The DOI matches its Crossref record; 7 of the 7 references it cites were found in a registry or an index.
Charge trapping properties of the HfO2 layer with various thicknesses for charge trap flash memory applications
Abstract
MHOS (metal-HfO2–SiO2–Si) structure capacitors were fabricated to investigate the charge trapping properties of HfO2 layer with various thicknesses for the applications of charge trap flash (CTF) memory devices. Also, the centroid of charge trap in HfO2 layer was extracted by constant current stress method and compared with that of conventional Si3N4 layer. The gate leakage current of MHOS capacitor due to tunneling was significantly reduced by stacking the HfO2 trap layer on thin SiO2 tunnel layer. The MHOS capacitors showed a larger memory window than the MNOS (metal-Si3N4–SiO2–Si) capacitors at the same trap layer thickness, because the HfO2 layer has better charge trapping efficiency than the Si3N4 layer. It is found that ultrathin HfO2 trap layer with a thickness of 2 nm stored almost the same charges with Si3N4 layer with a thickness of 7 nm. Consequently, the application of ultrathin HfO2 to charge storage layer can considerably improve the performance and enhance the high density of CTF memory.
Overview
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“The CTM mechanism is identical to the charge‐trap flash (CTF) memory, in which reversible charge trapping and de‐trapping to the charge trap layer alter the threshold voltage of the transistor.[ 14 , 15 , 16 ]”
From Retention Secured Nonlinear and Self-Rectifying Analog Charge Trap Memristor for Energy-Efficient Neuromorphic Hardware (2023) · cites this paper as [16]
Citations
Cites
Review on high-k dielectrics reliability issues
Ribes, G., Mitard, J., Denais, M., Bruyere, S., Monsieur, F., Parthasarathy, C., Vincent, E., & Ghibaudo, G. (2005) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2005.845236 · Cited by 533
Design considerations in scaled SONOS nonvolatile memory devices
Bu, J., & White, M. H. (2001) · Solid-State Electronics · doi:10.1016/s0038-1101(00)00232-x · Cited by 157
Maikap, S., Lee, H. Y., Wang, T.-Y., Tzeng, P.-J., Wang, C. C., Lee, L. S., Liu, K. C., Yang, J.-R., & Tsai, M.-J. (2007) · Semiconductor Science and Technology · doi:10.1088/0268-1242/22/8/010 · Cited by 140
Characterization of charge trapping and high-field endurance for 15-nm thermally nitrided oxides
Liu, Z. H., Lai, P. T., & Cheng, Y. (1991) · IEEE Transactions on Electron Devices · doi:10.1109/16.69916 · Cited by 59
Electrical properties of SiO2/TiO2 high-k gate dielectric stack
Bera, M. K., & Maiti, C. K. (2006) · Materials Science in Semiconductor Processing · doi:10.1016/j.mssp.2006.10.008 · Cited by 41
Ramanathan, S., McIntyre, P. C., Guha, S., & Gusev, E. (2004) · Applied Physics Letters · doi:10.1063/1.1636532 · Cited by 31
Jung, M.-H., Kim, K.-S., Park, G.-H., & Cho, W.-J. (2009) · Applied Physics Letters · doi:10.1063/1.3078279 · Cited by 30
Self-citation
Research works printed but not linked: 4
- Tech. Dig. - Int. Electron Devices Meet., 2005, 323
- 2008, IEEE Electron Device Lett., 29, 5
- Tech. Dig. - Int. Electron Devices Meet., 1988, 424
- Dig. Tech. Pap. - Symp. VLSI Technol., 2003, 27
Cited by
Sorted by citations
Items 101–158 of 158
Koo, K. M., Woo, J. S., & Choi, W. Y. (2025) · IEEE Transactions on Nanotechnology · doi:10.1109/tnano.2025.3605557 · Cited by 4
Rai, R., Nguyen, K. Q., Tran, H. D., Ho, V. Q., Weng, Y. C., Mazhari, B., Kuo, H. C., & Chang, E. Y. (2025) · IEEE Journal of the Electron Devices Society · doi:10.1109/jeds.2025.3649208 · Cited by 4
