Qubit compatible superconducting interconnects
Open accessAbstract
We present a fabrication process for fully superconducting interconnects compatible with superconducting qubit technology. These interconnects allow for the three dimensional integration of quantum circuits without introducing lossy amorphous dielectrics. They are composed of indium bumps several microns tall separated from an aluminum base layer by titanium nitride which serves as a diffusion barrier. We measure the whole structure to be superconducting (transition temperature of 1.1 K), limited by the aluminum. These interconnects have an average critical current of 26.8 mA, and mechanical shear and thermal cycle testing indicate that these devices are mechanically robust. Our process provides a method that reliably yields superconducting interconnects suitable for use with superconducting qubits.
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
The results provide a natural explanation for the observations of short periods of significantly elevated error found in recent experiments with stabilizer codes.
“Our results provide a natural explanation for the observations of short periods of signi cantly elevated error found in recent experiments with stabilizer codes [23, 24].”
From Resolving catastrophic error bursts from cosmic rays in large arrays of superconducting qubits (2022) · cites this paper as [23]
The 25 ms decay time constant is much larger than the typical QEC round time of 1 us.
“which is much larger than the typical QEC round time of 1 s [23, 24].”
From Resolving catastrophic error bursts from cosmic rays in large arrays of superconducting qubits (2022) · cites this paper as [23]
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Cites
Surface codes: Towards practical large-scale quantum computation
Fowler, A. G., Mariantoni, M., Martinis, J. M., & Cleland, A. N. (2012) · Physical Review A · doi:10.1103/physreva.86.032324 · Cited by 3,059 · see citing works
Self-citationSuperconducting quantum circuits at the surface code threshold for fault tolerance
Barends, R., Kelly, J., Megrant, A., Veitia, A., Sank, D., Jeffrey, E., White, T. C., Mutus, J., Fowler, A. G., Campbell, B., et al. (2014) · Nature · doi:10.1038/nature13171 · Cited by 1,733 · see citing works
Self-citationCoherent Josephson Qubit Suitable for Scalable Quantum Integrated Circuits
Barends, R., Kelly, J., Megrant, A., Sank, D., Jeffrey, E., Chen, Y., Yin, Y., Chiaro, B., Mutus, J., Neill, C., et al. (2013) · Physical Review Letters · doi:10.1103/physrevlett.111.080502 · Cited by 779 · see citing works
Self-citationCorcoles, A. D., Magesan, E., Srinivasan, S. J., Cross, A. W., Steffen, M., Gambetta, J., & Chow, J. M. (2015) · Nature Communications · doi:10.1038/ncomms7979 · Cited by 477 · see citing works
Microwave dielectric loss at single photon energies and millikelvin temperatures
O’Connell, A. D., Ansmann, M., Bialczak, R. C., Hofheinz, M., Katz, N., Lucero, E., McKenney, C., Neeley, M., Wang, H., Weig, E. M., et al. (2008) · Applied Physics Letters · doi:10.1063/1.2898887 · Cited by 274 · see citing works
Self-citationImproved superconducting qubit coherence using titanium nitride
Chang, J. B., Vissers, M. R., Córcoles, A. D., Sandberg, M., Gao, J., Abraham, D. W., Chow, J. M., Gambetta, J. M., Rothwell, M. B., Keefe, G. A., et al. (2013) · Applied Physics Letters · doi:10.1063/1.4813269 · Cited by 264 · see citing works
3D integrated superconducting qubits
Rosenberg, D., Kim, D. K., Das, R. N., Yost, D., Gustavsson, S., Hover, D. J., Krantz, P., Melville, A. J., Racz, L. M., Samach, G., et al. (2017) · npj Quantum Information · doi:10.1038/s41534-017-0044-0 · Cited by 260 · see citing works
Detecting bit-flip errors in a logical qubit using stabilizer measurements
Ristè, D., Poletto, S., Huang, M.-Z., Bruno, A., Vesterinen, V., Saira, O.-P., & DiCarlo, L. (2015) · Nature Communications · doi:10.1038/ncomms7983 · Cited by 254 · see citing works
Demonstration of Weight-Four Parity Measurements in the Surface Code Architecture
Takita, M., Corcoles, A. D., Magesan, E., Abdo, B., Brink, M., Cross, A. W., Chow, J. M., & Gambetta, J. (2016) · Physical Review Letters · doi:10.1103/physrevlett.117.210505 · Cited by 198 · see citing works
Experimental demonstration of a robust and scalable flux qubit
Harris, R., Johansson, J., Berkley, A. J., Johnson, M. W., Lanting, T., Han, S., Bunyk, P., Ladizinsky, E., Oh, T., Perminov, I., et al. (2010) · Physical Review B · doi:10.1103/physrevb.81.134510 · Cited by 177 · see citing works
