metal-dielectric interfaces. The magnitude and the linear temperature dependence of the conductance are described well by a diffuse-mismatch model for electron transport at interfaces.
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TDTR has been frequently used to measure the heat capacity of new materials and the thermal conductance of various solid/solid interfaces.
“The heat capacity of new materials 38, 39 and thermal conductance of various solid/solid interfaces 40-47 have also been frequently measured using TDTR.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [40]
TDTR is often used to measure the through-plane thermal conductivity Kz of the sample and the transducer/sample interface conductance G without much elaboration.
“Therefore, TDTR is often used to measure the through-plane thermal conductivity Kz of the sample and the transducer/sample interface conductance G without much elaboration.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [40]
The highest thermal conductance observed to date is for metal/metal interfaces, such as Al/Cu, with a G of about 3700 MW m-2 K-1 at room temperature.
“while the highest thermal conductance observed to-date is for metal/metal interfaces, such as Al/Cu, with a G of ~3700 MW m -2 K -1 at room temperature. 40”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [40]
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- Authors
- Gundrum, B. C., Cahill, D. G., & Averback, R. S.
- Affiliations
- University of Illinois Urbana-Champaign (US)
- Venue
- Physical Review B
- Publisher
- American Physical Society (APS)
- Published
- 2005-12-30
- Volume
- 72
- Issue
- 24
- ISSN
- 1098-0121 (ISSN-L)
- 1550-235X
- OpenAlex
- W2053027007
- Cited by
- 417
- References
- 31
- Citations by year
- 2026: 15 · 2025: 28 · 2024: 22 · 2023: 19 · 2022: 30 · 2021: 26 · 2020: 31 · 2019: 34 · 2018: 27 · 2017: 26 · 2016: 17 · 2015: 28 · 2014: 18 · 2013: 18 · 2012: 17
- FWCI
- 2.85
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Physical Review B (publishedVersion)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Physical Sciences › Engineering › Civil and Structural Engineering › Thermal Radiation and Cooling Technologies
- Keywords
- thermal conductance, metal-metal interfaces, Cu/Al interface, time-domain thermoreflectance, ion beam mixing, diffuse mismatch model, low-temperature thermal transport, metal-dielectric interface, sapphire substrate
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