Jeong, H., Ahn, D., Park, S., Ju, G., Han, J., & Kim, Y. (2025) · ACS Applied Electronic Materials · doi:10.1021/acsaelm.5c00447 · Cited by 4
Energy-Efficient, Scalable Single-Layer MoS2–Based Synaptic Field-Effect Transistors
Kim, J., 김병주, Ma, J., Lim, S.-Y., Choi, M.-H., Jeong, H., Ji, J., Kang, J., Chang, J., Kwon, J., et al. (2025) · ACS Applied Electronic Materials · doi:10.1021/acsaelm.5c00808 · Cited by 4
Park, I., Jung, Y. C., Seong, S., Ahn, J., & Lee, S. B. (2014) · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · doi:10.1116/1.4904730 · Cited by 4
First principles study on influence of oxygen vacancy in HfO2 on charge trapping memory
Guang-Zhen, D., Yue-Hua, D., Tai-Long, X., Jia-Yu, W., Yuan-Yang, Z., Jun-ning, C., & Liu, Q. (2014) · Acta Physica Sinica · doi:10.7498/aps.63.123101 · Cited by 4
Enhanced charge trapping characteristics through composite high-k material phase separation
Chai, P., Zhu, J., & Chen, J. (2023) · Applied Physics Letters · doi:10.1063/5.0170774 · Cited by 4
Na, H., Jeong, J., Lee, J., Shin, H., Lee, S.-H., & Sohn, H. (2017) · Current Applied Physics · doi:10.1016/j.cap.2017.07.006 · Cited by 4
Improving Zr0.5Hf0.5O2-based charge-trapped performance by graphene oxide quantum dots
Wang, H., Ding, B., Tian, X., Zhao, R. X., Zhang, Y., Lü, C., Ren, D., & Yan, X. (2018) · Functional Materials Letters · doi:10.1142/s1793604718500935 · Cited by 4
Oh, J., Na, H., Mok, I.-S., Kim, J., Lee, K., & Sohn, H. (2012) · Applied Physics A · doi:10.1007/s00339-012-6950-2 · Cited by 4
Kim, S., Yang, S., Kim, J.-S., Jeong, J.-K., Lee, H., & Lee, G. (2015) · Transactions on Electrical and Electronic Materials · doi:10.4313/teem.2015.16.4.183 · Cited by 4
Li‐Well ZnO Memtransistors: High Reliability for Neuromorphic Applications
Son, K., Kim, H., Han, D., Lim, H., & Lee, H. (2025) · Advanced Materials · doi:10.1002/adma.202506128 · Cited by 3
Tang, Z., Li, R., Zhang, X., Hu, D., & Zhao, Y. (2016) · Journal of Applied Physics · doi:10.1063/1.4959606 · Cited by 3
Dynamic Charge Centroid on Data Retention of Double-Nanostructure Nonvolatile Memory
Wang, J., Lin, C., Chen, C.-H., Huang, P., & Lai, C. (2012) · Applied Physics Express · doi:10.1143/apex.5.044201 · Cited by 3
Zhu, C., Xu, Z., Huo, Z., Zheng, Z., Cui, Y., Wang, Y., Liu, J., Li, F., & Liu, M. (2012) · Journal of Physics D Applied Physics · doi:10.1088/0022-3727/45/6/065104 · Cited by 3
Comparison of Fluorinated HfO2and Si3N4Charge Trapping Layer for Nonvolatile Flash Memories
Chen, Y.-Y., Lei, G., Shen, Y.-J., Lin, S.-C., & Chen, Y.-C. (2012) · Ferroelectrics · doi:10.1080/00150193.2012.740288 · Cited by 3
Tang, Z., Li, R., Hu, D., Zhang, X., & Zhao, Y. (2016) · physica status solidi (a) · doi:10.1002/pssa.201600143 · Cited by 3
Kumar, R. (2024) · Journal of Radioanalytical and Nuclear Chemistry · doi:10.1007/s10967-024-09629-w · Cited by 3
Improvement of charge trapping memory performance by modulating band alignment with oxygen plasma
Chai, P., Zhu, J., Li, K., & Chen, J. (2024) · Applied Physics Letters · doi:10.1063/5.0224220 · Cited by 3
Local surface charge dissipation studied using force spectroscopy method of atomic force microscopy
Revilla, R. I., Yang, Y., & Wang, C. (2015) · Surface and Interface Analysis · doi:10.1002/sia.5761 · Cited by 3
Tang, Z., Li, R., Zhang, X., Geng, H., Zang, S., Zheng, H., Lian, M., & Hu, N. (2018) · Semiconductor Science and Technology · doi:10.1088/1361-6641/aae75e · Cited by 3