Dunsworth, A., Megrant, A., Quintana, C., Chen, Z., Barends, R., Burkett, B., Foxen, B., Chen, Y., Chiaro, B., Fowler, A. G., et al. (2017) · Applied Physics Letters · doi:10.1063/1.4993577 · Cited by 124 · see citing works
Self-citationRoom temperature deposition of sputtered TiN films for superconducting coplanar waveguide resonators
Ohya, S., Chiaro, B., Megrant, A., Neill, C., Barends, R., Chen, Y., Kelly, J., Low, D., Mutus, J., O’Malley, P. J. J., et al. (2013) · Superconductor Science and Technology · doi:10.1088/0953-2048/27/1/015009 · Cited by 94 · see citing works
Self-citationFabrication of stable and reproducible submicron tunnel junctions
Pop, I. M., Fournier, T., Crozes, T., Lecocq, F., Matei, I., Pannetier, B., Buisson, O., & Guichard, W. (2012) · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · doi:10.1116/1.3673790 · Cited by 89 · see citing works
Development of an Indium bump bond process for silicon pixel detectors at PSI
Broennimann, C., Glaus, F., Gobrecht, J., Heising, S., Horisberger, M., Horisberger, R., Kaestli, H. C., Lehmann, J., Rohe, T., & Streuli, S. (2006) · Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment · doi:10.1016/j.nima.2006.05.011 · Cited by 82 · see citing works
Frear, D. R., Datta, M., Kohl, P. A., Ōsaka, T., Schultze, J. W., Krongelb, S., OKINAKA, Y., Watts, D., Akahoshi, H., Butterbaugh, J. W., et al. (2004) · CRC Press eBooks · doi:10.1201/9780203473689 · Cited by 49 · see citing works
Design and testing of high-speed interconnects for superconducting multi-chip modules
Narayana, S., Semenov, V. K., Polyakov, Y. A., Dotsenko, V., & Tolpygo, S. K. (2012) · Superconductor Science and Technology · doi:10.1088/0953-2048/25/10/105012 · Cited by 31 · see citing works
Superconducting TiN Films Sputtered Over a Large Range of Substrate DC Bias
Jaim, H. M. I., Aguilar, J. A., Sarabi, B., Rosen, Y. J., Ramanayaka, A. N., Lock, E. H., Richardson, C. J. K., & Osborn, K. D. (2014) · IEEE Transactions on Applied Superconductivity · doi:10.1109/tasc.2014.2366036 · Cited by 30 · see citing works
Design and fabrication of the detector technology for SCUBA-2
Walton, A. J., Parkes, W. J., Terry, J. G., Dunare, C. C., Stevenson, J. T. M., Gundlach, A. M., Hilton, G. C., Irwin, K. D., Ullom, J. N., Holland, W. S., et al. (2004) · IEE Proceedings - Science Measurement and Technology · doi:10.1049/ip-smt:20040088 · Cited by 15 · see citing works
Thermocompression bonding technology for multilayer superconducting quantum circuits
McRae, C. R., Béjanin, J. H., Pagel, Z., Abdallah, A. O., McConkey, T., Earnest, C. T., Rinehart, J. R., & Mariantoni, M. (2017) · Applied Physics Letters · doi:10.1063/1.5003169 · Cited by 12 · see citing works
Tolpygo, S. K., Tolpygo, D., Hunt, R. T., Narayana, S., Polyakov, Y. A., & Semenov, V. K. (2009) · IEEE Transactions on Applied Superconductivity · doi:10.1109/tasc.2009.2017858 · Cited by 11 · see citing works
Characterization of a novel fluxless surface preparation process for die interconnect bonding
Schulte, E. F., Cooper, K. A., Phillips, M. R., & Shindé, S. L. (2012) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2012.6248801 · Cited by 8 · see citing works
Fabrication of prototype imaging arrays for SCUBA-2
Hilton, G. C., Beall, J. A., Doriese, W. B., Duncan, W., Ferreira, L., Irwin, K. D., Reintsema, C. D., Ullom, J. N., Vale, L. R., Xu, Y., et al. (2006) · Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment · doi:10.1016/j.nima.2005.12.042 · Cited by 4 · see citing works
Flagged first, then by citations
Research works printed but not linked: 2
- O'Brien W et al 2017 Superconducting Caps for Quantum Integrated Circuits ArXiv e-prints
- Wade K and Banister A J 1973 Pergamon texts in Inorganic Chemistry The Chemistry of Aluminium, Gallium, Indium and Thallium (Elmsford, NY: Pergamon Press)
Cited by
Sorted by citations
A quantum engineer's guide to superconducting qubits
Krantz, P., Kjærgaard, M., Yan, F., Orlando, T. P., Gustavsson, S., & Oliver, W. D. (2019) · Applied Physics Reviews · doi:10.1063/1.5089550 · Cited by 2,056 · see citing works
Strong Quantum Computational Advantage Using a Superconducting Quantum Processor
Wu, Y., Bao, W.-S., Cao, S., Chen, F., Chen, M.-C., Chen, X., Chung, T.-H., Deng, H., Du, Y., Fan, D., et al. (2021) · Physical Review Letters · doi:10.1103/physrevlett.127.180501 · Cited by 1,059 · see citing works
