Channel mobility and on-resistance of vertical double implanted 4H-SiC MOSFETs at elevated temperatures
Open accessAbstract
Temperature and gate voltage dependences of the channel electron mobility were studied in short-channel high-voltage vertical double implanted 4H-SiC MOSFETs (VDMOSFETs). With increasing gate voltage, field effect electron mobility, μ FE , increased, tending to saturate at large V g values reaching a maximum of ∼4 cm 2 V −1 s −1 at room temperature. With the temperature increase, μ FE increased monotonically and reached a value of ∼16 cm 2 V −1 s −1 at 510 K. These trends are explained by the high density of the interface traps, which was extracted from the temperature dependence of the threshold voltage. The electron mobility in the drift region decreased with temperature increase. As a result, the contribution of the drift region to the on-resistance was dominant at elevated temperatures limiting the VDMOSFETs performance at temperatures above ∼420 K. The on-resistance of VDMOSFETs was only weakly dependent on temperature within the temperature range from 300 K to 510 K.
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
The on-resistance relation with junction temperature is not perfectly linear in SiC MOSFETs.
“However, the on-resistance relation with junction temperature is not perfectly linear in SiC MOSFETs.”
From AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters (2023) · cites this paper as [98]
Channel mobility increases over temperature and channel resistance shows a negative temperature coefficient.
“It is partially because the channel mobility increases over temperature and the channel resistance shows a negative temperature coefficient [98].”
From AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters (2023) · cites this paper as [98]
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Cites
Physics of Semiconductor Devices
Colinge, J.-P., & Colinge, C. (2002) · Kluwer Academic Publishers eBooks · doi:10.1007/b117561 · Cited by 14,074 · see citing works
Physics of Semiconductor Devices
Jain, S., & Radhakrishna, S. (1987) · doi:10.1142/9789814542012 · Cited by 4,187 · see citing works
Physics of semiconductor devices
(1990) · Choice Reviews Online · doi:10.5860/choice.27-6393 · Cited by 1,354 · see citing works
Shur, M. S. (1987) · Springer eBooks · doi:10.1007/978-1-4899-1989-2 · Cited by 753 · see citing works
Self-citationElectron mobility in inversion and accumulation layers on thermally oxidized silicon surfaces
Sun, S., & Plummer, J. D. (1980) · IEEE Transactions on Electron Devices · doi:10.1109/t-ed.1980.20063 · Cited by 688 · see citing works
Chung, G. Y., Tin, C. C., Williams, J. R., McDonald, K., Chanana, R. K., Weller, R. A., Pantelides, S. T., Feldman, L. C., Holland, O. W., Das, M. K., et al. (2001) · IEEE Electron Device Letters · doi:10.1109/55.915604 · Cited by 641 · see citing works
Self-citationStatus and prospects for SiC power MOSFETs
Cooper, J. A., Melloch, M. R., Singh, R., Agarwal, A., & Palmour, J. W. (2002) · IEEE Transactions on Electron Devices · doi:10.1109/16.992876 · Cited by 511 · see citing works
Self-citationSemiconductor Device Modeling For VLSI
Lee, K., Shur, M. S., Fjeldly, T. A., et al. (1993) · Medical Entomology and Zoology · Cited by 241 · see citing works
Self-citationA new analytic model for amorphous silicon thin-film transistors
Shur, M. S., Hack, M. G., & Shaw, J. G. (1989) · Journal of Applied Physics · doi:10.1063/1.344481 · Cited by 197 · see citing works
Self-citation1/f noise in MODFETs at low drain bias
Peransin, J.-M., Vignaud, P., Rigaud, D., et al. (1990) · IEEE Transactions on Electron Devices · doi:10.1109/16.59916 · Cited by 170 · see citing works
Jeon, D. S., & Burk, D. E. (1989) · IEEE Transactions on Electron Devices · doi:10.1109/16.30959 · Cited by 161 · see citing works
10-kV, 123-m $Omega cdot $ cm $^2$ 4H-SiC Power DMOSFETs
Ryu, S., Krishnaswami, S., O’Loughlin, M. J., Richmond, J., Agarwal, A., Palmour, J. W., & Hefner, A. R. (2004) · IEEE Electron Device Letters · doi:10.1109/led.2004.832122 · Cited by 151 · see citing works
Self-citationElectron scattering in silicon inversion layers by oxide and surface roughness
Hartstein, A., Ning, T. H., & Fowler, A. B. (1976) · Surface Science · doi:10.1016/0039-6028(76)90131-x · Cited by 136 · see citing works
Palmour, J. W., Kong, H. S., & Davis, R. F. (1988) · Journal of Applied Physics · doi:10.1063/1.341731 · Cited by 113 · see citing works
Self-citationPalmour, J. W., Kong, H. S., & Davis, R. F. (1987) · Applied Physics Letters · doi:10.1063/1.98282 · Cited by 111 · see citing works
Self-citationElectron-Scattering Mechanisms in Heavily Doped Silicon Carbide MOSFET Inversion Layers
Tilak, V., Matocha, K., & Dunne, G. T. (2007) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2007.906929 · Cited by 95 · see citing works
