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Imprint of sub-25 nm vias and trenches in polymers
Abstract
A nanoimprint process that presses a mold into a thin thermoplastic polymer film on a substrate to create vias and trenches with a minimum size of 25 nm and a depth of 100 nm in the polymer has been demonstrated. Furthermore, the imprint process has been used as a lithography process to fabricate sub-25 nm diameter metal dot arrays of a 100 nm period in a lift-off process. It was found that the nanostructures imprinted in the polymers conform completely with the geometry of the mold. At present, the imprinted size is limited by the size of the mold being used; with a suitable mold, the imprint process should mold sub-10 nm structures with a high aspect ratio in polymers. The nanoimprint process offers a low cost method for mass producing sub-25 nm structures and has the potential to become a key nanolithography method for future manufacturing of integrated circuits and integrated optics.
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Citations
Cited by
Review on micro molding of thermoplastic polymers
Heckele, M., & Schomburg, W. K. (2004) · Journal of Micromechanics and Microengineering · doi:10.1088/0960-1317/14/3/r01 · Cited by 915
Memristor−CMOS Hybrid Integrated Circuits for Reconfigurable Logic
Xia, Q., Robinett, W., Cumbie, M. W., Banerjee, N., Cardinali, T. J., Yang, J. J., Wu, W., Li, X., Tong, W. M., Strukov, D. B., et al. (2009) · Nano Letters · doi:10.1021/nl901874j · Cited by 671
Self-organization of nanostructures in semiconductor heteroepitaxy
Teichert, C. (2002) · Physics Reports · doi:10.1016/s0370-1573(02)00009-1 · Cited by 462
Progress and prospects for ultrathin solar cells
Massiot, I., Cattoni, A., & Collin, S. (2020) · Nature Energy · doi:10.1038/s41560-020-00714-4 · Cited by 322
Roller nanoimprint lithography
Tan, H., Gilbertson, A., & Chou, S. Y. (1998) · Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena · doi:10.1116/1.590438 · Cited by 317
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Metadata
- Authors
- Chou, S. Y., Krauss, P. R., & Renstrom, P. J.
- Venue
- Applied Physics Letters
- Publisher
- AIP Publishing
- Published
- 1995-11-20
- Volume
- 67
- Issue
- 21
- Pages
- 3114-3116
- ISSN
- 0003-6951 (ISSN-L)
- 1077-3118
- OpenAlex
- W2062074587
- Cited by
- 2,706
- References
- 0
- FWCI
- 11.94
- Type
- journal article
- Language
- en
- Open access
- closed
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- Chou, S. Y., Krauss, P. R., & Renstrom, P. J. (1995). Imprint of sub-25 nm vias and trenches in polymers. Applied Physics Letters. https://doi.org/10.1063/1.114851
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