Self-citation3D integrated superconducting qubits
Rosenberg, D., Kim, D. K., Das, R. N., Yost, D., Gustavsson, S., Hover, D. J., Krantz, P., Melville, A. J., Racz, L. M., Samach, G., et al. (2017) · npj Quantum Information · doi:10.1038/s41534-017-0044-0 · Cited by 260 · see citing works
Materials loss measurements using superconducting microwave resonators
McRae, C. R. H., Wang, H., Gao, J., Vissers, M. R., Brecht, T., Dunsworth, A., Pappas, D. P., & Mutus, J. (2020) · Review of Scientific Instruments · doi:10.1063/5.0017378 · Cited by 258 · see citing works
Self-citationMagnard, P., Storz, S., Kurpiers, P., Schär, J., Marxer, F., Lütolf, J., Walter, T., Besse, J.-C., Gabureac, M. S., Reuer, K., et al. (2020) · Physical Review Letters · doi:10.1103/physrevlett.125.260502 · Cited by 239 · see citing works
Quantum Electrodynamics in a Topological Waveguide
Kim, E., Zhang, X., Ferreira, V. S., Banker, J., Iverson, J. K., Sipahigil, A., Bello, M., González-Tudela, A., Mirhosseini, M., & Painter, O. J. (2021) · Physical Review X · doi:10.1103/physrevx.11.011015 · Cited by 204 · see citing works
3D integrated superconducting qubits
Rosenberg, D., Kim, D., Das, R. N., Yost, D., Gustavsson, S., Hover, D. J., Krantz, P., Melville, A. J., Racz, L. M., Samach, G., et al. (2017) · DSpace@MIT (Massachusetts Institute of Technology) · Cited by 207 · see citing works
Photonic materials in circuit quantum electrodynamics
Carusotto, I., Houck, A., Kollár, A. J., Roushan, P., Schuster, D., & Simon, J. (2020) · Nature Physics · doi:10.1038/s41567-020-0815-y · Cited by 209 · see citing works
Self-citationResolving catastrophic error bursts from cosmic rays in large arrays of superconducting qubits
McEwen, M., Faoro, L., Arya, K., Dunsworth, A., Huang, T., Kim, S., Burkett, B., Fowler, A., Arute, F., Bardin, J. C., et al. (2022) · Nature Physics · doi:10.1038/s41567-021-01432-8 · Cited by 193 · see citing works
Self-citationTopological and Subsystem Codes on Low-Degree Graphs with Flag Qubits
Chamberland, C., Zhu, G., Yoder, T. J., Hertzberg, J. B., & Cross, A. W. (2020) · Physical Review X · doi:10.1103/physrevx.10.011022 · Cited by 223 · see citing works
Digital Coherent Control of a Superconducting Qubit
Leonard, E., Beck, M. A., Nelson, J., Christensen, B. G., Thorbeck, T., Howington, C., Opremcak, A., Pechenezhskiy, I., Dodge, K., Dupuis, N. P., et al. (2019) · Physical Review Applied · doi:10.1103/physrevapplied.11.014009 · Cited by 141 · see citing works
Noisy intermediate-scale quantum computers
Cheng, B., Deng, X., Gu, X. Q., He, Y., Hu, G., Huang, P., Li, J., Lin, B., Lu, D., Lu, Y., et al. (2023) · Frontiers of Physics · doi:10.1007/s11467-022-1249-z · Cited by 131 · see citing works
Solid-state qubits integrated with superconducting through-silicon vias
Yost, D. R. W., Schwartz, M. E., Mallek, J., Rosenberg, D., Stull, C., Yoder, J. L., Calusine, G., Cook, M., Das, R., Day, A. L., et al. (2020) · npj Quantum Information · doi:10.1038/s41534-020-00289-8 · Cited by 128 · see citing works
Entanglement across separate silicon dies in a modular superconducting qubit device
Gold, A., Paquette, J.-P., Stockklauser, A., Reagor, M. J., Alam, M. S., Bestwick, A. J., Didier, N., Nersisyan, A., Oruc, F. B., Razavi, A., et al. (2021) · npj Quantum Information · doi:10.1038/s41534-021-00484-1 · Cited by 111 · see citing works
Leung, N., Lu, Y., Chakram, S., Naik, R., Earnest, N., Ma, R., Jacobs, K. A., Cleland, A. N., & Schuster, D. (2019) · npj Quantum Information · doi:10.1038/s41534-019-0128-0 · Cited by 101 · see citing works
Solid-state qubits integrated with superconducting through-silicon vias
Yost, D., Schwartz, M. E., Mallek, J., Rosenberg, D., Stull, C., Yoder, J., Calusine, G., Cook, M., Das, R. N., Day, A., et al. (2020) · DSpace@MIT (Massachusetts Institute of Technology) · Cited by 95 · see citing works
Building blocks of a flip-chip integrated superconducting quantum processor
Kosen, S., Li, H.-X., Rommel, M., Shiri, D., Warren, C., Grönberg, L., Salonen, J., Abad, T., Biznárová, J., Caputo, M., et al. (2022) · Quantum Science and Technology · doi:10.1088/2058-9565/ac734b · Cited by 88 · see citing works
Engineering superconducting qubits to reduce quasiparticles and charge noise
Pan, X., Zhou, Y., Yuan, H., Nie, L., Wei, W., Zhang, L., Li, J., Liu, S., Jiang, Z. H., Catelani, G., et al. (2022) · Nature Communications · doi:10.1038/s41467-022-34727-2 · Cited by 70 · see citing works