Kim, S. W., Yoo, J.-H., Park, W.-J., Lee, C., Lee, J., Kim, J.-H., Uhm, S.-H., & Lee, H. C. (2024) · Nanomaterials · doi:10.3390/nano14201686 · Cited by 2
Chen, J. X., Xu, J. P., Liu, L., & Lai, P. T. (2013) · Applied Physics Letters · doi:10.1063/1.4829880 · Cited by 2
Xi, K., Bi, J., Xu, Y., Li, Y. D., Zhang, Z., & Liu, M. (2020) · Microelectronics Reliability · doi:10.1016/j.microrel.2020.113882 · Cited by 2
Ultrafast reconfigurable direct charge trapping devices based on few-layer MoS2
高, H. 辉. G., Liu, X., Song, P., Wei, C., Jiazila, N., Sun, J., Wu, K., Guo, H., Yang, H., Bao, L., et al. (2024) · Chinese Physics B · doi:10.1088/1674-1056/ad8ecd · Cited by 2
Understanding ferroelectricity in sputtered aluminum nitride thin films on silicon
Gogi, V. K., Chae, C., Barua, A., Hwang, J., & Jha, R. (2025) · APL Materials · doi:10.1063/5.0246797 · Cited by 2
Chen, W.-C., Yang, C.-F., & Hwu, J. (2018) · IEEE Transactions on Nanotechnology · doi:10.1109/tnano.2018.2880277 · Cited by 2
Aji, A. S., & Darma, Y. (2013) · International Conference on Instrumentation, Communications, Information Technology, and Biomedical Engineering · doi:10.1109/icici-bme.2013.6698506 · Cited by 2
Polarization of Bi2Te3 thin film in a floating-gate capacitor structure
Yuan, H., Zhang, K., Li, H., Zhu, H., Bonevich, J. E., Baumgart, H., Richter, C. A., & Li, Q. (2014) · Applied Physics Letters · doi:10.1063/1.4904003 · Cited by 2
Tang, Z., Li, R., Zhang, X., & Hu, D. (2020) · Japanese Journal of Applied Physics · doi:10.35848/1347-4065/ab8d0a · Cited by 2
Tang, Z., Geng, H., Li, R., & Zhang, X. (2019) · Applied Physics Express · doi:10.7567/1882-0786/ab282e · Cited by 2
Electron trapping in HfO2 layer deposited over a HF last treated silicon substrate
Salomone, L. S., Cassani, M. V., Garcia–Inza, M., Carbonetto, S., Redin, E. G., Campabadal, F., & Faigón, A. (2024) · Microelectronic Engineering · doi:10.1016/j.mee.2024.112277 · Cited by 1
Maurya, A., Vaithiyanathan, D., & Sharma, A. K. (2025) · Advanced Theory and Simulations · doi:10.1002/adts.202500319 · Cited by 1
Zhang, G., Wu, Z., & Yoo, W. J. (2011) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2011.2162731 · Cited by 1
Role of metal nanocrystals on the breakdown statistics of flash memory high-κ stacks
Feng, X., Raghavan, N., Mei, S., Du, L., Pey, K. L., & Wong, H. (2017) · Microelectronic Engineering · doi:10.1016/j.mee.2017.05.003 · Cited by 1
Bury, P., Matsumoto, T., Hardoň, Š., Bellan, I., Janek, M., & Kobayashi, H. (2014) · Communications - Scientific letters of the University of Zilina · doi:10.26552/com.c.2014.1.3-9 · Cited by 1
Tang, Z., Li, R., & Zhang, X. (2020) · Chinese Physics B · doi:10.1088/1674-1056/ab7224 · Cited by 1
Non-volatile flash memory characteristics implementing high-k blocking layer
Rahman, S. (2018) · Cited by 1
Cheung, S. S., Liang, D., Yuan, Y., Peng, Y., Hu, Y., Kurczveil, G., & Beausoleil, R. G. (2023) · Research Square · doi:10.21203/rs.3.rs-3098943/v1 · Cited by 1
Metal Contacts on Low-Dimensional Materials
Yuan, H. (2014) · doi:10.13021/mars/4472
Charge storage characteristics of atomic layer deposited ZrO2/Al2O3multilayered films
Tang, Z., Li, R., Zhu, X., & Liu, Z. G. (2012) · The European Physical Journal Applied Physics · doi:10.1051/epjap/2012120351
Investigation of charge loss characteristics of HfO2annealed in N2or O2ambient
Chu, Y.-Q., Huo, Z., Han, Y., Chen, G., Zhang, D., Li, X., & Liu, M. (2014) · Journal of Semiconductors · doi:10.1088/1674-4926/35/8/083004
