Cited by 410Thermal properties of materials3D IC and TSV technologiesThermoelastic and Magnetoelastic Phenomena

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Thermal resistance at interfaces

Swartz, E. T., Pohl, R. O.·1987·Applied Physics Letters

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Abstract

We report measurements of the solid-solid thermal boundary resistance Rbd, spanning the temperature range from 1 to 300 K. Below 30 K, Rbd is found to be in agreement with the prediction of the acoustic mismatch model. The influence of diffuse scattering at the interface is found to have a very minor influence on Rbd. Above 30 K, Rbd decreases less rapidly with increasing temperature than predicted by the theory. Phonon scattering in thin (∼30 Å) disordered layers near the interface is shown to be a possible explanation. Implications for heat removal from integrated circuits are discussed.

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Authors: Swartz, E. T., & Pohl, R. O.
Affiliations: Cornell University (US)
Venue: Applied Physics Letters
Publisher: AIP Publishing
Published: 1987-12-28
Volume: 51
Issue: 26
Pages: 2200-2202
ISSN: 0003-6951 (ISSN-L)
1077-3118
DOI: 10.1063/1.98939
OpenAlex: W2018240900
Cited by: 410
References: 6
Citations by year: 2026: 16 · 2025: 14 · 2024: 20 · 2023: 13 · 2022: 20 · 2021: 21 · 2020: 20 · 2019: 19 · 2018: 15 · 2017: 18 · 2016: 14 · 2015: 13 · 2014: 14 · 2013: 12 · 2012: 10
FWCI: 5.13
Type: journal article
Language: en
Open access: closed
Locations: Applied Physics Letters (publishedVersion)
Topics: Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
Physical Sciences › Engineering › Mechanics of Materials › Thermoelastic and Magnetoelastic Phenomena
Keywords: interfacial thermal resistance, solid-solid interfaces, low-temperature thermal transport, acoustic mismatch model, diffuse scattering, phonon scattering

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Thermal resistance at interfaces

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