High coherence superconducting microwave cavities with indium bump bonding
Lei, C. U., Krayzman, L., Ganjam, S., Frunzio, L., & Schoelkopf, R. J. (2020) · Applied Physics Letters · doi:10.1063/5.0003907 · Cited by 65 · see citing works
A method for building low loss multi-layer wiring for superconducting microwave devices
Dunsworth, A., Barends, R., Chen, Y., Chen, Z., Chiaro, B., Fowler, A. G., Foxen, B., Jeffrey, E., Kelly, J., Klimov, P. V., et al. (2018) · Applied Physics Letters · doi:10.1063/1.5014033 · Cited by 57 · see citing works
Self-citationSolid-State Qubits: 3D Integration and Packaging
Rosenberg, D., Weber, S. J., Conway, D., Yost, D., Mallek, J., Calusine, G., Das, R. N., Kim, D. K., Schwartz, M. E., Woods, W. H., et al. (2020) · IEEE Microwave Magazine · doi:10.1109/mmm.2020.2993478 · Cited by 91 · see citing works
Superconducting qubits in a flip-chip architecture
Conner, C. R., Bienfait, A., Chang, H.-S., Chou, M.-H., Dumur, É., Grebel, J., Peairs, G. A., Povey, R. G., Yan, H., Zhong, Y., et al. (2021) · Applied Physics Letters · doi:10.1063/5.0050173 · Cited by 53 · see citing works
Holman, N., Rosenberg, D., Yost, D., Yoder, J., Das, R. N., Oliver, W. D., McDermott, R., & Eriksson, M. A. (2021) · npj Quantum Information · doi:10.1038/s41534-021-00469-0 · Cited by 43 · see citing works
High coherence and low cross-talk in a tileable 3D integrated superconducting circuit architecture
Spring, P., Cao, S., Tsunoda, T., Campanaro, G., Fasciati, S. D., Wills, J., Bakr, M. S., Chidambaram, V., Shteynas, B., Carpenter, L. G., et al. (2022) · Science Advances · doi:10.1126/sciadv.abl6698 · Cited by 43 · see citing works
ARQUIN: Architectures for Multinode Superconducting Quantum Computers
Ang, J., Carini, G. A., Chen, Y., Chuang, I. L., Demarco, M., Economou, S. E., Eickbusch, A., Faraon, A., Fu, K. C., Girvin, S. M., et al. (2024) · ACM Transactions on Quantum Computing · doi:10.1145/3674151 · Cited by 65 · see citing works
Self-citationSuperconductivity Behavior in Epitaxial TiN Films Points to Surface Magnetic Disorder
Saveskul, N. A., Titova, N. A., Baeva, E. M., Semenov, A. V., Лубенченко, А. В., Saha, S., Reddy, H., Bogdanov, S., Marinero, E. E., Shalaev, V. M., et al. (2019) · Physical Review Applied · doi:10.1103/physrevapplied.12.054001 · Cited by 38 · see citing works
Superconducting Magnetic Field Programmable Gate Array
Katam, N. K., Mukhanov, O. A., & Pedram, M. (2018) · IEEE Transactions on Applied Superconductivity · doi:10.1109/tasc.2018.2797262 · Cited by 33 · see citing works
Vacuum-gap transmon qubits realized using flip-chip technology
Li, X., Zhang, Y., Yang, C., Li, Z., Wang, J., Su, T., Chen, M., Li, Y., Li, C.-Y., Mi, Z., et al. (2021) · Applied Physics Letters · doi:10.1063/5.0068255 · Cited by 33 · see citing works
Synthesizing Five-Body Interaction in a Superconducting Quantum Circuit
Zhang, K., Li, H., Zhang, P., Yuan, J., Chen, J., Ren, W., Wang, Z., Song, C., Wang, D., Wang, H., et al. (2022) · Physical Review Letters · doi:10.1103/physrevlett.128.190502 · Cited by 30 · see citing works
Signal Crosstalk in a Flip-Chip Quantum Processor
Kosen, S., Li, H.-X., Rommel, M., Rehammar, R., Caputo, M., Grönberg, L., Fernández-Pendás, J., Kockum, A. F., Biznárová, J., Chen, L., et al. (2024) · PRX Quantum · doi:10.1103/prxquantum.5.030350 · Cited by 32 · see citing works
Simple non-galvanic flip-chip integration method for hybrid quantum systems
Satzinger, K. J., Conner, C. R., Bienfait, A., Chang, H.-S., Chou, M.-H., Cleland, A. Y., Dumur, É., Grebel, J., Peairs, G. A., Povey, R. G., et al. (2019) · Applied Physics Letters · doi:10.1063/1.5089888 · Cited by 30 · see citing works
Quantum origami: Transversal gates for quantum computation and measurement of topological order
Zhu, G., Hafezi, M., & Barkeshli, M. (2020) · Physical Review Research · doi:10.1103/physrevresearch.2.013285 · Cited by 30 · see citing works
Electrodeposition of Superconducting Rhenium with Water-in-Salt Electrolyte
Huang, Q., & Hu, Y. (2018) · Journal of The Electrochemical Society · doi:10.1149/2.0261816jes · Cited by 29 · see citing works
Enhancing the coherence of superconducting quantum bits with electric fields
Lisenfeld, J., Bilmes, A., & Ustinov, A. V. (2023) · npj Quantum Information · doi:10.1038/s41534-023-00678-9 · Cited by 29 · see citing works
