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Cited by 410Thermal properties of materials3D IC and TSV technologiesThermoelastic and Magnetoelastic Phenomena

The DOI matches its Crossref record; 6 of the 6 references it cites were found in a registry or an index.

Thermal resistance at interfaces

Swartz, E. T., Pohl, R. O.·1987·Applied Physics Letters
DOI 10.1063/1.98939
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Abstract

We report measurements of the solid-solid thermal boundary resistance Rbd, spanning the temperature range from 1 to 300 K. Below 30 K, Rbd is found to be in agreement with the prediction of the acoustic mismatch model. The influence of diffuse scattering at the interface is found to have a very minor influence on Rbd. Above 30 K, Rbd decreases less rapidly with increasing temperature than predicted by the theory. Phonon scattering in thin (∼30 Å) disordered layers near the interface is shown to be a possible explanation. Implications for heat removal from integrated circuits are discussed.

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Crossref · 10.1063/1.98939

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6 of 6 references verified0 citation errors · 0 not checkable

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Citations

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Research works printed but not linked: 1

  1. 1981, Physica, 107B, 549

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Metadata

Authors
Swartz, E. T., & Pohl, R. O.
Affiliations
Cornell University (US)
Venue
Applied Physics Letters
Publisher
AIP Publishing
Published
1987-12-28
Volume
51
Issue
26
Pages
2200-2202
ISSN
  • 0003-6951 (ISSN-L)
  • 1077-3118
DOI
10.1063/1.98939
OpenAlex
W2018240900
Cited by
410
References
6
Citations by year
2026: 16 · 2025: 14 · 2024: 20 · 2023: 13 · 2022: 20 · 2021: 21 · 2020: 20 · 2019: 19 · 2018: 15 · 2017: 18 · 2016: 14 · 2015: 13 · 2014: 14 · 2013: 12 · 2012: 10
FWCI
5.13
Type
journal article
Language
en
Open access
closed
Locations
Applied Physics Letters (publishedVersion)
Topics
  • Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
  • Physical Sciences › Engineering › Mechanics of Materials › Thermoelastic and Magnetoelastic Phenomena
Keywords
interfacial thermal resistance, solid-solid interfaces, low-temperature thermal transport, acoustic mismatch model, diffuse scattering, phonon scattering

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