Cited by 66Silicon Carbide Semiconductor TechnologiesSemiconductor materials and devicesAdvancements in Semiconductor Devices and Circuit Design

Channel mobility and on-resistance of vertical double implanted 4H-SiC MOSFETs at elevated temperatures

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Rumyantsev, S L, Shur, M S, Levinshtein, M E, Ivanov, P A, Palmour, J W, Agarwal, A K, Hull, B A, Ryu, Sei-Hyung·2009·Semiconductor Science and Technology

Abstract

Temperature and gate voltage dependences of the channel electron mobility were studied in short-channel high-voltage vertical double implanted 4H-SiC MOSFETs (VDMOSFETs). With increasing gate voltage, field effect electron mobility, μ FE , increased, tending to saturate at large V g values reaching a maximum of ∼4 cm 2 V −1 s −1 at room temperature. With the temperature increase, μ FE increased monotonically and reached a value of ∼16 cm 2 V −1 s −1 at 510 K. These trends are explained by the high density of the interface traps, which was extracted from the temperature dependence of the threshold voltage. The electron mobility in the drift region decreased with temperature increase. As a result, the contribution of the drift region to the on-resistance was dominant at elevated temperatures limiting the VDMOSFETs performance at temperatures above ∼420 K. The on-resistance of VDMOSFETs was only weakly dependent on temperature within the temperature range from 300 K to 510 K.

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Research works printed but not linked: 3

  1. Palmour J W, Edmond J A, Kong H S and Carter C H Jr 1994 Vertical power devices in silicon carbide Proc. Silicon Carbide and Related Materials p 499
  2. Lu C Y, Cooper J A Jr, Tsuji T, Chung G, Williams J R, McDonald K and Feldman L C 2003 IEEE Trans. Electron Devices 50 15821588
  3. Levinshtein M E, Rumyantsev S L and Shur M S 2001 Properties of Advanced Semiconductor Materials GaN, AlN, InN, SiC, SiGe (New York: Wiley)

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Authors
Rumyantsev, S. L., Shur, M. S., Levinshtein, M. E., Ivanov, P. A., Palmour, J. W., Agarwal, A. K., Hull, B. A., & Ryu, S.-H.
Affiliations
  • Russian Academy of Sciences (RU)
  • Rensselaer Polytechnic Institute (US)
  • Wolfspeed, Inc. (United States) (US)
Venue
Semiconductor Science and Technology
Published
2009-06-02
Volume
24
Issue
7
Pages
075011
ISSN
  • 0268-1242 (ISSN-L)
  • 1361-6641
OpenAlex
W2091201956
Cited by
66
References
27
Citations by year
2026: 3 · 2025: 7 · 2024: 6 · 2023: 6 · 2022: 2 · 2021: 3 · 2020: 6 · 2019: 8 · 2018: 7 · 2017: 5 · 2016: 1 · 2015: 2 · 2014: 1 · 2013: 4 · 2012: 3
FWCI
1.32
Type
journal article
Language
en
Open access
Locations
Semiconductor Science and Technology (publishedVersion)
Funders
  • National Science Foundation
  • Russian Foundation for Basic Research
  • Ioffe Institute
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advancements in Semiconductor Devices and Circuit Design
Keywords
4H-SiC MOSFET, field-effect mobility, on-resistance, temperature dependence, gate voltage dependence, interface states, threshold voltage, high-voltage power devices

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