Mukai, H., Sakata, K., Devitt, S. J., Wang, R., Zhou, Y., Nakajima, Y., & Tsai, J.-S. (2020) · New Journal of Physics · doi:10.1088/1367-2630/ab7d7d · Cited by 28 · see citing works
Scaling up Superconducting Quantum Computers With Cryogenic RF-Photonics
Joshi, S., & Moazeni, S. (2023) · Journal of Lightwave Technology · doi:10.1109/jlt.2023.3311806 · Cited by 27 · see citing works
Demonstration of dynamic surface codes
Eickbusch, A., McEwen, M., Sivak, V., Bourassa, A., Atalaya, J., Claes, J., Kafri, D., Gidney, C., Warren, C., Gross, J. A., et al. (2025) · Nature Physics · doi:10.1038/s41567-025-03070-w · Cited by 24 · see citing works
Self-citationAlfaro-Barrantes, J. A., Mastrangeli, M., Thoen, D. J., Visser, S., Bueno, J., Baselmans, J. J. A., & Sarro, P. M. (2020) · IEEE Electron Device Letters · doi:10.1109/led.2020.2994862 · Cited by 23 · see citing works
Voltage-Tunable Superconducting Resonators: A Platform for Random Access Quantum Memory
Sardashti, K., Dartiailh, M., Yuan, J. O., Hart, S., Gumann, P., & Shabani, J. (2020) · IEEE Transactions on Quantum Engineering · doi:10.1109/tqe.2020.3034553 · Cited by 21 · see citing works
Muthusubramanian, N., Finkel, M. I., Duivestein, P., Zachariadis, C., van der Meer, S. L. M., Veen, H. M., Beekman, M., Stavenga, T., Bruno, A., & DiCarlo, L. (2023) · Quantum Science and Technology · doi:10.1088/2058-9565/ad199c · Cited by 21 · see citing works
Coupler-Assisted Leakage Reduction for Scalable Quantum Error Correction with Superconducting Qubits
Yang, X., Chu, J., Guo, Z., Huang, W., Liang, Y., Liu, J., Qiu, J., Sun, X., Tao, Z., Zhang, J., et al. (2024) · Physical Review Letters · doi:10.1103/physrevlett.133.170601 · Cited by 21 · see citing works
Self-citationCryogenic Electronics and Quantum Information Processing
Holmes, D. S. (2021) · doi:10.1109/irds54852.2021.00012 · Cited by 23 · see citing works
Superconducting routing platform for large-scale integration of quantum technologies
Charvolin, T., Michel, J., Deschaseaux, E., Charbonnier, J., Souil, R., Vermande, E., Campo, A., Farjot, T., Rodriguez, G., Romano, G., et al. (2022) · Materials for Quantum Technology · doi:10.1088/2633-4356/ac88ae · Cited by 20 · see citing works
Zhao, P., Zhang, Y., Xue, G., Jin, Y., & Yu, H. (2022) · Applied Physics Letters · doi:10.1063/5.0097521 · Cited by 19 · see citing works
Flip-Chip-Based Microwave Spectroscopy of Andreev Bound States in a Planar Josephson Junction
Hinderling, M., Sabonis, D., Paredes, S., Haxell, D. Z., Coraiola, M., ten Kate, S. C., Cheah, E., Křížek, F., Schott, R., Wegscheider, W., et al. (2023) · Physical Review Applied · doi:10.1103/physrevapplied.19.054026 · Cited by 19 · see citing works
Chemical and structural identification of material defects in superconducting quantum circuits
de Graaf, S. E., Un, S., Shard, A. G., & Lindström, T. (2022) · Materials for Quantum Technology · doi:10.1088/2633-4356/ac78ba · Cited by 18 · see citing works
Quantum walks via quantum cellular automata
Costa, P. C. S., Portugal, R., & de Melo, F. (2018) · Quantum Information Processing · doi:10.1007/s11128-018-1983-x · Cited by 16 · see citing works
Liang, G.-H., Song, X., Deng, C.-L., Gu, X.-Y., Yan, Y., Mei, Z.-Y., Zhao, S.-L., Bu, Y.-Z., Xiao, Y.-X., Yu, Y.-H., et al. (2023) · Physical Review Applied · doi:10.1103/physrevapplied.20.044028 · Cited by 16 · see citing works
Wafer-level direct bonding of optimized superconducting NbN for 3D chip integration
Li, Y., Gheitaghy, A. M., Trifunovic, M., Xu, Y., Zhang, G., & Ishihara, R. (2021) · Physica C Superconductivity · doi:10.1016/j.physc.2021.1353823 · Cited by 16 · see citing works
Tamate, S., Tabuchi, Y., & Nakamura, Y. (2021) · IEICE Transactions on Electronics · doi:10.1587/transele.2021sep0007 · Cited by 16 · see citing works
Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application
Yu, J. Y., Zheng, Y. R., Zhou, S., Wang, Q., Wu, S., Wu, H., Li, T., & Cai, J. (2022) · International Conference on Electronic Packaging Technology (ICEPT) · doi:10.1109/icept56209.2022.9873338 · Cited by 16 · see citing works
Fabrication of superconducting through-silicon viasPreprint
Mallek, J., Yost, D., Rosenberg, D., Yoder, J., Calusine, G., Cook, M., Das, R. N., Day, A. L., Golden, E. B., Kim, D. K., et al. (2021) · arXiv (Cornell University) · doi:10.48550/arxiv.2103.08536 · Cited by 16 · see citing works
300 mm CMOS-compatible superconducting HfN and ZrN thin films for quantum applications