Yun, D.-J., Kang, H.-B., & Yoon, S. (2016) · International Workshop on Active-Matrix Flatpanel Displays and Devices · doi:10.1109/am-fpd.2016.7543655
Electrical and charge trapping properties of HfO2/Al2O3 multilayer dielectric stacks
Davidović, V. S., Paskaleva, A., Spassov, D., Guziewicz, E., Krajewski, T., Golubović, S., Djoric-Veljkovic, S., Manic, I., Danković, D., & Stojadinović, N. (2017) · IEEE International Conference on Microelectronics (MIEL) · doi:10.1109/miel.2017.8190088
Skeparovski, A., Novkovski, N., Paskaleva, A., & Spassov, D. (2021) · IEEE International Conference on Microelectronics (MIEL) · doi:10.1109/miel52794.2021.9569062
Optimization of HfO2/Al2O3 Dielectric Stacks for Charge Trapping Memories
Spassov, D., & Paskaleva, A. (2021) · IEEE International Conference on Microelectronics (MIEL) · doi:10.1109/miel52794.2021.9569085
Spassov, D., Paskaleva, A., Guziewicz, E., Ivanov, T., Stanchev, T., Davidović, V. S., Veljković, S., Mitrović, N., & Danković, D. (2023) · IEEE International Conference on Microelectronics (MIEL) · doi:10.1109/miel58498.2023.10315813
Unveiling charge-trapping storage capacity in MoS2/BiFeO3 heterostructure
Xia, Y., Chen, Y., Ablat, G., Zhang, Y., Tao, Y., Zhang, L., Zhang, L., Yin, L., Sun, J. C., Yao, Y., et al. (2025) · Applied Physics Letters · doi:10.1063/5.0276993
Kim, E. A., Park, S., Kim, Y., & Cho, S.-Y. (2025) · SID Symposium Digest of Technical Papers · doi:10.1002/sdtp.18611
Kim, S. H., Kim, D., Yoon, I., Lee, S., Jang, Y., Jeong, L. H., Lee, S., Woo, J., & Lee, J. W. (2025) · Applied Surface Science Advances · doi:10.1016/j.apsadv.2025.100914
Rapidly Erasable Ambipolar SnO Charge-Trap Memory With Low Dynamic Energy Consumption
Wang, H., Yao, Y., Dai, P., Wang, Y., Zhang, J., Li, Y., Xin, Q., & Song, A. M. (2026) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2026.3698067
Guang-Hua, X., Chen, S., & Liu, Y. (2026) · Chinese Physics B · doi:10.1088/1674-1056/ae7db4
Lee, J.-Y., & Song, Y.-H. (2026) · Journal of Applied Physics · doi:10.1063/5.0323662
Role of ultra-thin MgO tunneling and blocking layers in HfO2-based charge trap flash memory
Gorthy, A., Gogi, V. K., Srinivasan, R., Mayersky, J., Leedy, K. D., & Jha, R. (2026) · Memories - Materials Devices Circuits and Systems · doi:10.1016/j.memori.2026.100147
Niu, H., Fan, M., Lv, L., Wan, H., Ma, G., & Wang, H. (2026) · Small · doi:10.1002/smll.75278
Lee, S., Lim, Y. S., Park, J. S., Kim, H. J., Yang, J., Son, Y., Kim, B., Choi, H., & Choi, C. (2026) · Applied Surface Science · doi:10.1016/j.apsusc.2026.168392
Metadata
- Authors
- You, H.-W., & Cho, W.-J.
- Affiliations
- Kwangwoon University (KR)
- ORCID
- Cho, Won-Ju
- Venue
- Applied Physics Letters
- Publisher
- AIP Publishing
- Published
- 2010-03-01
- Volume
- 96
- Issue
- 9
- ISSN
- 0003-6951 (ISSN-L)
- 1077-3118
- OpenAlex
- W2000947237
- Cited by
- 158
- References
- 7
- Citations by year
- 2026: 6 · 2025: 17 · 2024: 11 · 2023: 10 · 2022: 10 · 2021: 7 · 2020: 5 · 2019: 7 · 2018: 10 · 2017: 11 · 2016: 9 · 2015: 7 · 2014: 15 · 2013: 10 · 2012: 11
- FWCI
- 8.32
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Applied Physics Letters (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Ferroelectric and Negative Capacitance Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advancements in Semiconductor Devices and Circuit Design
- Keywords
- charge trapping, hafnium oxide, charge trap flash memory, silicon nitride, gate leakage current, tunneling, memory window, high-k dielectrics
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review