Yano, H., Hirao, T., Kimoto, T., et al. (2001) · Applied Physics Letters · doi:10.1063/1.1340861 · Cited by 93 · see citing works
Powell, S. K., Goldsman, N., McGarrity, J. M., Bernstein, J. B., Scozzie, C. J., & Lelis, A. J. (2002) · Journal of Applied Physics · doi:10.1063/1.1499523 · Cited by 82 · see citing works
A 1-kV 4H-SiC Power DMOSFET Optimized for Low on-Resistance
Saha, A., & Cooper, J. A. (2007) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2007.904577 · Cited by 81 · see citing works
Carrier mobility model for simulation of SiC-based electronic devices
Mnatsakanov, T. T., Levinshteĭn, M. E., Pomortseva, L. I., & Yurkov, S. N. (2002) · Semiconductor Science and Technology · doi:10.1088/0268-1242/17/9/313 · Cited by 67 · see citing works
Gudjónsson, G., Ólafsson, H., Allerstam, F., et al. (2005) · IEEE Electron Device Letters · doi:10.1109/led.2004.841191 · Cited by 56 · see citing works
Rumyantsev, S., Pala, N., Shur, M. S., et al. (2001) · Journal of Applied Physics · doi:10.1063/1.1372364 · Cited by 50 · see citing works
Self-citationHigh Channel Mobility of MOSFET Fabricated on 4H-SiC (11-20) Face Using Wet Annealing
Endo, T., Okuno, E., Sakakibara, T., et al. (2008) · Materials science forum · doi:10.4028/www.scientific.net/msf.600-603.691 · Cited by 26 · see citing works
Alok, D., Arnold, E., Egloff, R., et al. (2001) · IEEE Electron Device Letters · doi:10.1109/55.974582 · Cited by 26 · see citing works
Low frequency noise in 4H-SiC metal oxide semiconductor field effect transistors
Rumyantsev, S., Shur, M. S., Levinshteĭn, M. E., et al. (2008) · Journal of Applied Physics · doi:10.1063/1.3009664 · Cited by 18 · see citing works
Self-citationDesign and Fabrication of 4H-SiC RF MOSFETs
Gudjónsson, G., Allerstam, F., Sveinbjörnsson, E. Ö., et al. (2007) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2007.908547 · Cited by 9 · see citing works
Layout considerations for improving the on-state performance of vertical SiC switching devices
Friedrichs, P., & Elpelt, R. (2007) · PESC record · doi:10.1109/pesc.2007.4342123 · Cited by 5 · see citing works
Flagged first, then by citations
Research works printed but not linked: 3
- Palmour J W, Edmond J A, Kong H S and Carter C H Jr 1994 Vertical power devices in silicon carbide Proc. Silicon Carbide and Related Materials p 499
- Lu C Y, Cooper J A Jr, Tsuji T, Chung G, Williams J R, McDonald K and Feldman L C 2003 IEEE Trans. Electron Devices 50 15821588
- Levinshtein M E, Rumyantsev S L and Shur M S 2001 Properties of Advanced Semiconductor Materials GaN, AlN, InN, SiC, SiGe (New York: Wiley)
Cited by
Sorted by citations
Overview of Real-Time Lifetime Prediction and Extension for SiC Power Converters
Ni, Z., Lyu, X., Yadav, O. P., Singh, B. N., Zheng, S., & Cao, D. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2962503 · Cited by 261 · see citing works
Evaluation of Aging's Effect on Temperature-Sensitive Electrical Parameters in SiC mosfets
Yang, F., Ugur, E., & Akin, B. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2950311 · Cited by 121 · see citing works
AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters
Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2023.3271251 · Cited by 24 · see citing works
“It is partially because the channel mobility increases over temperature and the channel resistance shows a negative temperature coef-ficient [98].”
BackgroundA Critical Review on Reliability and Short Circuit Robustness of Silicon Carbide Power MOSFETs
Sreejith, S., Ajayan, J., Devasenapati, S. B., Sivasankari, B., & Tayal, S. (2023) · Silicon · doi:10.1007/s12633-022-02039-1 · Cited by 11 · see citing works
- Authors
- Rumyantsev, S. L., Shur, M. S., Levinshtein, M. E., Ivanov, P. A., Palmour, J. W., Agarwal, A. K., Hull, B. A., & Ryu, S.-H.
- Affiliations
- Russian Academy of Sciences (RU)
- Rensselaer Polytechnic Institute (US)
- Wolfspeed, Inc. (United States) (US)
- Venue
- Semiconductor Science and Technology
- Publisher
- IOP Publishing
- Published
- 2009-06-02
- Volume
- 24
- Issue
- 7
- Pages
- 075011
- ISSN
- 0268-1242 (ISSN-L)
- 1361-6641
- OpenAlex
- W2091201956
- Cited by
- 66
- References
- 27
- Citations by year
- 2026: 3 · 2025: 7 · 2024: 6 · 2023: 6 · 2022: 2 · 2021: 3 · 2020: 6 · 2019: 8 · 2018: 7 · 2017: 5 · 2016: 1 · 2015: 2 · 2014: 1 · 2013: 4 · 2012: 3
- FWCI
- 1.32
- Type
- journal article
- Language
- en
- Open access
- bronze
- doi.org
- Locations
- Semiconductor Science and Technology (publishedVersion)
- Funders
- National Science Foundation
- Russian Foundation for Basic Research
- Ioffe Institute
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advancements in Semiconductor Devices and Circuit Design
- Keywords
- 4H-SiC MOSFET, field-effect mobility, on-resistance, temperature dependence, gate voltage dependence, interface states, threshold voltage, high-voltage power devices
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review