Potjan, R., Wislicenus, M., Ostien, O., Hoffmann, R., Lederer, M., Reck, A., Emara, J., Roy, L., Uhlig, B., & Wosnitza, J. (2023) · Applied Physics Letters · doi:10.1063/5.0176060 · Cited by 15 · see citing works
Li, T.-M., Zhang, J., Chen, B.-J., Huang, K., Liu, H.-T., Xiao, Y.-X., Deng, C.-L., Liang, G.-H., Chen, C.-T., Liu, Y., et al. (2025) · Physical Review Applied · doi:10.1103/physrevapplied.23.024059 · Cited by 15 · see citing works
Parity Quantum Optimization: Encoding Constraints
Drieb-Schön, M., Ender, K., Javanmard, Y., & Lechner, W. (2023) · Quantum · doi:10.22331/q-2023-03-17-951 · Cited by 18 · see citing works
Janzen, N., Kononenko, M., Ren, S., & Lupaşcu, A. (2022) · Applied Physics Letters · doi:10.1063/5.0103165 · Cited by 14 · see citing works
A review of design concerns in superconducting quantum circuits
Levenson-Falk, E. M., & Shanto, S. (2025) · Materials for Quantum Technology · doi:10.1088/2633-4356/ade10d · Cited by 13 · see citing works
Highly-Conformal Sputtered Through-Silicon Vias With Sharp Superconducting Transition
Alfaro-Barrantes, J. A., Mastrangeli, M., Thoen, D. J., Visser, S., Bueno, J., Baselmans, J. J. A., & Sarro, P. M. (2021) · Journal of Microelectromechanical Systems · doi:10.1109/jmems.2021.3049822 · Cited by 13 · see citing works
Reproducible coherence characterization of superconducting quantum devices
McRae, C. R., Stiehl, G. M., Wang, H., Lin, S.-X., Caldwell, S. A., Pappas, D. P., Mutus, J., & Combes, J. (2021) · Applied Physics Letters · doi:10.1063/5.0060370 · Cited by 13 · see citing works
Self-citationMcRae, C. R., Béjanin, J. H., Earnest, C. T., McConkey, T., Rinehart, J. R., Deimert, C., Thomas, J. P., Wasilewski, Z. R., & Mariantoni, M. (2018) · Journal of Applied Physics · doi:10.1063/1.5020514 · Cited by 13 · see citing works
Thermocompression bonding technology for multilayer superconducting quantum circuits
McRae, C. R., Béjanin, J. H., Pagel, Z., Abdallah, A. O., McConkey, T., Earnest, C. T., Rinehart, J. R., & Mariantoni, M. (2017) · Applied Physics Letters · doi:10.1063/1.5003169 · Cited by 12 · see citing works
Thermal management of a 3D packaging structure for superconducting quantum annealing machines
Feng, W., Kikuchi, K., Hidaka, M., Yamamori, H., Araga, Y., Makise, K., & Kawabata, S. (2021) · Applied Physics Letters · doi:10.1063/5.0039822 · Cited by 12 · see citing works
Characterizations of Indium Interconnects for 3D Quantum Assemblies
Feautrier, C., Deschaseaux, E., Gueugnot, A., Charbonnier, J., Plihon, A., Dupré, L., Henry, F., Berger, F., Pagot, A., Renet, S., et al. (2023) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc51909.2023.00166 · Cited by 12 · see citing works
Indium Bump Process for Low-Temperature Detectors and Readout
Lucas, T. J., Biesecker, J., Doriese, W. B., Duff, S. M., Hilton, G. C., Ullom, J. N., Vissers, M. R., & Schmidt, D. R. (2022) · Journal of Low Temperature Physics · doi:10.1007/s10909-022-02728-6 · Cited by 11 · see citing works
Fluxonium qubits in a flip-chip package
Somoroff, A., Truitt, P., Weis, A. C., Bernhardt, J., Yohannes, D. T., Walter, J., Kalashnikov, K., Renzullo, M., Mencia, R., Vavilov, M., et al. (2024) · Physical Review Applied · doi:10.1103/physrevapplied.21.024015 · Cited by 11 · see citing works
Mitigating leakage errors due to cavity modes in a superconducting quantum computer
McConkey, T., Béjanin, J. H., Earnest, C. T., McRae, C. R., Pagel, Z., Rinehart, J. R., & Mariantoni, M. (2018) · Quantum Science and Technology · doi:10.1088/2058-9565/aabd41 · Cited by 10 · see citing works
Ruan, X., Li, L., Liang, G.-H., Zhao, S., Wang, J.-H., Bu, Y.-Z., Chen, B., Song, X., Li, X., Zhang, H., et al. (2024) · Applied Physics Letters · doi:10.1063/5.0216607 · Cited by 10 · see citing works
Li, H.-X., Shiri, D., Kosen, S., Rommel, M., Chayanun, L., Nylander, A., Rehammar, R., Tancredi, G., Caputo, M., Grigoras, K., et al. (2023) · IEEE Transactions on Quantum Engineering · doi:10.1109/tqe.2023.3302371 · Cited by 10 · see citing works
Electrical and Morphological Characterizations of 3-D Interconnections for Quantum Computation
Thomas, C., Charbonnier, J., Garnier, A., Bresson, N., Bouchu, D., Moreau, S., Gustavo, F., & Vinet, M. (2021) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2021.3104326 · Cited by 10 · see citing works
Focused Ion Beam Preparation of Low Melting Point Metals: Lessons Learned From Indium
Michael, J. R., Perry, D. L., Cummings, D. P., Walraven, J. A., & Jordan, M. B. (2022) · Microscopy and Microanalysis · doi:10.1017/s1431927622000496 · Cited by 10 · see citing works
Opinion: Democratizing Spin Qubits
Tahan, C. (2021) · Quantum · doi:10.22331/q-2021-11-18-584 · Cited by 9 · see citing works
Stavenga, T., Khan, S. A., Liu, Y., Krogstrup, P., & DiCarlo, L. (2023) · Applied Physics Letters · doi:10.1063/5.0146814 · Cited by 9 · see citing works
Enhanced superconducting qubit performance through ammonium fluoride etch
Kopas, C., Goronzy, D. P., Pham, T., Torres‐Castanedo, C. G., Cheng, M., Cochrane, R., Nast, P., Lachman, E., Zhelev, N., Vallières, A., et al. (2024) · Materials for Quantum Technology · doi:10.1088/2633-4356/ad88cc · Cited by 9 · see citing works
Self-citationNorris, G. J., Michaud, L., Pahl, D., Kerschbaum, M., Eichler, C., Besse, J.-C., & Wallraff, A. J. (2024) · EPJ Quantum Technology · doi:10.1140/epjqt/s40507-023-00213-x · Cited by 9 · see citing works
Die-to-Wafer 3D Interconnections Operating at Sub-Kelvin Temperatures for Quantum Computation
Thomas, C., Charbonnier, J., Garnier, A., Bresson, N., Fournel, F., Renet, S., Franiatte, R., David, N., Thiney, V., Urdampilleta, M., et al. (2020) · Electronic System-Integration Technology Conference (ESTC) · doi:10.1109/estc48849.2020.9229657 · Cited by 9 · see citing works
Modeling Insights Into the Assembly Challenges of Focal Plane Arrays
Stoyanov, S., & Bailey, C. (2023) · IEEE Access · doi:10.1109/access.2023.3264806 · Cited by 8 · see citing works
Through-silicon-via Architecture of 3D Integration for Superconducting Quantum Computing Application
Yu, J. Y., Wang, Q., Zheng, Y. R., Song, C., Fang, J., Li, T., Wu, H., Wang, Z., & Cai, J. (2023) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc51909.2023.00316 · Cited by 8 · see citing works
Yang, Y.-T., Hu, C., Green, J., Zhang, P., Shakoorzadeh, N., Ambhore, P., Mogera, U., Ni, N., Wang, K. L., & Iyer, S. S. (2020) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc32862.2020.00291 · Cited by 8 · see citing works
Self-citationSuperconducting Molybdenum Multi-Chip Module Approach for Cryogenic and Quantum Applications
Shah, A., Peek, S. E., Yelamanchili, B., Gupta, V., Tuckerman, D. B., Cantaloube, C., Sellers, J. A., & Hamilton, M. C. (2022) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc51906.2022.00052 · Cited by 8 · see citing works
Optimization of the transmission cost of distributed quantum circuits based on merged transfer
Cheng, X., Chen, X., Cao, K., Zhu, P., Feng, S., & Guan, Z. (2023) · Quantum Information Processing · doi:10.1007/s11128-023-03927-0 · Cited by 8 · see citing works
Scanning tunneling Andreev microscopy of titanium nitride thin films
Liao, W.-T., Kohler, T., Osborn, K. D., Butera, R., Lobb, C. J., Wellstood, F. C., & Dreyer, M. (2019) · Physical review. B./Physical review. B · doi:10.1103/physrevb.100.214505 · Cited by 8 · see citing works
Silicon Hard-Stop Spacers for 3D Integration of Superconducting QubitsPreprint
(2019) · DSpace@MIT (Massachusetts Institute of Technology) · Cited by 8 · see citing works
Tunable compact on-chip superconducting switch
Zotova, J., Semenov, A. V., Wang, R., Zhou, Y., Astafiev, O. V., & Tsai, J.-S. (2024) · Physical Review Applied · doi:10.1103/physrevapplied.21.024059 · Cited by 7 · see citing works
Floquet analysis of frequency collisions
Heya, K., Malekakhlagh, M., Merkel, S., Kanazawa, N., & Pritchett, E. (2024) · Physical Review Applied · doi:10.1103/physrevapplied.21.024035 · Cited by 7 · see citing works
Nb-based superconducting silicon interconnect fabric for cryogenic electronics
Yang, Y.-T., Hu, C., Zhang, P., Shakoorzadeh, N., Ni, N., Wang, K. L., & Iyer, S. S. (2021) · Quantum Science and Technology · doi:10.1088/2058-9565/abe279 · Cited by 7 · see citing works
Self-citationLi, H., Chui, K.-J., Goh, S. C. K., Budoyo, R. P., Long, N. H., Ng, Y. C., Lau, D., Jaafar, N. B., Tan, Y. P., & Dumke, R. (2024) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc51529.2024.00078 · Cited by 6 · see citing works
Superconducting-Semiconducting Voltage-Tunable Qubits in the Third Dimension
Hazard, T., Kerman, A. J., Serniak, K., & Tahan, C. (2023) · Physical Review Applied · doi:10.1103/physrevapplied.20.034056 · Cited by 6 · see citing works
Indium Bump Bonding: Advanced Integration Techniques for Low-Temperature Detectors and Readout
Lucas, T. J., Biesecker, J., Doriese, W. B., Duff, S. M., Durkin, M., Lew, R. A., Ullom, J. N., Vissers, M. R., & Schmidt, D. R. (2024) · Journal of Low Temperature Physics · doi:10.1007/s10909-024-03104-2 · Cited by 6 · see citing works
Paradkar, A., Nicaise, P., Dakroury, K., Resare, F., & Wieczorek, W. (2025) · Applied Physics Letters · doi:10.1063/5.0235266 · Cited by 6 · see citing works
Solving the Element Detecting Problem in Graphs via Quantum Walk Search Algorithm (QWSA)
Gill, S. K., Kaur, G., Shankar, G., & Veeramanickam (2023) · Lecture notes in networks and systems · doi:10.1007/978-981-19-7982-8_36 · Cited by 6 · see citing works
Malik, S., Jiang, W., Mayor, F. M., Makihara, T., & Safavi‐Naeini, A. H. (2023) · Applied Physics Letters · doi:10.1063/5.0157516 · Cited by 6 · see citing works
Superconducting TSV contact for cryoelectronic devices
Filippov, I. A., Anikanov, A., Rykov, A., Mumlyakov, A. M., Шибалов, М. В., Trofimov, I. V., Porokhov, N. V., Anufriev, Y., & Tarkhov, M. A. (2023) · Superconductor Science and Technology · doi:10.1088/1361-6668/ad1460 · Cited by 6 · see citing works
Advantages of a modular high-level quantum programming framework
Steiger, D. S., Häner, T., & Troyer, M. (2019) · Microprocessors and Microsystems · doi:10.1016/j.micpro.2019.02.003 · Cited by 6 · see citing works
Superconducting and Silicon-Based Semiconductor Quantum Computers: A review
Jia, Z.-L., Fu, Y., Cao, Z. X., Cheng, W., Zhao, Y., Dou, M., Duan, P., Kong, W., Cao, G., Li, H.-O., et al. (2022) · IEEE Nanotechnology Magazine · doi:10.1109/mnano.2022.3175394 · Cited by 5 · see citing works
Demonstration of 90 000 superconductive bump connections for massive quantum computing
Araga, Y., Nakagawa, H., Hashino, M., & Kikuchi, K. (2023) · Japanese Journal of Applied Physics · doi:10.35848/1347-4065/acbebf · Cited by 5 · see citing works
Hughes, G. D., Peek, S. E., Shah, A., Hamilton, M. C., & Adams, M. L. (2024) · IEEE Transactions on Applied Superconductivity · doi:10.1109/tasc.2024.3351620 · Cited by 5 · see citing works
Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration
Cirulis, I., Zschenderlein, U., Braun, S., Radestock, M., Pantou, R., Vogel, K., Selbmann, F., Kurth, S., Wunderle, B., & Kühn, H. (2023) · European Microelectronics and Packaging Conference · doi:10.23919/empc55870.2023.10418420 · Cited by 4 · see citing works
Design of Scalable Superconducting Quantum Circuits Using Flip-Chip Assembly
Park, S. H., Baek, D., Park, I., & Hahn, S. (2023) · IEEE Transactions on Applied Superconductivity · doi:10.1109/tasc.2023.3244142 · Cited by 4 · see citing works
Leung, N., Lu, Y., Chakram, S., Naik, R., Earnest, N., Ma, R., Jacobs, K. A., Cleland, A. N., & Schuster, D. (2018) · arXiv (Cornell University) · doi:10.48550/arxiv.1804.02028 · Cited by 4 · see citing works
- Authors
- Foxen, B., Mutus, J. Y., Lucero, E., Graff, R., Megrant, A., Chen, Y., Quintana, C., Burkett, B., Kelly, J., Jeffrey, E., Yang, Y., Yu, A., Arya, K., Barends, R., Chen, Z., Chiaro, B., Dunsworth, A., Fowler, A., Gidney, C., Giustina, M., Huang, T., Klimov, P., Neeley, M., Neill, C., Roushan, P., Sank, D., Vainsencher, A., Wenner, J., White, T. C., & Martinis, J. M.
- Affiliations
- University of California, Santa Barbara (US)
- Google (United States) (US)
- Corresponding author
- Martinis, John M
- ORCID
- Venue
- Quantum Science and Technology
- Publisher
- IOP Publishing
- Published
- 2017-11-29
- Volume
- 3
- Issue
- 1
- Pages
- 014005
- ISSN
- 2058-9565 (ISSN-L)
- OpenAlex
- W2748822299
- Cited by
- 143
- References
- 22
- Citations by year
- 2026: 8 · 2025: 10 · 2024: 27 · 2023: 22 · 2022: 17 · 2021: 21 · 2020: 14 · 2019: 10 · 2018: 11 · 2017: 3
- FWCI
- 5.69
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Licence
- Locations
- Quantum Science and Technology (publishedVersion, cc-by)
- arXiv (Cornell University) (submittedVersion)
- arXiv (Cornell University)
- Funders
- Division of Graduate Education (DGE- 1144085)
- Google (JMGI01)
- Topics
- Physical Sciences › Physics and Astronomy › Astronomy and Astrophysics › Superconducting and THz Device Technology
- Physical Sciences › Computer Science › Artificial Intelligence › Quantum Information and Cryptography
- Physical Sciences › Engineering › Biomedical Engineering › Superconducting Materials and Applications
- Keywords
- superconducting interconnects, superconducting qubits, indium bumps, critical current, mechanical robustness, thermal cycling, fabrication techniques
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
